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1. 发明专利

JP2011171423A Method for manufacturing of flexible printed circuit board 有权
标题翻译：制造柔性印刷电路板的方法
公开(公告)号：JP2011171423A
公开(公告)日：2011-09-01
申请号：JP2010032289
申请日：2010-02-17
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： OKA YOSHIO , UENISHI NAOTA , PARK JIN-JOO , UEHARA SUMITO , NOGUCHI KO , OKAGUCHI KAYO
IPC分类号： H05K3/26 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing of a flexible printed circuit board, capable of efficiently and effectively suppressing and removing residue, which is produced on a base metal layer after performing the exposure and development on a resist layer with a simple configuration. SOLUTION: The method for manufacturing a flexible printed circuit board is capable of efficiently and effectively suppressing and removing residue P, which is produced on a base metal layer 11 after performing the exposure and development on a resist layer. The method includes a resist pattern formation step 300 combining a water washing step to wash a trench 31a in a resist pattern 31 with a washing water and an acid electrolytic water treatment to wash the same with an acid electrolytic water after performing the exposure treatment in use of at least alkali development liquid. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性印刷电路板的制造方法，其能够高效且有效地抑制和去除在抗蚀剂层上进行曝光和显影之后在基底金属层上产生的残留物，一个简单的配置。解决方案：柔性印刷电路板的制造方法能够高效且有效地抑制和去除在抗蚀剂层上进行曝光和显影之后在基底金属层11上产生的残留物P. 该方法包括：抗蚀剂图形形成步骤300，组合水洗步骤，用洗涤水和酸性电解水处理洗涤抗蚀剂图案31中的沟槽31a，在使用中进行曝光处理后用酸性电解水洗涤的至少碱性显影液。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2010034170A Wiring body, connection structure and electronic equipment 有权
标题翻译：接线体，连接结构和电子设备
公开(公告)号：JP2010034170A
公开(公告)日：2010-02-12
申请号：JP2008192923
申请日：2008-07-27
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MISHIMA HIDEHIKO , KOYAMA KEIJI , PARK JIN-JOO
IPC分类号： H05K7/00 , H04M1/02 , H05K5/06 , H05K7/14
摘要： PROBLEM TO BE SOLVED: To provide a wiring body, etc. that can have a waterproof structure inexpensively while being flexibly adaptive to design change of a wiring member.
SOLUTION: The wiring body has a fitting portion 15 which is fitted in a through-hole of a housing of electronic equipment. The fitting portion 15 has first and second reinforcing plates 11a and 11b fixed to FPC 21 with first and second adhesive layers 14a and 14b. An O ring 13 is fitted in groove portions 12 of the reinforcing plates 11a and 11b. The O ring 13 clamps the reinforcing plates 11a and 11b with the FPC 21 interposed. An O type groove is formed in the through-hole of the housing. The O ring 13 in the fitting portion 15 is fit in the O type groove of the through-hole. The reinforcing plates 11a and 11b are flexibly adaptive to design change of the wiring member, and manufactured inexpensively.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够廉价地具有防水结构的布线体等，同时柔性地适应布线构件的设计变化。解决方案：接线体具有安装在电子设备的壳体的通孔中的嵌合部15。装配部分15具有第一和第二加强板11a和11b，其固定到具有第一和第二粘合层14a和14b的FPC21上。 O形环13安装在加强板11a和11b的槽部12中。 O型环13夹着FPC21夹持加强板11a，11b。在壳体的通孔中形成O型槽。装配部分15中的O形环13装配在通孔的O型槽中。加强板11a和11b灵活地适应布线构件的设计变化，并且廉价地制造。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2010034169A Seal structure and electronic equipment 有权
标题翻译：密封结构和电子设备
公开(公告)号：JP2010034169A
公开(公告)日：2010-02-12
申请号：JP2008192922
申请日：2008-07-27
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MISHIMA HIDEHIKO , PARK JIN-JOO
IPC分类号： H05K7/00 , H04M1/02
摘要： PROBLEM TO BE SOLVED: To achieve waterproofing with inexpensive and simple seal structure.
SOLUTION: A seal portion 60 is provided with a seal member 61 which covers FPC 21, and an adhesive sheet 65 for pressing the seal member 61. The FPC 21 is stuck on a housing with an adhesive double coated tape 63. The seal member 61 covers the FPC 21 and the whole through-hole. The adhesive sheet 65 seals a periphery of the seal member 61 while pressing the seal member 61 against the housing and FPC 21. The seal member 61 is made of a water-repellent porous resin. In this example, the seal member 61 uses a porous PTFE film manufactured by a stretching method as the porous resin. When the seal member 61 is pressed, a gap between the seal member 61, and the housing and FPC 21 becomes small because of elastic deformation to secure a waterproofing function.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：用廉价和简单的密封结构实现防水。解决方案：密封部分60设置有覆盖FPC21的密封构件61和用于按压密封构件61的粘合片65. FPC 21用粘合剂双面胶带63粘贴在壳体上。密封构件61覆盖FPC 21和整个通孔。粘合片65在将密封构件61压靠在壳体和FPC 21上的同时密封密封构件61的周边。密封构件61由防水多孔树脂制成。在该实施例中，密封部件61使用通过拉伸法制造的多孔PTFE膜作为多孔树脂。当密封构件61被按压时，密封构件61与壳体和FPC 21之间的间隙由于弹性变形而变小，以确保防水功能。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2010118460A Printed wiring board and its manufacturing method 审中-公开
标题翻译：印刷线路板及其制造方法
公开(公告)号：JP2010118460A
公开(公告)日：2010-05-27
申请号：JP2008290072
申请日：2008-11-12
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： OKA YOSHIO , KASUGA TAKASHI , PARK JIN-JOO , SHIMOMURA TETSUYA
IPC分类号： H05K1/11 , H05K1/05 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which can control connection resistance between a metal substrate and a conductive layer, and can be simplified in manufacturing, and its manufacturing method.
