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    • 1. 发明申请
    • Semiconductor memory device with stacked memory cell and method of manufacturing the stacked memory cell
    • 具有堆叠存储单元的半导体存储器件和制造堆叠存储单元的方法
    • US20060120148A1
    • 2006-06-08
    • US11238381
    • 2005-09-29
    • Sung-Min KimEun-Jung YunJong-Soo SeoDu-Eung KimBeak-Hyung ChoByung-Seo Kim
    • Sung-Min KimEun-Jung YunJong-Soo SeoDu-Eung KimBeak-Hyung ChoByung-Seo Kim
    • G11C11/00
    • H01L27/2436G11C13/0004G11C13/003G11C2213/74G11C2213/79
    • In a semiconductor memory device and method, phase-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices formed of a phase-change material. Each phase-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a phase-change material. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of phase-change memory cell groups storing data while being connected to the local bit lines, respectively. Each of the phase-change memory cells of each of the phase-change memory cell groups comprises a plurality of control transistors formed on different layers, and a variable resistance device formed of a phase-change material. In addition, the semiconductor memory device has a hierarchical bit line structure that uses a global bit line and local bit lines. Accordingly, it is possible to increase both the integration density of the semiconductor memory device and the amount of current flowing through each of the phase-change memory cells.
    • 在半导体存储器件和方法中,提供了相变存储单元,每个都包括形成在不同层上的多个控制晶体管和由相变材料形成的可变电阻器件。 每个相变存储单元包括形成在不同层上的多个控制晶体管和由相变材料形成的可变电阻器件。 在一个示例中,控制晶体管的数量是两个。 半导体存储器件包括全局位线; 通过分别对应于本地位线的本地位线选择电路分别连接到全局位线或与全局位线断开的多个局部位线; 以及分别在连接到本地位线时存储数据的多个相变存储单元组。 每个相变存储单元组的每个相变存储单元包括形成在不同层上的多个控制晶体管和由相变材料形成的可变电阻器件。 此外,半导体存储器件具有使用全局位线和局部位线的分层位线结构。 因此,可以增加半导体存储器件的集成密度和流过每个相变存储单元的电流量。
    • 3. 发明授权
    • Semiconductor device including a crystal semiconductor layer
    • 包括晶体半导体层的半导体器件
    • US08198704B2
    • 2012-06-12
    • US12710378
    • 2010-02-23
    • Sung-Min KimEun-Jung Yun
    • Sung-Min KimEun-Jung Yun
    • H01L29/06H01L29/76H01L29/94H01L31/062H01L31/113H01L31/119
    • H01L21/02667H01L21/02639H01L21/2026H01L27/108H01L27/10802H01L27/10826H01L27/10879H01L29/66795H01L29/785
    • In one embodiment, a method of fabricating a semiconductor device having a crystalline semiconductor layer includes preparing a semiconductor substrate and forming a preliminary active pattern on the semiconductor substrate. The preliminary active pattern includes a barrier pattern and a non-single crystal semiconductor pattern. A sacrificial non-single crystal semiconductor layer covers the preliminary active pattern and the semiconductor substrate. By crystallizing the sacrificial non-single crystal semiconductor layer and the non-single crystal semiconductor pattern, using the semiconductor substrate as a seed layer, the sacrificial non-single crystal semiconductor layer and the non-single crystal semiconductor pattern are changed to a sacrificial crystalline semiconductor layer and a crystalline semiconductor pattern, respectively. The crystalline semiconductor pattern and the barrier pattern constitute an active pattern. The sacrificial crystalline semiconductor layer is removed.
