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1. 发明专利

JP2009200292A Flexible printed wiring board, and forming method for projection structure of wiring board 审中-公开
标题翻译：柔性印刷线路板和布线板投影结构的形成方法
公开(公告)号：JP2009200292A
公开(公告)日：2009-09-03
申请号：JP2008041194
申请日：2008-02-22
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： HIRAMOTO MASAYUKI , YAMABAYASHI NAOYUKI , BOKU TATSUTAMA
IPC分类号： H05K1/02 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed wiring board capable of surely having a projection structure by a simple forming method for the projection structure. SOLUTION: On a lower die 21, an FPC 10 is placed with wiring 12 in up-facing while a rod-shaped spacer 16 extending along the width of a base film 11 and an adhesive sheet 17 are interposed. The base film 11, the wiring 12 and a reinforcing plate 15 of the FPC 10 are deformed through stamping wherein an upper die 22 is lowered at a high speed. A part of the base film 11, the wiring 12 and the reinforcing plate 16 are deformed by the spacer 16 to form a projection portion 18 complying with the shape of a recessed portion 22a of the upper die 22. Then the spacer 16 is fitted in a recessed portion 19 formed on the back side of the projection portion 18. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过简单的投影结构形成方法可靠地具有突起结构的柔性印刷线路板。解决方案：在下模具21上，布置有布线12的FPC10，同时沿着基膜11和粘合片17的宽度延伸的棒状间隔件16。 FPC 10的基膜11，布线12和加强板15通过冲压而变形，其中上模22以高速下降。基膜11的一部分，布线12和加强板16通过间隔件16变形，形成符合上模22的凹部22a的形状的突出部18。然后将间隔件16嵌入形成在突出部分18的背面上的凹部19.版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2009090615A Manufacturing method of plastic thin film 审中-公开
标题翻译：塑料薄膜的制造方法
公开(公告)号：JP2009090615A
公开(公告)日：2009-04-30
申请号：JP2007266148
申请日：2007-10-12
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MIKAGE MASANARI , BOKU TATSUTAMA , YODA JUN , MISHIMA HIDEHIKO , OZOEGAWA MISAKO
IPC分类号： B29C67/20 , B29C59/02 , B29K105/04 , B29L7/00 , B29L9/00 , B41J2/135
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of plastic thin film, in which through-holes are formed and, at the same time, the film is prevented from remaining.
SOLUTION: The manufacturing method of a plastic thin film provided with a plurality of through-holes penetrating the thin film in the thickness direction comprises: a heating process (S1) of laminating a material thin film on an opposite substrate made of resin material having plastic deformability lower than that of the material thin film and heating the laminated body up to at least the plastic deformable temperature of the material thin film; a pressing process (S2) of pressing the material thin film between a pressing mold which forms the through-holes and the opposite substrate to penetrate the pressing mold through the material thin film and forcing the pressing mold into the opposite substrate; a cooling process (S3) of cooling the material thin film and the opposite substrate into which the pressing mold is forced; and a releasing process (S4) of releasing the pressing mold from the material thin film and the opposite substrate.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供形成通孔的塑料薄膜的制造方法，并且同时防止了膜的残留。解决方案：在厚度方向上设置有穿透薄膜的多个通孔的塑料薄膜的制造方法包括：将材料薄膜层压在由树脂制成的相对基板上的加热工序（S1）具有比材料薄膜低的塑性变形性的材料，并将层叠体加热至少至少为材料薄膜的塑性变形温度; 在形成通孔的加压模具和相对基板之间挤压材料薄膜的压制工艺（S2），以通过材料薄膜穿透压模，并迫使压模进入相对的基板; 对材料薄膜进行冷却的冷却工序（S3）和加压模具被强制的对置基板; 以及从所述材料薄膜和所述相对基板释放所述按压模具的释放工序（S4）。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008234948A Anisotropic conductive sheet and its manufacturing method 有权
标题翻译：各向异性导电片及其制造方法
公开(公告)号：JP2008234948A
公开(公告)日：2008-10-02
申请号：JP2007071673
申请日：2007-03-19
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： MIKAGE MASANARI , BOKU TATSUTAMA , KOYAMA KEIJI , YAMAMOTO MASAMICHI , NAKAMA KOKI
IPC分类号： H01R11/01 , H01B5/16 , H01B13/00 , H01R43/00
摘要： PROBLEM TO BE SOLVED: To provide a repeatedly-usable anisotropic conductive sheet that can be inexpensively manufactured by reducing manufacturing steps, and its manufacturing method.
SOLUTION: The anisotropic conductive sheet 1 is provided with an electrically-insulating sheet-like base material 2 and linear conductors 3 oriented in a thickness direction of the sheet-like base material while being held by the sheet-like base material. Both end parts of each linear conductor having bent parts are held protrudingly from the sheet-like base material.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供可以通过减少制造步骤廉价地制造的可重复使用的各向异性导电片及其制造方法。解决方案：各向异性导电片1设置有电绝缘片状基材2和线状导体3，其被片状基材保持在厚度方向上。具有弯曲部分的每个线性导体的两端部从片状基材突出地保持。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008234947A Anisotropic conductive sheet manufacturing method 有权
标题翻译：各向异性导电板制造方法
公开(公告)号：JP2008234947A
公开(公告)日：2008-10-02
申请号：JP2007071672
申请日：2007-03-19
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： MIKAGE MASANARI , BOKU TATSUTAMA , KOYAMA KEIJI , YAMAMOTO MASAMICHI , NAKAMA KOKI
IPC分类号： H01R43/00 , H01B13/00 , H01R11/01
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for inexpensively manufacturing an anisotropic conductive sheet.
SOLUTION: The manufacturing method includes a base-material molding step, in which an electrically-insulating resin material 7 is injection-filled into a die 1 so as to form a sheet-like base material 8 with an array of through-holes 9 formed penetrating through in a thickness direction, and a conduction-part forming step for filling a conductive material into the through-holes.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于廉价制造各向异性导电片的制造方法。解决方案：制造方法包括基材成型步骤，其中将电绝缘树脂材料7注入模具1中以形成具有通孔阵列的片状基材8，穿过厚度方向形成的孔9以及用于将导电材料填充到通孔中的导电部形成步骤。版权所有（C）2009，JPO＆INPIT

