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1. 发明专利

JP2012212938A Printed wiring board and manufacturing method therefor 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：JP2012212938A
公开(公告)日：2012-11-01
申请号：JP2012164199
申请日：2012-07-24
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： OKA YOSHIO , PARK CHIN-JU , MAEDA KAZUYUKI , YAGI SHIGETO , SHIMOMURA TETSUYA , NISHIKAWA JUNICHIRO
IPC分类号： H05K1/05 , G11B5/60 , H05K1/11 , H05K3/40 , H05K3/44
CPC分类号： H05K3/44 , H01B1/22 , H05K1/056 , H05K1/097 , H05K3/4069 , H05K2201/09554 , H05K2203/0315 , H05K2203/105 , H05K2203/1136 , Y10T29/49128 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board having excellent connection reliability by using a conductive paste with good conductivity.SOLUTION: A printed wiring board 1 of the present invention comprises a metal substrate 2, an insulation layer 3 provided on the surface of the metal substrate 2, and a conductive layer 4 provided on the surface of the insulation layer 3 and electrically connected with the metal substrate 2. The printed wiring board 1 is further provided with a through hole 6 formed on the insulation layer 3 and the conductive layer 4 and having the metal substrate 2 as the bottom face and the insulation layer 3 and the conductive layer 4 as the wall surfaces, and a conductive paste 7 which fills the through hole 6 and electrically connects the metal substrate 2 and the conductive layer 4. In the printed wiring board 1, current is fed for the boundary surface of the metal substrate 2 and the conductive paste 7.
摘要翻译：要解决的问题：通过使用具有良好导电性的导电膏来提供具有优异的连接可靠性的印刷线路板。解决方案：本发明的印刷电路板1包括金属基板2，设置在金属基板2的表面上的绝缘层3和设置在绝缘层3的表面上的导电层4，并且电气与金属基板2连接。印刷布线板1还设置有形成在绝缘层3和导电层4上的通孔6，并且具有金属基板2作为底面，并且绝缘层3和导电层以及导电膏7，其填充通孔6并电连接金属基板2和导电层4.在印刷布线板1中，馈送电流用于金属基板2的边界表面，并且导电膏7.版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2009253080A Printed wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2009253080A
公开(公告)日：2009-10-29
申请号：JP2008100337
申请日：2008-04-08
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： OKA YOSHIO , KASUGA TAKASHI , YAGI SHIGETO , BOKU TATSUTAMA , SHIMOMURA TETSUYA , MATSUOKA TORU , NOGUCHI KO , UENISHI NAOTA , OHAMA OSAMU , UEDA HIROSHI , UEHARA SUMITO , MAKINO TAKAHIKO , OKAGUCHI KAYO
IPC分类号： H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board having excellent connection reliability by using conductive paste.
SOLUTION: A printed wiring board 1 is provided with a first conductive layer 3, an insulating layer 2 provided on the surface of the first conductive layer 3, and a second conductive layer 4 provided on the surface of the insulating layer 2 and electrically connected with the first conductive layer 3. Moreover, the printed wiring board 1 is provided with: a via hole 5 that is formed in the insulating layer 2 and the second conductive layer 4 and has the first conductive layer 3 as a bottom surface and the insulating layer 2 and the second conductive layer 4 as wall surfaces; and conductive paste 6 that is filled in the via hole 5 to electrically connect the first conductive layer 3 and the second conductive layer 4. The opening diameter R1 of the via hole 5 in the insulating layer 2 is set larger than the opening diameter R2 of the via hole 5 in the second conductive layer 4.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过使用导电膏来提供具有优异连接可靠性的印刷线路板。解决方案：印刷电路板1设置有第一导电层3，设置在第一导电层3的表面上的绝缘层2和设置在绝缘层2的表面上的第二导电层4和与第一导电层3电连接。此外，印刷布线板1设置有形成在绝缘层2和第二导电层4中并具有作为底面的第一导电层3的通孔5，以及绝缘层2和第二导电层4作为壁表面; 以及填充在通孔5中以将第一导电层3和第二导电层4电连接的导电膏6.绝缘层2中的通路孔5的开口直径R1被设定为大于开口直径R2 通孔5在第二导电层4中。（C）2010，JPO＆INPIT

3. 发明专利

JP2008198964A Printed wiring board and method for manufacturing the same 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：JP2008198964A
公开(公告)日：2008-08-28
申请号：JP2007047609
申请日：2007-02-27
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： OKA YOSHIO , BOKU TATSUTAMA , MAEDA KAZUYUKI , YAGI SHIGETO , SHIMOMURA TETSUYA , NISHIKAWA JUNICHIRO
IPC分类号： H05K1/05 , G11B5/60 , H05K1/11 , H05K3/40
