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1. 发明专利

DE69415839D1 未知
公开(公告)号：DE69415839D1
公开(公告)日：1999-02-25
申请号：DE69415839
申请日：1994-03-07
申请人： TOKYO SEIMITSU CO LTD
发明人： TSUCHISHIMA JIRO , CHIBA KIYOTAKA
IPC分类号： B23D61/10 , B24B45/00 , B24D5/16 , B26D7/26 , H01L21/301 , B27B5/32
摘要： A mounting structure for a cutting blade in a dicing apparatus in which a mounted blade is rotated in a well-balanced condition and further the blade can be easily attached to and detached from the apparatus. The mounting structure of the invention comprises a mount (3) including a first cylindrical engagement portion (31), and a first screw portion (33); a cutting blade (4) including a second engagement portion (43) engaging with a first engagement portion (31); and a screw member (5) including a second screw portion (51) being screwed into the first screw portion (33) so that the screw member (5) presses the cutting blade (4) against the flange surface (32) for fixation, the mount (3) further including a third cylindrical engagement portion (36), and the screw member (5) including a fourth engagement portion (52) engaging with the third engagement portion (36).

2. 发明专利

DE69415839T2 未知
公开(公告)号：DE69415839T2
公开(公告)日：1999-05-20
申请号：DE69415839
申请日：1994-03-07
申请人： TOKYO SEIMITSU CO LTD
发明人： TSUCHISHIMA JIRO , CHIBA KIYOTAKA
IPC分类号： B23D61/10 , B24B45/00 , B24D5/16 , B26D7/26 , H01L21/301 , B27B5/32
摘要： A mounting structure for a cutting blade in a dicing apparatus in which a mounted blade is rotated in a well-balanced condition and further the blade can be easily attached to and detached from the apparatus. The mounting structure of the invention comprises a mount (3) including a first cylindrical engagement portion (31), and a first screw portion (33); a cutting blade (4) including a second engagement portion (43) engaging with a first engagement portion (31); and a screw member (5) including a second screw portion (51) being screwed into the first screw portion (33) so that the screw member (5) presses the cutting blade (4) against the flange surface (32) for fixation, the mount (3) further including a third cylindrical engagement portion (36), and the screw member (5) including a fourth engagement portion (52) engaging with the third engagement portion (36).

3. 发明专利

JP2008117897A Prober and probing inspection method 审中-公开
标题翻译：检测和检测方法
公开(公告)号：JP2008117897A
公开(公告)日：2008-05-22
申请号：JP2006298915
申请日：2006-11-02
申请人： Tokyo Seimitsu Co Ltd , 株式会社東京精密
发明人： CHIBA KIYOTAKA , YAMAMOTO SATOSHI
IPC分类号： H01L21/66 , G01R31/26
摘要： PROBLEM TO BE SOLVED: To obtain a prober and a probing inspection method in which a tester and a probe card can be used efficiently and total cost of probing inspection can be reduced.
SOLUTION: The prober for connecting each terminal of a tester 30 with an electrode in order to inspect a semiconductor device formed on a wafer W by means of the tester comprises a probe card 24 having a probe 25 touching the electrode, a first wafer chuck 16A, a second wafer chuck 16B, first moving mechanisms 13A-18A for moving the first wafer chuck under the probe card, and second moving mechanisms 13B-18B for moving the second wafer chuck under the probe card wherein the first and second moving mechanisms move the first and second wafer chucks independently.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了获得可以有效利用测试器和探针卡的探测器和探测检查方法，可以降低总体探测成本。解决方案：用于将测试器30的每个端子与电极连接以便通过测试器检查形成在晶片W上的半导体器件的探测器包括探针卡24，其具有接触电极的探针25，第一晶片卡盘16A，第二晶片卡盘16B，用于使探针卡下方的第一晶片卡盘移动的第一移动机构13A-18A，以及用于使探针卡下方的第二晶片卡盘移动的第二移动机构13B-18B，其中第一和第二移动机构独立地移动第一和第二晶片卡盘。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007235070A Supporting device of surface plate, stage device, tester of device, and device manufacturing equipment 审中-公开
标题翻译：表面板的支撑装置，装置的装置，装置的制造装置以及装置的制造装置
公开(公告)号：JP2007235070A
公开(公告)日：2007-09-13
申请号：JP2006058343
申请日：2006-03-03
申请人： Tokyo Seimitsu Co Ltd , 株式会社東京精密
发明人： MASE FUMIO , CHIBA KIYOTAKA
IPC分类号： H01L21/66 , B23Q1/00
摘要： PROBLEM TO BE SOLVED: To provide a supporting device of a surface plate which can keep the positioning accuracy of a movable stage even when a load on the top surface of the surface plate changes with the movement of the movable stage on the surface plate or even when a pedestal or a floor for bearing the surface plate is deformed.
SOLUTION: A surface plate 2 is supported by one or more fixed-position supporting portions 20a to 20c which support the undersurface of the surface plate 2 via fixed support points and fixed-load supporting portions 40a to 40d which support points where the surface plate 2 is bent by the support of the fixed-position supporting portions 20a to 20c. The fixed-load supporting portions 40a to 40d reduce fluctuations in supporting load by expansion and contraction.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种能够保持可移动台的定位精度的表面板的支撑装置，即使当表面板的顶表面上的负载随着可移动台在表面上的移动而变化板或甚至当用于承载表面板的基座或地板变形时。解决方案：一个表面板2由一个或多个固定位置支撑部分20a至20c支撑，固定位置支撑部分20a至20c通过固定支撑点和固定负载支撑部分40a至40d支撑表面板2的下表面，固定支撑部分40a至40d支撑点表面板2由固定位置支撑部分20a至20c的支撑件弯曲。固定负载支撑部分40a至40d通过膨胀和收缩减少支撑负载的波动。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JPH10150081A PROBING METHOD AND PROBER 失效
公开(公告)号：JPH10150081A
公开(公告)日：1998-06-02
申请号：JP30468296
申请日：1996-11-15
申请人： TOKYO SEIMITSU CO LTD
发明人： CHIBA KIYOTAKA
IPC分类号： G01R31/28 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To bring a needle into contact with a specified position all the time at a specified contact pressure by computing the deflecting amount of a stage caused by the contact position of the needle and the deviation of the contact position caused by this deflecting amount, and correcting the relative position with respect to the needle of a semiconductor wafer by the computed deviation. SOLUTION: A wafer 100, on which a plurality of semiconductor chips are aligned, is mounted on a stage 2. The contact position of a needle 4 to the wafer 100 on the stage 2 is computed based on the chip instructing information for instructing the semiconductor chip for contact with the needle 4. Then, the estimated amount of the slant change of the stage 2 when the needle 4 is brought into contact with the wafer 100 at the contact position is computed. The correcting amount for correcting the change in contact position caused by the estimated amount of the slant change is computed. Based on the correcting amount, the stage 2 is relatively moved with respect to the needle 4, and the deviation of the wafer 100 with respect to the needle 4 is corrected.

