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1. 发明授权

US09480186B2 Apparatus and method for facilitating air cooling of an electronics rack 有权
标题翻译：用于促进电子机架的空气冷却的装置和方法
公开(公告)号：US09480186B2
公开(公告)日：2016-10-25
申请号：US11958528
申请日：2007-12-18
申请人： Steven J. Ahladas , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber, Jr.
发明人： Steven J. Ahladas , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber, Jr.
IPC分类号： H05K5/00 , H05K7/20
CPC分类号： H05K7/20745 , H05K7/20736
摘要： Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly.
摘要翻译：提供了用于促进电子机架的空气冷却的装置和方法。该装置包括瓦片组件，温度传感器和控制器。瓦片组件邻近电子机架布置，并且包括穿孔瓦片和与穿孔瓦片相关联的一个或多个可控空气移动装置，用于使空气移动穿过穿孔瓦片。温度传感器被定位成用于感测电子机架附近或外部的空气温度，并且控制器耦合到瓦片组件和温度传感器，以控制空气移动装置的操作。基于感测的空气温度调节通过瓦片组件的气流，从而有助于电子机架的空气冷却。在一个实施例中，瓦片组件是地板砖组件，其中空气 - 液体热交换器设置在穿孔瓦片和空气移动装置之间，用于冷却通过地板瓦片组件的空气。

2. 发明授权

US07837352B2 Light source for illuminating an electronics rack to facilitate servicing thereof 有权
标题翻译：用于照亮电子机架以便于维修的光源
公开(公告)号：US07837352B2
公开(公告)日：2010-11-23
申请号：US11954272
申请日：2007-12-12
申请人： David P. Graybill , Madhusudan K. Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber
发明人： David P. Graybill , Madhusudan K. Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber
IPC分类号： F21S4/00
CPC分类号： H05K7/1488 , F21K9/00 , F21S4/20 , F21V21/30
摘要： An apparatus is provided for facilitating servicing of an electronics rack. The apparatus includes a light source, which includes a plurality of light-emitting diodes. The plurality of light-emitting diodes are secured to the electronics rack or a floor tile disposed adjacent to the electronics rack, and are configured to illuminate at least a lower portion of the electronics rack at either the air inlet or air outlet side of the rack. A power supply is also provided for selectively supplying power to the plurality of light-emitting diodes. In one implementation, the light source includes an elongate light bar, which is configured to mount to either the inlet door or outlet door of the electronics rack, and the plurality of light-emitting diodes are secured to an elongate housing structure which pivotally couples to a base plate for adjustment of a direction of illumination by the light-emitting diodes.
摘要翻译：提供了一种便于维护电子机架的装置。该装置包括一个包括多个发光二极管的光源。多个发光二极管被固定到电子机架或邻近电子机架设置的地板瓦片，并且被构造成在机架的空气入口或空气出口侧的至少一部分照明电子机架。还提供用于选择性地向多个发光二极管供电的电源。在一个实施方案中，光源包括细长的光条，其被配置为安装到电子机架的入口门或出口门，并且多个发光二极管被固定到细长的壳体结构，其被枢转地耦合到用于调节发光二极管的照明方向的基板。

3. 发明申请

US20130118353A1 SERVER RACK FRONT DOOR WITH CONTAMINATION FILTER AND SENSOR 有权
标题翻译：服务器机架前门带有污染过滤器和传感器
公开(公告)号：US20130118353A1
公开(公告)日：2013-05-16
申请号：US13295078
申请日：2011-11-13
申请人： Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh
发明人： Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh
IPC分类号： B01D46/42 , B01D46/00
CPC分类号： B01D46/10 , B01D46/103 , B01D2279/45
摘要： An apparatus, system, and method for preventing server contamination. The system includes a server rack and a contamination filter secured to the server rack. The contamination filter may be configured to filter particulate substances and/or chemical substances from air. The system may include a reaction coupon configured to indicate the presence of particulate substances and/or chemical substances in the air.
摘要翻译：一种用于防止服务器污染的设备，系统和方法。该系统包括一个服务器机架和一个固定在服务器机架上的污染过滤器。污染过滤器可以被配置为从空气中过滤颗粒物质和/或化学物质。该系统可以包括配置为指示空气中颗粒状物质和/或化学物质的存在的反应试剂。