SOLUTION: The printed wiring board 1 includes the metal substrate 2, an insulating layer 3 formed on the surface of the metal substrate 2, the conductive layer 4 formed on the surface of the insulating layer 3, and a bottomed through-hole 5 formed on the insulating layer 3 and the conductive layer 4 in which the metal substrate 2 is a bottom surface and the insulating layer 3 and the conductive layer 4 are wall surfaces wherein the metal substrate 2 and the conductive layer 4 are electrically connected using the through-hole 5. Then, on the surface of the metal substrate 2 which is the bottom surface of the through-hole 5, a dried matter of conductive ink 6 including metal particulates (that is, residue obtained by evaporating and drying the conductive ink 6) is provided.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以控制金属基板和导电层之间的连接电阻并且可以简化制造的印刷线路板及其制造方法。解决方案：印刷电路板1包括金属基板2，形成在金属基板2的表面上的绝缘层3，形成在绝缘层3的表面上的导电层4和有底的通孔 5，其中金属基板2是底面，绝缘层3和导电层4是导电层4，其中金属基板2和导电层4使用然后，在作为通孔5的底面的金属基板2的表面上，包含金属微粒的导电性油墨6的干燥物（即，通过蒸发和干燥导电油墨得到的残留物 6）。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2010067590A Flexible flat cable and method of manufacturing the same 审中-公开
标题翻译：柔性平板电缆及其制造方法
公开(公告)号：JP2010067590A
公开(公告)日：2010-03-25
申请号：JP2009064498
申请日：2009-03-17
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： HIRAMOTO MASAYUKI , CHIBA AKINOBU , PARK JIN-JOO
IPC分类号： H01B13/00 , H01B7/04
摘要： PROBLEM TO BE SOLVED: To expose a conductor of a flexible flat cable (FFC) 10 by irradiation of a laser beam (a) without firing off the conductor 11.
SOLUTION: The conductor 11 is sent to a heating roll 1, insulation tapes 12a, 12b with adhesive 16 are sent on both sides of the conductor, and they are integrated to form an FFC 10', and the FFC 10' are wound. The required number of rolls 5 formed by winding the FFC are stored. When an order of the FFC 10 with a conductor exposed part 13 is received, the FFC 10' is drawn from the stored FFC roll 5. The laser light a
1 is irradiated by continuously reciprocating respectively in longitudinal and horizontal directions at required widths in the figure to form an opening 13a by melting the insulation tape 12a. After forming the opening, molten residue b is alcohol-cleaned by a cleaning rod 15 or irradiated with laser light a
2 to form the conductor exposed part 13. Then, the FFC 10' is cut at a predetermined length to provide the FFC 10 with the predetermined conductor exposed part.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过照射激光束（a）来暴露柔性扁平电缆（FFC）10的导体而不使导体11点火。解决方案：将导体11送至加热辊1，具有粘合剂16的绝缘带12a，12b被传送到导体的两侧，并且它们被一体化以形成FFC 10'，并且FFC 10'被卷绕。存储通过缠绕FFC形成的所需数量的辊5。当接收到具有导体暴露部分13的FFC10的顺序时，从存储的FFC辊5中抽出FFC 10'。激光a 1 分别沿纵向和在图中以所需宽度的水平方向，通过熔化绝缘带12a形成开口13a。在形成开口之后，将熔融残渣b用清洁棒15进行醇清洗或照射激光 2 ，形成导体暴露部分13.然后，将FFC 10'以预定的长度以使FFC 10具有预定的导体暴露部分。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2010045096A Seal structure and electronic equipment 审中-公开
标题翻译：密封结构和电子设备
公开(公告)号：JP2010045096A
公开(公告)日：2010-02-25
申请号：JP2008206775
申请日：2008-08-11
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MISHIMA HIDEHIKO , PARK JIN-JOO , YAGI SHIGETO , YAMASHITA KATSUHISA
IPC分类号： H05K7/00
摘要： PROBLEM TO BE SOLVED: To provide a seal structure which is provided in a narrow gap, and to provide electronic equipment using the same.
SOLUTION: A wiring body 20 includes a seal portion 15 for sealing through-hole peripheries of a housing 41a of the electronic equipment. The seal portion 15 is provided with a direct-connection spacer member 11 which branches from FPC 21 as a wiring member to extend and encloses a through-hole 43. The direct-connection spacer member 11 and FPC 21 constitute a closed-ring type blocker (dam D) enclosing the periphery of the through-hole 43. The blocker (dam D) is fixed to a first housing 41a with a double-sided adhesive tape (bonding member). Further, the blocker (dam D) and peripheries of through-holes 33 and 43 are sealed with a seal tape 14. The FPC 21 extends into the first housing 41a through the blocker (dam D).
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供设置在狭窄间隙中的密封结构，并提供使用该密封结构的电子设备。解决方案：布线主体20包括用于密封电子设备的外壳41a的通孔周边的密封部分15。密封部分15设置有直接连接间隔件11，其从作为布线构件的FPC 21分支以延伸并包围通孔43.直接连接间隔件11和FPC 21构成闭环型阻塞件（大坝D）封闭通孔43的周边。阻挡器（大坝D）用双面胶带（接合构件）固定到第一壳体41a。此外，阻塞器（大坝D）和通孔33和43的周边用密封带14密封。FPC 21通过阻挡件（大坝D）延伸到第一壳体41a中。版权所有（C）2010，JPO＆INPIT

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