6. 发明专利

JPH05296244A 失效
公开(公告)号：JPH05296244A
公开(公告)日：1993-11-09
申请号：JP9273392
申请日：1992-04-13
申请人： TOKYO SEIMITSU CO LTD
发明人： CHIBA KIYOTAKA
IPC分类号： F16C32/06
摘要： PURPOSE:To provide a direct moving air bearing whose rigidity against pressure air can be heightened without increasing the wall thickness of an air slider member. CONSTITUTION:In the area of a guide rail 22 where an X slider 24 travels, one or plural slits 44 are formed along the direction of travel of the X slider 24. One or plural connecting plates 50 for connecting the upper 46a and lower 48a guide faces of the X slider 24 to each other are attached to the X slider 24 and are passed through the respective slits 44 of the guide rail 22. Therefore, even if pressure air is supplied to the space 32 between the X slider 24 and the guide rail 22, the connecting plates 50 prevent deformation of the X slider 24, so the rigidity of the direct moving air bearing against the pressure air can be heightened without increasing the wall thickness of the X slider 24.

7. 发明专利

JP2008117968A Prober 审中-公开
标题翻译： PROBER
公开(公告)号：JP2008117968A
公开(公告)日：2008-05-22
申请号：JP2006300601
申请日：2006-11-06
申请人： Tokyo Seimitsu Co Ltd , 株式会社東京精密
发明人： CHIBA KIYOTAKA , MASE FUMIO
IPC分类号： H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a prober in which a probe needle and an electrode pad can be brought into contact correctly even if yawing exists in the moving stages of X axis and Y axis.
SOLUTION: The prober comprises a wafer chuck 16 for holding a wafer W, an X-axis moving stage 14 performing movement in the X-axis direction while mounting a Z-axis movement/rolling mechanism 15, a Y-axis moving stage 13 performing movement of the X-axis moving stage in the Y-axis direction, a base 12 for moving/supporting the Y-axis moving stage, first and second linear scales 42 and 43 provided on the upper surface of the Y-axis moving stage in parallel with the moving direction of the X-axis moving stage, and an arm having heads opposing the first and second linear scales fixed to the X-axis moving stage, respectively, wherein wafer chuck rotation in the plane of XY axes along with movement in the X-axis direction is detected from the readings of the first and second linear scales.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使在X轴和Y轴的移动级中存在偏转，也可以提供探针和电极焊盘正确接触的探测器。解决方案：探针包括用于保持晶片W的晶片卡盘16，X轴移动台14沿X轴方向移动，同时安装Z轴移动/滚动机构15，Y轴移动阶段13执行X轴移动台在Y轴方向的移动，用于移动/支撑Y轴移动台的基座12，设置在Y轴的上表面上的第一和第二线性标尺42和43 移动台与X轴移动台的移动方向平行，并且分别具有与固定到X轴移动台的第一和第二线性标尺相对的头部的臂，其中，在XY轴的平面中的晶片卡盘旋转根据第一和第二线性刻度的读数检测X轴方向的移动。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007324181A Prober and probing method 有权
标题翻译：探测和探测方法
公开(公告)号：JP2007324181A
公开(公告)日：2007-12-13
申请号：JP2006149659
申请日：2006-05-30
申请人： Tokyo Seimitsu Co Ltd , 株式会社東京精密
发明人： MASE FUMIO , CHIBA KIYOTAKA
IPC分类号： H01L21/66 , G01R1/06 , G01R31/26 , G01R31/28
摘要： PROBLEM TO BE SOLVED: To achieve a prober and a probing method capable of detecting a change in the contact pressure of a probe easily at low cost and capable of maintaining the contact pressure within a prescribed range.