4. 发明授权

US08591625B2 Server rack front door with contamination filter and sensor 有权
标题翻译：服务器机柜前门，带有污染过滤器和传感器
公开(公告)号：US08591625B2
公开(公告)日：2013-11-26
申请号：US13295078
申请日：2011-11-13
申请人： Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh
发明人： Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh
IPC分类号： B01D46/46
CPC分类号： B01D46/10 , B01D46/103 , B01D2279/45
摘要： An apparatus, system, and method for preventing server contamination. The system includes a server rack and a contamination filter secured to the server rack. The contamination filter may be configured to filter particulate substances and/or chemical substances from air. The system may include a reaction coupon configured to indicate the presence of particulate substances and/or chemical substances in the air.
摘要翻译：一种用于防止服务器污染的设备，系统和方法。该系统包括一个服务器机架和一个固定在服务器机架上的污染过滤器。污染过滤器可以被配置为从空气中过滤颗粒物质和/或化学物质。该系统可以包括配置为指示空气中颗粒状物质和/或化学物质的存在的反应试剂。

5. 发明授权

US07301770B2 Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins 失效
标题翻译：冷却装置，冷却电子模块及其制造方法采用导热的引线引脚散热片
公开(公告)号：US07301770B2
公开(公告)日：2007-11-27
申请号：US11009935
申请日：2004-12-10
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons , Prabjit Singh
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , F28F3/022 , H01L23/433 , H01L23/473 , H01L2224/78301 , H01L2924/10253 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The cooling apparatus includes a thermally conductive base having a substantially planar main surface, and a plurality of thermally conductive pin fins wire-bonded to the main surface of the thermally conductive base and disposed to facilitate the transfer of heat from the thermally conductive base. The thermally conductive base can be a portion of the electronic device to be cooled or a separate structure coupled to the electronic device to be cooled. If a separate structure, the thermally conductive base has a coefficient of thermal expansion within a defined range of a coefficient of thermal expansion of the electronic device. In one implementation, the wire-bonded pin fins are discrete, looped pin fins separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.
摘要翻译：提供冷却装置和制造方法以便于从发热电子装置中除去热量。冷却装置包括具有基本上平面的主表面的导热基体和与导热基体的主表面引线接合并设置成有助于从导热基底转移热量的多个导热销散热片。导热基座可以是要冷却的电子设备的一部分或者耦合到要冷却的电子设备的单独的结构。如果是单独的结构，导热基座的热膨胀系数在电子设备的热膨胀系数的规定范围内。在一个实施方式中，引线接合销散热片是离散的环形销散热片，其分开地引线键合到主表面，并且间隔小于300微米。

6. 发明授权

US08743545B2 Thermal expansion-enhanced heat sink for an electronic assembly 失效
标题翻译：用于电子组件的热膨胀增强型散热器
公开(公告)号：US08743545B2
公开(公告)日：2014-06-03
申请号：US13271268
申请日：2011-10-12
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
IPC分类号： H05K7/20 , G06F1/20 , H05K5/00
CPC分类号： H05K7/20 , H01L23/367 , H01L23/373 , H01L23/3736 , H01L23/4006 , H01L23/427 , H01L23/473 , H01L2023/4087 , H01L2224/16 , Y10T29/49002 , Y10T29/4935 , Y10T29/49353
摘要： A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.
摘要翻译：散热器和制造方法被提供用于从电子部件去除热量。散热器包括散热器底座和框架。基座具有第一热膨胀系数（CTE），并且包括配置成耦合到电子部件以便于去除热量的基面。框架具有第二CTE，并且被配置为以与电子部件相对的关系约束基面，其中第一CTE大于第二CTE。散热器基座或框架中的至少一个被构造成使得散热器基座的加热导致散热器基座的基面朝向电子部件的压缩力，其有助于从电子部件的热传递。热界面材料设置在基底表面和电子部件之间。

7. 发明授权

US08387249B2 Apparatus and method for facilitating servicing of a liquid-cooled electronics rack 失效
标题翻译：便于维修液冷电子机架的装置和方法
公开(公告)号：US08387249B2
公开(公告)日：2013-03-05
申请号：US11942221
申请日：2007-11-19
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Robert E. Simons , Prabjit Singh
IPC分类号： B21D53/02 , B23P6/00 , F28D15/00 , H01S4/00
CPC分类号： H05K7/20781 , Y10T29/49002 , Y10T29/4935 , Y10T29/49352 , Y10T29/49826
摘要： Apparatus and method for facilitating servicing of a liquid-cooled electronics rack are provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.
摘要翻译：提供了一种便于维护液冷电子机架的设备和方法。该装置包括冷却剂箱，与冷却剂箱流体连通的冷却剂泵，将冷却剂泵连接到设备的冷却剂供应端口的多个并联连接的冷却剂供应管线，以及冷却剂返回端口和冷却剂返回管线，冷却液返回口和冷却液箱。每个冷却剂供应管线包括冷却剂控制阀，用于选择性地控制由冷却剂泵从冷却剂箱泵送的冷却剂流。至少一个冷却剂供应管线包括至少一个过滤器，一个冷却剂供应管线是没有过滤器的旁路管路。当操作时，该装置通过允许选择性地过滤插入到冷却系统中的冷却剂，便于将冷却剂填充到液冷电子机架的冷却系统中。