    • 在一个实施例中,制造具有晶体半导体层的半导体器件的方法包括制备半导体衬底并在半导体衬底上形成预活性图案。 预活性图案包括阻挡图案和非单晶半导体图案。 牺牲非单晶半导体层覆盖预活性图案和半导体衬底。 通过使牺牲非单晶半导体层和非单晶半导体图案结晶,使用半导体衬底作为晶种层,将牺牲非单晶半导体层和非单晶半导体图案改变为牺牲晶体 半导体层和晶体半导体图案。 晶体半导体图案和势垒图案构成活性图案。 去除牺牲晶体半导体层。
    • 4. 发明授权
    • Methods of fabricating vertical twin-channel transistors
    • 制造垂直双通道晶体管的方法
    • US07897463B2
    • 2011-03-01
    • US12651688
    • 2010-01-04
    • Eun-Jung YunSung-Young LeeMin-Sang KimSung-Min KimHye-Jin Cho
    • Eun-Jung YunSung-Young LeeMin-Sang KimSung-Min KimHye-Jin Cho
    • H01L21/336
    • H01L29/7827H01L29/0653H01L29/513H01L29/66666H01L29/7831
    • A transistor includes first and second pairs of vertically overlaid source/drain regions on a substrate. Respective first and second vertical channel regions extend between the overlaid source/drain regions of respective ones of the first and second pairs of overlaid source/drain regions. Respective first and second insulation regions are disposed between the overlaid source/drain regions of the respective first and second pairs of overlaid source/drain regions and adjacent respective ones of the first and second vertical channel regions. Respective first and second gate insulators are disposed on respective ones of the first and second vertical channel regions. A gate electrode is disposed between the first and second gate insulators. The first and second vertical channel regions may be disposed near adjacent edges of the overlaid source/drain regions.
    • 晶体管包括在衬底上的第一对和第二对垂直重叠的源/漏区。 相应的第一和第二垂直沟道区域在第一和第二对覆盖的源极/漏极区域中的相应的第一和第二对重叠的源极/漏极区域之间延伸。 相应的第一和第二绝缘区域设置在相应的第一和第二对重叠的源极/漏极区域的重叠的源极/漏极区域之间并且相邻的第一和第二垂直沟道区域中的相应的第一和第二绝缘区域。 相应的第一和第二栅极绝缘体设置在第一和第二垂直沟道区域中的相应的一个上。 栅电极设置在第一和第二栅极绝缘体之间。 第一和第二垂直沟道区域可以设置在覆盖的源极/漏极区域的邻近边缘附近。
    • 6. 发明授权
    • Schottky barrier FinFET device and fabrication method thereof
    • 肖特基势垒FinFET器件及其制造方法
    • US07723762B2
    • 2010-05-25
    • US11598374
    • 2006-11-13
    • Sung-Min KimEun-Jung YunDong-Won Kim
    • Sung-Min KimEun-Jung YunDong-Won Kim
    • H01L29/76
    • H01L29/41791H01L29/66795H01L29/7839H01L29/78618H01L29/78684
    • A Schottky barrier FinFET device and a method of fabricating the same are provided. The device includes a lower fin body provided on a substrate. An upper fin body having first and second sidewalls which extend upwardly from a center of the lower fin body and face each other is provided. A gate structure crossing over the upper fin body and covering an upper surface of the upper fin body and the first and second sidewalls is provided. The Schottky barrier FinFET device includes a source and a drain which are formed on the sidewalls of the upper fin body adjacent to sidewalls of the gate structure and made of a metal material layer formed on an upper surface of the lower fin body positioned at both sides of the upper fin body, and the source and drain form a Schottky barrier to the lower and upper fin bodies.
    • 提供肖特基势垒FinFET器件及其制造方法。 该装置包括设置在基板上的下部翅片体。 提供具有从下翅片体的中心向上延伸并彼此面对的第一和第二侧壁的上翅片本体。 提供了一种跨越上翅片体并覆盖上翅片体的上表面和第一和第二侧壁的门结构。 肖特基势垒FinFET器件包括源极和漏极,其形成在与鳍结构的侧壁相邻的上翅片体的侧壁上,并且由形成在位于两侧的下翅片体的上表面上的金属材料层 并且源极和漏极对下鳍体和上鳍体形成肖特基势垒。