CPC分类号： H05K3/44 , H01B1/22 , H05K1/056 , H05K1/097 , H05K3/4069 , H05K2201/09554 , H05K2203/0315 , H05K2203/105 , H05K2203/1136 , Y10T29/49128 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board having superior connection reliability by using a conductive paste having superior conductivity. SOLUTION: The printed wiring board 1 is provided with: a metal substrate 2; an insulating layer 3 arranged on the surface of the metal substrate 2; and a conductive layer 4 which is arranged on the surface of the insulating layer 3 and electrically connected to the metal substrate 2. The printed wiring board 1 also includes: a through hole 6 which is formed through the insulating layer 3 and the conductive layer 4 and has the metal substrate 2 as a bottom surface and the insulating layer 3 and the conductive layer 4 as wall surfaces; and a conductive paste 7 with which the through hole 6 is filled for electrically connecting the metal substrate 2 and the conductive layer 4. The printed wiring board 1 is processed to permit a current to flow to an interface between the metal substrate 2 and the conductive paste 7. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过使用具有优异导电性的导电膏来提供具有优异的连接可靠性的印刷线路板。解决方案：印刷电路板1设置有：金属基板2; 布置在金属基板2的表面上的绝缘层3; 以及布置在绝缘层3的表面上并与金属基板2电连接的导电层4.印刷布线板1还包括：穿过绝缘层3和导电层4形成的通孔6 并且具有作为底面的金属基板2和作为壁面的绝缘层3和导电层4; 以及填充有通孔6的导电膏7，用于电连接金属基板2和导电层4.印刷布线板1被加工成允许电流流到金属基板2和导电层之间的界面粘贴7.版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2009033034A Printed wiring board and its manufacturing method 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：JP2009033034A
公开(公告)日：2009-02-12
申请号：JP2007197603
申请日：2007-07-30
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： OKA YOSHIO , YAGI SHIGETO , BOKU TATSUTAMA , SHIMOMURA TETSUYA , MATSUOKA TORU , UENISHI NAOTA , UEDA HIROSHI , OKUDA SUMUTO , MAKINO TAKAHIKO
IPC分类号： H05K1/09 , H05K3/12 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board that allows sure coating of a conductive layer by a cover coat while preventing the occurrence of oxidization or corrosion of the conductive layer, and its manufacturing method.
SOLUTION: The printed wiring board 1 is provided with a conductive layer 3 provided on the surface of a base material 2, a conductive paste 7 provided on the surface of the conductive layer 3, and a cover coat 5 provided on the surface of the conductive layer 3 and on the surface of the conductive paste 7 so as to coat the conductive layer 3 and the conductive paste 7. The conductive paste 7 includes a metal reflective member 21 for reflecting ultraviolet rays. The cover coat 5 is formed of a negative-type photosensitive resin composition that is ultraviolet curable. When ultraviolet rays are emitted to the conductive paste 7, the metal reflective member 21 reflects the ultraviolet rays. The ultraviolet rays are scattered in the conductive paste 7. Scattered light of the ultraviolet rays scattered by the conductive paste 7 is emitted to a part of the cover coat 5 located around the conductive paste 7.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过覆盖层确保涂覆导电层同时防止导电层氧化或腐蚀的发生的印刷线路板及其制造方法。解决方案：印刷电路板1设置有设置在基材2的表面上的导电层3，设置在导电层3的表面上的导电膏7和设置在导电层3的表面上的覆盖层5 的导电性层3和导电性膏7的表面，以便涂覆导电层3和导电膏7.导电膏7包括用于反射紫外线的金属反射构件21。覆盖层5由可紫外线固化的负型感光性树脂组合物形成。当紫外线发射到导电膏7时，金属反射构件21反射紫外线。紫外线散射在导电膏7中。由导电膏7散射的紫外线的散射光被发射到位于导电浆7周围的覆盖层5的一部分。版权所有（C）2009， JPO和INPIT

5. 发明专利

JP2004128365A Flexible copper clad circuit board 有权
公开(公告)号：JP2004128365A
公开(公告)日：2004-04-22
申请号：JP2002293178
申请日：2002-10-07
申请人： Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社
发明人： NAKAGAMA SHOJI , HAYASHI NORIKATA , OKA YOSHIO , YAGI SHIGETO , KANDA MASAHIKO , NAKAYAMA HIDEAKI , YAMAOKA SEIICHI
IPC分类号： H05K3/38 , H05K3/16 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a flexible copper clad in which a stability of dimension and flexibility is excellent, a thin copper layer can be easily formed, peel strength reduction is small after a heat deterioration test and processes of a micro-via, desmear, gilding or the like, and further a minute circuit can be formed that has favorable patterns and is hard to exfoliate.