5. 发明专利

JP2008118091A Wiring board, wiring board connecting body and wiring board module 审中-公开
标题翻译：接线板，接线板连接体和接线板模块
公开(公告)号：JP2008118091A
公开(公告)日：2008-05-22
申请号：JP2007072753
申请日：2007-03-20
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： YAMAMOTO MASAMICHI , TOSHIOKA HIDEAKI , KASHIWABARA HIDEKI , MIYAZAKI TAKESHI , KOYAMA KEIJI , MIKAGE MASANARI , BOKU TATSUTAMA
IPC分类号： H05K1/14 , H05K1/11 , H05K3/36 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To connect conductors with each other and the resins of an insulation part with each other with required force and to peel them without damaging the conductors when a need to peel them occurs.
SOLUTION: The wiring board 20 wherein the plurality of conductors 22 are a connection part 23 comprises a plating layer 24 provided on the surface of the conductors 22 of the connection part 23 and an adhesion resin part 25 on the insulation part held between the conductors 22, and the plating layer 24 and the adhesion resin part 25 are connected by being bonded to the connection part 33 of another wiring board 30.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了将导体彼此连接，并且绝缘部件的树脂以所需的力彼此连接，并且当需要剥离时，不会损坏导体，从而剥离它们。解决方案：其中多个导体22是连接部分23的布线板20包括设置在连接部分23的导体22的表面上的镀层24和绝缘部分上的粘合树脂部分25，导体22和镀层24以及粘合树脂部25通过与另一个配线板30的连接部33接合而连接。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2008117579A Hydrogen absorbing alloy negative electrode for alkaline battery 审中-公开
标题翻译：氢吸收合金负极电极用于碱性电池
公开(公告)号：JP2008117579A
公开(公告)日：2008-05-22
申请号：JP2006298438
申请日：2006-11-02
申请人： National Institute Of Advanced Industrial & Technology , Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , 独立行政法人産業技術総合研究所
发明人： IWAKI TSUTOMU , YAO MASARU , SAKAI TETSUO , OKUNO KAZUKI , KATO MASAHIRO , BOKU TATSUTAMA
IPC分类号： H01M4/80 , C22C19/00 , H01M2/30 , H01M4/24 , H01M4/26 , H01M4/30 , H01M4/66
CPC分类号： Y02E60/124
摘要： PROBLEM TO BE SOLVED: To provide a hydrogen absorbing alloy negative electrode for an alkaline battery reducing the used amount of nickel and enhancing cycle characteristics; and to provide the alkaline battery having the negative electrode. SOLUTION: The hydrogen absorbing alloy negative electrode has a current collector of a nickel porous body formed by applying nickel plating on a nonwoven fabric of alkali resistant fibers, the nickel content of the current collector is 20-70 g/cm 2 . By using the nonwoven fabric in the current collector and making the filled hydrogen absorbing alloy present in the skeletons of the current collector, coming off of the alloy caused by finely dividing and expansion of the negative electrode can be suppressed. The nickel content in the current collector is low, the filling density of the hydrogen absorbing alloy is high, and the weight of the negative electrode can be made light. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于碱性电池的吸氢合金负极，减少镍的使用量并提高循环特性; 并提供具有负极的碱性电池。解吸方法：吸氢合金负极具有通过在耐碱性纤维的无纺布上施加镀镍而形成的镍多孔体的集电体，集电体的镍含量为20〜70g / cm 2 > 2 。通过在集电体中使用非织造布并使填充的吸氢合金存在于集电体的骨架中，可以抑制由于负极的细分和膨胀引起的合金脱落。集电体中的镍含量低，吸氢合金的填充密度高，能够使负极重量轻。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007256247A Gas sensor 审中-公开
标题翻译：气体传感器
公开(公告)号：JP2007256247A
公开(公告)日：2007-10-04
