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    • 5. 发明申请
    • CARBON NANOTUBE INTERCONNECT STRUCTURES
    • 碳纳米管互连结构
    • US20100022083A1
    • 2010-01-28
    • US12548779
    • 2009-08-27
    • Florian GstreinValery M. DubinJuan E. DominguezAdrien R. Lavoie
    • Florian GstreinValery M. DubinJuan E. DominguezAdrien R. Lavoie
    • H01L21/768
    • H01L21/76877H01L21/76838H01L23/53276H01L2221/1094H01L2924/0002Y10S977/742Y10S977/75H01L2924/00
    • A method including forming an interconnect of single-walled carbon nanotubes on a sacrificial substrate; transferring the interconnect from the sacrificial substrate to a circuit substrate; and coupling the interconnect to a contact point on the circuit substrate. A method including forming a nanotube bundle on a circuit substrate between a first contact point and a second contact point, the nanotube defining a lumen therethrough; filling a portion of a length of the lumen of the nanotube bundle with an electrically conductive material; and coupling the electrically conductive material to the second contact point. A system including a computing device comprising a microprocessor, the microprocessor coupled to a printed circuit board, the microprocessor including a substrate having a plurality of circuit devices with electrical connections made to the plurality of circuit devices through interconnect structures including carbon nanotube bundles.
    • 一种包括在牺牲衬底上形成单层碳纳米管的互连的方法; 将所述互连件从所述牺牲衬底转移到电路衬底; 以及将所述互连件耦合到所述电路基板上的接触点。 一种方法,包括在第一接触点和第二接触点之间的电路基板上形成纳米管束,所述纳米管限定通过其的腔; 用导电材料填充纳米管束管腔长度的一部分; 以及将所述导电材料耦合到所述第二接触点。 一种包括计算设备的系统,包括微处理器,微处理器耦合到印刷电路板,微处理器包括具有多个电路器件的衬底,该电路器件具有通过包括碳纳米管束的互连结构与多个电路器件形成的电连接。