会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明授权
    • Low thermal resistant, fluid-cooled semiconductor module
    • 低耐热,流体冷却的半导体模块
    • US5774334A
    • 1998-06-30
    • US520338
    • 1995-08-28
    • Keizo KawamuraNoriyuki AshiwakeTakahiro DaikokuAkio IdeiKenichi KasaiHideyuki KimuraAtsuo NishiharaToshio HatadaShigeyuki Sasaki
    • Keizo KawamuraNoriyuki AshiwakeTakahiro DaikokuAkio IdeiKenichi KasaiHideyuki KimuraAtsuo NishiharaToshio HatadaShigeyuki Sasaki
    • H01L23/433H05K7/20
    • H01L23/4338H01L2224/16H01L2224/73253
    • Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.
    • 半导体器件通过焊料固定在衬底上,并且具有封闭结构的半导体模块由衬底,凸缘和壳体形成。 两组导热构件分别与半导体装置收缩的翅片和壳体的内壁连接到半导体。 两组导热构件的每个翅片的翅片厚度相对较厚,翅片高度低,并且相应的相对的导热构件的各个翅片之间的间隙非常小。 作为导热介质的液体封装在半导体模块中。 半导体模块的液面被控制成使得其以垂直方式接触半导体模块中的最上面的半导体器件。 此外,在半导体模块中形成的空间的顶面和底面设置有用于引入和移除冷却流体的阀机构。 通过提供这种高度刚性的翅片来提高导热构件的批量生产能力,并且通过将冷却介质牢固地引入各个翅片来提供改进的冷却功能,同时允许模块减小尺寸。
    • 8. 发明申请
    • Mechanical Quantity Measuring Device
    • 机械量测量装置
    • US20150276517A1
    • 2015-10-01
    • US14403385
    • 2012-05-25
    • Kisho AshidaHiroyuki OhtaHiromi ShimazuKenichi Kasai
    • Kisho AshidaHiroyuki OhtaHiromi ShimazuKenichi Kasai
    • G01L1/22
    • G01L1/2293G01L1/18G01L1/2243
    • A load cell including sensor chip (1) on which plural resistive elements rectangular in a plan view are formed, and a member (2) is provided on a front surface side of a semiconductor substrate made of silicon single crystal. The member (2) includes a load portion (3), a fixed pedestal portion (4), and a strain generation portion (5) that is spaced apart from the load portion (3) and the fixed pedestal portion (4), and arranged between the load portion (3) and the fixed pedestal portion (4). The sensor chip (1) is attached onto a front side surface (2a) of the strain generation portion (5) of the member (2) so that a direction of the silicon single crystal in the semiconductor substrate is parallel to a load direction, and a longitudinal direction of the plural resistive elements has an angle of 45° with respect to a load direction.
    • 一种传感器芯片(1)的测力传感器,其上形成有平面图中矩形的多个电阻元件,并且在由硅单晶制成的半导体衬底的正面侧设置有构件(2)。 构件(2)包括负载部分(3),固定基座部分(4)和与负载部分(3)和固定基座部分(4)间隔开的应变产生部分(5),以及 布置在负载部分(3)和固定基座部分(4)之间。 传感器芯片(1)安装在构件(2)的应变产生部分(5)的前侧表面(2a)上,使得半导体衬底中的单晶硅的<100>方向平行于 多个电阻元件的纵向方向相对于负载方向具有45°的角度。