申请号：JP2006106519
申请日：2006-04-07
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： OTA YUKIHIRO , BOKU TATSUTAMA
IPC分类号： G01N27/41 , G01N27/416
摘要： PROBLEM TO BE SOLVED: To improve quantitative accuracy and lower the heating temperature, in order to shorten the sensor start-up time and prevent a sintered body from cracking at its junction. SOLUTION: A gas sensor is provided with a porous plate-like sintered body comprising trisilicon tetranitride needle crystals; first catalyst metal thin films 5a, 5b and a second catalyst metal thin film 8, formed on one surface of the plate-like sintered body in a non-contacted state with each other; oxygen ion-conductive solid electrolyte thin films 6a, 6b and 6c, formed on the respective surfaces; surface layer thin films 7a, 7b and 7c, formed on the respective surfaces so that a first measurement part, a second measurement part and a third measurement part are constituted; and a glass sealing layer 9 comprising silicon oxide and being formed on the other surface of the porous plate-like sintered body 2, a surface other than the surface of the porous plate-like sintered body having the first catalyst metal thin film 5a and the second catalyst metal thin film 8 formed thereon, and a side of the first measurement part and the second measurement part. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提高定量精度和降低加热温度，以缩短传感器启动时间并防止烧结体在其接合处开裂。气体传感器设置有多孔板状烧结体，其包含三硅四氮化物针状晶体; 在非接触状态的板状烧结体的一个表面上形成第一催化剂金属薄膜5a，5b和第二催化剂金属薄膜8; 形成在各个表面上的氧离子导电固体电解质薄膜6a，6b和6c; 形成在各个表面上的表面层薄膜7a，7b和7c构成第一测量部分，第二测量部分和第三测量部分; 以及形成在多孔板状烧结体2的另一个表面上的氧化硅玻璃密封层9，除了具有第一催化剂金属薄膜5a的多孔板状烧结体的表面以外，形成在其上的第二催化剂金属薄膜8，以及第一测量部分和第二测量部分的一侧。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2004223359A POROUS Si3N4 FOR FILTER AND ITS PRODUCTION METHOD 有权
公开(公告)号：JP2004223359A
公开(公告)日：2004-08-12
申请号：JP2003012370
申请日：2003-01-21
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： SATO TAKESHI , BOKU TATSUTAMA
IPC分类号： B01D39/20 , B01D39/00 , C04B35/584 , C04B35/591 , C04B35/594 , C04B35/638 , C04B38/00
CPC分类号： C04B35/638 , C04B35/584 , C04B35/591 , C04B35/6261 , C04B35/62625 , C04B38/0074 , C04B2111/00793 , C04B2235/3224 , C04B2235/3225 , C04B2235/428 , C04B2235/46 , C04B2235/6021 , C04B2235/604 , C04B2235/656 , C04B2235/668 , C04B2235/728 , C04B2235/766 , C04B2235/77 , C04B2235/78 , C04B2235/788
摘要： PROBLEM TO BE SOLVED: To provide porous Si 3 N 4 for a filter which has high porosity and a high aspect ratio. SOLUTION: Porous Si 3 N 4 having a porosity of 30-60%, a mean pore diameter of 0.05-12 μm, and an aspect ratio of Si 3 N 4 particles of 2-20 can be produced by a production method including a process of mixing 7.5-45 pts. mass of a metallic Si powder to 100 pts. mass of a first sintering aid of a rare earth element compound in terms of the oxide, a process for molding, a process for obtaining a nitride body and a process for sintering. Further, 0.05-5 pts. mass of at least one compound of group IIa, group IIIb and group IVb elements and transition elements is added to 100 pts. mass of the Si powder in terms of the oxide of each element to obtain the porous Si 3 N 4 for filter. COPYRIGHT: (C)2004,JPO&NCIPI