SOLUTION: The prober connects each terminal of a tester to the electrode of an electronic device for inspecting the electronic device on a wafer W with the tester. The prober comprises: a probe card 25 having a probe 26 in contact with an electrode; a stage 18; moving mechanisms 12-17 for moving the stage; a travel control section 27; and alignment mechanisms 19, 23 for detecting the relative positions of the electrode and the probe. The prober also comprises: motor current measurement sections 62, 65 for measuring the current value of the drive motor of at least one moving shaft; and current-load operation sections 63, 66 for computing a load applied to at least one moving shaft from a motor current value when control is made to maintain a travel position.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了实现能够以低成本容易地检测探针的接触压力的变化并且能够将接触压力保持在规定范围内的探测器和探测方法。
解决方案：探测器将测试仪的每个端子连接到电子设备的电极，以便使用测试仪检查晶圆W上的电子设备。探测器包括：探针卡25，其具有与电极接触的探针26; 一个阶段18; 用于移动舞台的移动机构12-17; 行驶控制部27; 以及用于检测电极和探针的相对位置的对准机构19,23。探测器还包括：用于测量至少一个移动轴的驱动马达的当前值的马达电流测量部分62,65; 以及用于当进行控制以保持行驶位置时用于计算从电动机电流值施加到至少一个移动轴的负载的电流负载操作部63,66。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2005236025A Electron beam exposure apparatus and electron beam exposing method 审中-公开
标题翻译：电子束曝光装置和电子束曝光方法
公开(公告)号：JP2005236025A
公开(公告)日：2005-09-02
申请号：JP2004043157
申请日：2004-02-19
申请人： Riipuru:Kk , Tokyo Seimitsu Co Ltd , 株式会社リープル , 株式会社東京精密
发明人： FUKUI TOYOJI , CHIBA KIYOTAKA , SHIMAZU NOBUO , ENDO AKIHIRO
IPC分类号： G03F1/20 , G03F7/20 , H01L21/027 , G03F1/16
摘要： PROBLEM TO BE SOLVED: To provide an electron beam exposure apparatus effectually employing a mask substrate for use in electron beam exposure and capable of reducing costs required for the exposure in a semiconductor manufacturing process. SOLUTION: The electron beam exposure apparatus comprises an electron beam source 14 for generating an electron beam 15; a mask 30 having a mask pattern in response to a pattern exposed to the surface of sample 40, a mask holder 31 for disposing and holding the mask 30 in a passage of the electron beam 15, and a scanning means 21 for deflecting the electron beam 15 such that the electron beam 15 scans the mask 30 thereon. The mask holder 31 holds the mask 30 variably in the relative position of the mask with respect to a scanning region of the electron beam 15 by the scanning means 21. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电子束曝光装置，其有效地使用用于电子束曝光的掩模基板，并且能够降低在半导体制造工艺中曝光所需的成本。电子束曝光装置包括用于产生电子束15的电子束源14; 具有响应于暴露于样品40的表面的图案的掩模图案的掩模30，用于将掩模30设置并保持在电子束15的通道中的掩模保持器31，以及用于使电子束偏转的扫描装置21 使得电子束15在其上扫描掩模30。掩模保持器31通过扫描装置21将掩模30相对于电子束15的扫描区域可变地保持在掩模的相对位置。（C）2005，JPO和NCIPI

10. 发明专利

JP2000164654A METHOD AND DEVICE FOR BURN-IN TEST WITH WAFER 失效
公开(公告)号：JP2000164654A
公开(公告)日：2000-06-16
申请号：JP33536298
申请日：1998-11-26
申请人： TOKYO SEIMITSU CO LTD
发明人： CHIBA KIYOTAKA
IPC分类号： H01L21/66
摘要： PROBLEM TO BE SOLVED: To simplify a burn-in test process in a wafer state, thus providing a compact device. SOLUTION: A test card and wafer tray set and integrated on a port 11 are sent to an assembling/disassembling apparatus 12. Similarly, a wafer set on a port 10 is sent to the assembling/disassembling apparatus. An assembly, integrated from three units for holding the wafer in the device, is formed. Then the assembly is transferred into a burn-in device 13, where a burn-in test is performed with the wafer. The assembly after the test is returned to the assembling/disassembling apparatus, where it is disassembled and returned to original ports 10 and 11.

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