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1. 发明专利

JP2009253080A Printed wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2009253080A
公开(公告)日：2009-10-29
申请号：JP2008100337
申请日：2008-04-08
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： OKA YOSHIO , KASUGA TAKASHI , YAGI SHIGETO , BOKU TATSUTAMA , SHIMOMURA TETSUYA , MATSUOKA TORU , NOGUCHI KO , UENISHI NAOTA , OHAMA OSAMU , UEDA HIROSHI , UEHARA SUMITO , MAKINO TAKAHIKO , OKAGUCHI KAYO
IPC分类号： H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board having excellent connection reliability by using conductive paste.
SOLUTION: A printed wiring board 1 is provided with a first conductive layer 3, an insulating layer 2 provided on the surface of the first conductive layer 3, and a second conductive layer 4 provided on the surface of the insulating layer 2 and electrically connected with the first conductive layer 3. Moreover, the printed wiring board 1 is provided with: a via hole 5 that is formed in the insulating layer 2 and the second conductive layer 4 and has the first conductive layer 3 as a bottom surface and the insulating layer 2 and the second conductive layer 4 as wall surfaces; and conductive paste 6 that is filled in the via hole 5 to electrically connect the first conductive layer 3 and the second conductive layer 4. The opening diameter R1 of the via hole 5 in the insulating layer 2 is set larger than the opening diameter R2 of the via hole 5 in the second conductive layer 4.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过使用导电膏来提供具有优异连接可靠性的印刷线路板。解决方案：印刷电路板1设置有第一导电层3，设置在第一导电层3的表面上的绝缘层2和设置在绝缘层2的表面上的第二导电层4和与第一导电层3电连接。此外，印刷布线板1设置有形成在绝缘层2和第二导电层4中并具有作为底面的第一导电层3的通孔5，以及绝缘层2和第二导电层4作为壁表面; 以及填充在通孔5中以将第一导电层3和第二导电层4电连接的导电膏6.绝缘层2中的通路孔5的开口直径R1被设定为大于开口直径R2 通孔5在第二导电层4中。（C）2010，JPO＆INPIT

2. 发明专利

JP2011171423A Method for manufacturing of flexible printed circuit board 有权
标题翻译：制造柔性印刷电路板的方法
公开(公告)号：JP2011171423A
公开(公告)日：2011-09-01
申请号：JP2010032289
申请日：2010-02-17
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： OKA YOSHIO , UENISHI NAOTA , PARK JIN-JOO , UEHARA SUMITO , NOGUCHI KO , OKAGUCHI KAYO
IPC分类号： H05K3/26 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing of a flexible printed circuit board, capable of efficiently and effectively suppressing and removing residue, which is produced on a base metal layer after performing the exposure and development on a resist layer with a simple configuration. SOLUTION: The method for manufacturing a flexible printed circuit board is capable of efficiently and effectively suppressing and removing residue P, which is produced on a base metal layer 11 after performing the exposure and development on a resist layer. The method includes a resist pattern formation step 300 combining a water washing step to wash a trench 31a in a resist pattern 31 with a washing water and an acid electrolytic water treatment to wash the same with an acid electrolytic water after performing the exposure treatment in use of at least alkali development liquid. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性印刷电路板的制造方法，其能够高效且有效地抑制和去除在抗蚀剂层上进行曝光和显影之后在基底金属层上产生的残留物，一个简单的配置。解决方案：柔性印刷电路板的制造方法能够高效且有效地抑制和去除在抗蚀剂层上进行曝光和显影之后在基底金属层11上产生的残留物P. 该方法包括：抗蚀剂图形形成步骤300，组合水洗步骤，用洗涤水和酸性电解水处理洗涤抗蚀剂图案31中的沟槽31a，在使用中进行曝光处理后用酸性电解水洗涤的至少碱性显影液。版权所有（C）2011，JPO＆INPIT

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