9. 发明专利

JP2009253080A Printed wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2009253080A
公开(公告)日：2009-10-29
申请号：JP2008100337
申请日：2008-04-08
申请人： Sumitomo Electric Ind Ltd , Sumitomo Electric Printed Circuit Inc , 住友電工プリントサーキット株式会社 , 住友電気工業株式会社
发明人： OKA YOSHIO , KASUGA TAKASHI , YAGI SHIGETO , BOKU TATSUTAMA , SHIMOMURA TETSUYA , MATSUOKA TORU , NOGUCHI KO , UENISHI NAOTA , OHAMA OSAMU , UEDA HIROSHI , UEHARA SUMITO , MAKINO TAKAHIKO , OKAGUCHI KAYO
IPC分类号： H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board having excellent connection reliability by using conductive paste.
SOLUTION: A printed wiring board 1 is provided with a first conductive layer 3, an insulating layer 2 provided on the surface of the first conductive layer 3, and a second conductive layer 4 provided on the surface of the insulating layer 2 and electrically connected with the first conductive layer 3. Moreover, the printed wiring board 1 is provided with: a via hole 5 that is formed in the insulating layer 2 and the second conductive layer 4 and has the first conductive layer 3 as a bottom surface and the insulating layer 2 and the second conductive layer 4 as wall surfaces; and conductive paste 6 that is filled in the via hole 5 to electrically connect the first conductive layer 3 and the second conductive layer 4. The opening diameter R1 of the via hole 5 in the insulating layer 2 is set larger than the opening diameter R2 of the via hole 5 in the second conductive layer 4.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过使用导电膏来提供具有优异连接可靠性的印刷线路板。解决方案：印刷电路板1设置有第一导电层3，设置在第一导电层3的表面上的绝缘层2和设置在绝缘层2的表面上的第二导电层4和与第一导电层3电连接。此外，印刷布线板1设置有形成在绝缘层2和第二导电层4中并具有作为底面的第一导电层3的通孔5，以及绝缘层2和第二导电层4作为壁表面; 以及填充在通孔5中以将第一导电层3和第二导电层4电连接的导电膏6.绝缘层2中的通路孔5的开口直径R1被设定为大于开口直径R2 通孔5在第二导电层4中。（C）2010，JPO＆INPIT

10. 发明专利

JP2008234997A Connection structure, wiring-board connector, wiring-board module, and electronic equipment 审中-公开
标题翻译：连接结构，接线板连接器，接线板模块和电子设备
公开(公告)号：JP2008234997A
公开(公告)日：2008-10-02
申请号：JP2007072692
申请日：2007-03-20
申请人： Sumitomo Electric Ind Ltd , 住友電気工業株式会社
发明人： MIKAGE MASANARI , BOKU TATSUTAMA , HIRATA YOSHIHIRO , YODA JUN
摘要： PROBLEM TO BE SOLVED: To provide a connection structure or the like that enables thinning and size-reduction while being high in electric-connection reliability. SOLUTION: The connection structure 30 is composed by alternately incorporating a first connector terminal 10 and a second connector terminal 20 into a casing 31. A spring member 14 is provided between a PCB 40 and the lower end part of the base part 11 of the first connector terminal 10 across the casing 31. A spring member 24 is provided between the PCB 40 and the tip part of the lower arm part 22 of the second connector terminal 20 across the casing 31. By this structure, when a pressing force is applied to electric-contact parts 15, 25 via contact parts 16, 26 from a lock lever 33, biasing forces of the spring members 14, 24 suppress the occurrence of poor contact due to bending of the lower arm parts 12, 22 so as to balance a bending moment acting on an FPC 50. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在电连接可靠性高的同时进行减薄和减小尺寸的连接结构等。解决方案：连接结构30通过将第一连接器端子10和第二连接器端子20交替地并入壳体31中而构成。弹簧部件14设置在PCB 40与基部11的下端部之间第一连接器端子10穿过壳体31.弹簧构件24设置在PCB 40和第二连接器端子20的下臂部分22的顶端部分之间跨越壳体31。通过这种结构，当按压力通过接触部分16,26从锁定杆33施加到电接触部分15,25，弹簧构件14,24的偏置力抑制由于下臂部件12,22的弯曲而导致的接触不良的发生，从而以平衡作用在FPC 50上的弯矩。版权所有：（C）2009，JPO＆INPIT

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