SOLUTION: In the flexible copper clad substrate in which a thermoplastic polyimide layer, a metallic layer that is composed of an alloy containing at least one sort of metals among nickel, chrome or nickel and chrome and has a thickness of 5 nm or more, and copper layer are formed in this order on a base film formed from a heat resistant resin. Further, the flexible copper clad circuit board has an unevenness whose center line roughness Ra is nearly in a range of 0.1 to 1.0μm in a boundary face between the thermoplastic polyimide layer and the metallic layer and is fabricated by using a fabricating method of the flexible copper clad circuit board.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2007227156A Conductive paste, and printed wiring board using it 有权
标题翻译：导电膏和印刷线路板使用它
公开(公告)号：JP2007227156A
公开(公告)日：2007-09-06
申请号：JP2006046967
申请日：2006-02-23
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： OKA YOSHIO , YAGI SHIGETO
IPC分类号： H01B1/22 , B22F1/00 , B22F1/02 , H01B1/00 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide conductive paste excelling in a migration suppression effect and in conductivity; and to provide a printed wiring board using it. SOLUTION: This conductive paste contains a conductive filler and a binder resin as essential constituents. The conductive paste is characterized in that the conductive filler contains silver powder and silver-coated copper powder as main constituents, and the content of the silver-coated copper powder is 1-40 wt.% of the whole conductive filler. This printed wiring board is characterized by printing the conductive paste on a board. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供优异的迁移抑制效果和导电性的导电性糊剂; 并提供使用它的印刷线路板。
解决方案：该导电浆料含有导电填料和粘合剂树脂作为必要成分。导电性糊剂的特征在于，导电性填料含有银粉末和银涂覆铜粉末作为主要成分，并且银涂覆的铜粉末的含量为整个导电填料的1-40重量％。该印刷电路板的特征在于将导电膏印刷在板上。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2010045096A Seal structure and electronic equipment 审中-公开
标题翻译：密封结构和电子设备
公开(公告)号：JP2010045096A
公开(公告)日：2010-02-25
申请号：JP2008206775
申请日：2008-08-11
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MISHIMA HIDEHIKO , PARK JIN-JOO , YAGI SHIGETO , YAMASHITA KATSUHISA
IPC分类号： H05K7/00
摘要： PROBLEM TO BE SOLVED: To provide a seal structure which is provided in a narrow gap, and to provide electronic equipment using the same.
SOLUTION: A wiring body 20 includes a seal portion 15 for sealing through-hole peripheries of a housing 41a of the electronic equipment. The seal portion 15 is provided with a direct-connection spacer member 11 which branches from FPC 21 as a wiring member to extend and encloses a through-hole 43. The direct-connection spacer member 11 and FPC 21 constitute a closed-ring type blocker (dam D) enclosing the periphery of the through-hole 43. The blocker (dam D) is fixed to a first housing 41a with a double-sided adhesive tape (bonding member). Further, the blocker (dam D) and peripheries of through-holes 33 and 43 are sealed with a seal tape 14. The FPC 21 extends into the first housing 41a through the blocker (dam D).