8. 发明授权

US06684501B2 Foil heat sink and a method for fabricating same 失效
标题翻译：箔散热器及其制造方法
公开(公告)号：US06684501B2
公开(公告)日：2004-02-03
申请号：US10105698
申请日：2002-03-25
申请人： Michael J. Ellsworth, Jr. , Egidio Marotta , Budy D. Notohardjono , Roger R. Schmidt , Prabjit Singh
发明人： Michael J. Ellsworth, Jr. , Egidio Marotta , Budy D. Notohardjono , Roger R. Schmidt , Prabjit Singh
IPC分类号： H05K720
CPC分类号： F28F21/02 , F28F3/02 , H01L23/3672 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A design and method for fabricating a foil heat sink including a fin body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of heat sink fins are disposed in a parallel fashion so as to form a plurality of horizontal channels between the plurality of heat sink fins, a fin support, wherein the fin support includes a plurality of fin support structures disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin support structures are disposed adjacent to the fin head so as to form a plurality of vertical channels between the plurality of heat sink fins, and a fin base, wherein the fin base includes a plurality of fin spacers disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin spacers are disposed so as to be adjacent to the fin foot.
摘要翻译：一种用于制造包括翅片体的箔散热器的设计和方法，其中所述鳍体包括多个散热鳍片，散热鳍片具有翅片头和鳍脚，并且其中所述多个散热鳍片以平行方式设置，以在所述多个散热鳍片之间形成多个水平通道，翅片支撑件，其中所述翅片支撑件包括设置在所述多个散热鳍片之间的多个翅片支撑结构，以分离所述多个散热鳍片，并且其中所述多个翅片支撑结构设置成与所述翅片头相邻，以便在所述多个散热鳍片之间形成多个垂直通道，以及翅片基座，其中所述翅片基座包括多个翅片间隔件，散热翅片以分离多个散热鳍片，并且其中所述多个翅片间隔件设置成与鳍脚相邻。

9. 发明授权

US08245401B2 Casted heat sink and tube cold plate with peritectically reacted metals 有权
标题翻译：铸造的散热器和管冷板，具有包晶反应的金属
公开(公告)号：US08245401B2
公开(公告)日：2012-08-21
申请号：US12612905
申请日：2009-11-05
申请人： Bret W. Lehman , Roger R. Schmidt , Prabjit Singh
发明人： Bret W. Lehman , Roger R. Schmidt , Prabjit Singh
IPC分类号： B23P15/26
CPC分类号： H05K7/20254 , Y10T29/4935 , Y10T29/49359 , Y10T29/49364 , Y10T29/49368 , Y10T29/49369 , Y10T29/49373 , Y10T29/49377 , Y10T29/49393
摘要： A cold plate apparatus is provided which includes a tube and a casted heat sink member. The tube includes a first metal and first and second ends, with a heat transfer region disposed between the ends. The heat sink includes a second metal that surrounds the heat transfer region of the tube, with the first and second ends of the tube residing outside of the heat sink. The second metal has a lower melting point than the first, and the metals reacted peritectically such that a metallurgical bond exists between the tube and the heat sink. The metallurgical bond includes an alloy layer that was formed during casting of the heat sink member. A thickness of the alloy layer was minimized during casting of the heat sink member to enhance the heat transfer characteristic of the metallurgical bond.
摘要翻译：提供一种冷板装置，其包括管和铸造散热构件。管包括第一金属和第一和第二端，其中传热区域设置在端部之间。散热器包括围绕管的传热区域的第二金属，管的第一和第二端位于散热器的外部。第二金属具有比第一金属低的熔点，并且所述金属在周围进行反应，使得管和散热器之间存在冶金结合。冶金结合包括在散热构件的铸造期间形成的合金层。在散热构件的铸造期间合金层的厚度最小化，以增强冶金结合的传热特性。

10. 发明授权

US06233959B1 Dehumidified cooling assembly for IC chip modules 失效
标题翻译： IC芯片模块的除湿冷却组件
公开(公告)号：US06233959B1
公开(公告)日：2001-05-22
申请号：US09415732
申请日：1999-10-12
申请人： Sukhvinder Kang , Howard Victor Mahaney, Jr. , Roger R. Schmidt , Prabjit Singh
发明人： Sukhvinder Kang , Howard Victor Mahaney, Jr. , Roger R. Schmidt , Prabjit Singh
IPC分类号： F25D2312
CPC分类号： H01L23/445 , F25D19/00 , H01L2224/16
摘要： A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which is surrounded by an atmosphere of dehumidified air.
摘要翻译：一种用于集成电路芯片模块的冷却组件，其中蒸发器冷却的IC模块封装在由除湿空气的气氛包围的绝缘壳体内。

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