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供设置在狭窄间隙中的密封结构，并提供使用该密封结构的电子设备。解决方案：布线主体20包括用于密封电子设备的外壳41a的通孔周边的密封部分15。密封部分15设置有直接连接间隔件11，其从作为布线构件的FPC 21分支以延伸并包围通孔43.直接连接间隔件11和FPC 21构成闭环型阻塞件（大坝D）封闭通孔43的周边。阻挡器（大坝D）用双面胶带（接合构件）固定到第一壳体41a。此外，阻塞器（大坝D）和通孔33和43的周边用密封带14密封。FPC 21通过阻挡件（大坝D）延伸到第一壳体41a中。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2007109727A Multilayer printed wiring board and method of manufacturing same 有权
标题翻译：多层印刷接线板及其制造方法
公开(公告)号：JP2007109727A
公开(公告)日：2007-04-26
申请号：JP2005296729
申请日：2005-10-11
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： TAKII HITOSHI , HAYASHI NORIKATA , OKA YOSHIO , YAGI SHIGETO
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board capable of being mounted with components on both the surfaces with high density, and to provide a method of manufacturing the multilayer printed wiring board by a simple process. SOLUTION: The multilayer printed wiring board comprises an insulating board in which a circuit formed by a conductive resin composition A is provided on at least one of its surfaces. The insulating board contains a laminate. The laminate has an adhesive layer that has two wiring board base materials, each having a via hole that reaches one circuit and is open on the other surface; and a through-hole in contact with an opening so that respective openings at both sides contain the opening of the via hole, and the conductive section between circuits composed by filling the via hole and the through-hole with a conductive resin composition B. The method of manufacturing the multilayer printed wiring board is also disclosed. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供能够以高密度在两个表面上安装组件的多层印刷线路板，并且通过简单的工艺提供制造多层印刷线路板的方法。解决方案：多层印刷线路板包括绝缘板，其中在至少一个表面上设置由导电树脂组合物A形成的电路。绝缘板包含层压板。该层压体具有粘合剂层，该粘合剂层具有两个线路板基材，每个具有通孔到达一个电路并在另一个表面上开口; 以及与开口接触的通孔，使得两侧的开口都包含通孔的开口，以及通过用导电树脂组合物B填充通孔和通孔而构成的电路之间的导电部分。还公开了制造多层印刷线路板的方法。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2004111168A Conductive paste 有权
公开(公告)号：JP2004111168A
公开(公告)日：2004-04-08
申请号：JP2002270958
申请日：2002-09-18
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： OKA YOSHIO , HAYASHI NORIKATA , YAGI SHIGETO , MIYAZAKI TAKESHI
IPC分类号： H05K1/09 , H01B1/22
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste of a copper base with low cost and hardly deteriorating with time, necessary for a pattern forming of a miniaturized electric circuit.
SOLUTION: Oxidation of a copper surface is prevented to keep its conductivity by adding an unsaturated fatty acid and metal powder having greater ionization tendency than copper as additives to a conductive paste mainly composed of copper powder and synthetic resin solution. Zinc or an alloy including zinc is preferable for a metal having greater ionization tendency than copper. Amount of adding is 0.2 to 10 weight parts of the unsaturated fatty acid to 100 weight parts of the copper powder, and preferably, zinc is to be used as metal powder having greater ionization tendency than copper within a range from 0.2 to 10 weight parts.
COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2003323929A Arc resistant terminal pair 审中-公开
标题翻译：抗电弧终端对
公开(公告)号：JP2003323929A
公开(公告)日：2003-11-14
申请号：JP2002231300
申请日：2002-08-08
申请人： Auto Network Gijutsu Kenkyusho:Kk , Sumitomo Electric Ind Ltd , Sumitomo Wiring Syst Ltd , 住友電気工業株式会社 , 住友電装株式会社 , 株式会社オートネットワーク技術研究所
发明人： OTA TAKASHI , HIRAI HIROKI , TSUJI RYOJI , TAKANO SATORU , SHIBATA MASAHIRO , KIMURA ATSUSHI , KANDA MASAHIKO , YAGI SHIGETO , HAYASHI NORIKATA
IPC分类号： H01R13/03
CPC分类号： H01R13/03
摘要： PROBLEM TO BE SOLVED: To effectively suppress arc discharge in terminal uncoupling.
SOLUTION: When using a terminal pair of energization by mutual engagement and a portion in at least one terminal 1 separating last in uncoupling from another terminal 2 is designated as a final contact part 1e, at least the final contact part is coated by a plating layer 1c including a metal with a melting point of ≥1550°C. The terminals favorably mutually contact even in portions other than the plating layer 1c when they are completely engaged, and that surfaces in the portions other than the plating layer 1c are favorably composed of a material 1d with higher conductivity than the plating layer 1c.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：有效抑制端子分离中的电弧放电。解决方案：当通过相互接合使用端子对通电时，并且至少一个端子1中的最后一个分离中的另一个端子2的部分被指定为最终接触部分1e时，至少最终接触部分被涂覆包含熔点≥1550℃的金属的镀层1c。这些端子在完全接合时，甚至在电镀层1c以外的部分也是有利地相互接触的，并且镀层1c以外的部分的表面优选由比镀层1c更高的导电性的材料1d构成。版权所有（C）2004，JPO

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