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1. 发明授权

US09480186B2 Apparatus and method for facilitating air cooling of an electronics rack 有权
标题翻译：用于促进电子机架的空气冷却的装置和方法
公开(公告)号：US09480186B2
公开(公告)日：2016-10-25
申请号：US11958528
申请日：2007-12-18
申请人： Steven J. Ahladas , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber, Jr.
发明人： Steven J. Ahladas , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber, Jr.
IPC分类号： H05K5/00 , H05K7/20
CPC分类号： H05K7/20745 , H05K7/20736
摘要： Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly.
摘要翻译：提供了用于促进电子机架的空气冷却的装置和方法。该装置包括瓦片组件，温度传感器和控制器。瓦片组件邻近电子机架布置，并且包括穿孔瓦片和与穿孔瓦片相关联的一个或多个可控空气移动装置，用于使空气移动穿过穿孔瓦片。温度传感器被定位成用于感测电子机架附近或外部的空气温度，并且控制器耦合到瓦片组件和温度传感器，以控制空气移动装置的操作。基于感测的空气温度调节通过瓦片组件的气流，从而有助于电子机架的空气冷却。在一个实施例中，瓦片组件是地板砖组件，其中空气 - 液体热交换器设置在穿孔瓦片和空气移动装置之间，用于冷却通过地板瓦片组件的空气。

2. 发明申请

US20130000736A1 ADJUSTABLE AND DIRECTIONAL FLOW PERFORATED TILES 审中-公开
标题翻译：可调和方向流动执行平台
公开(公告)号：US20130000736A1
公开(公告)日：2013-01-03
申请号：US13172765
申请日：2011-06-29
申请人： Patrick A. Coico , David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Roger R. Schmidt , Gerard V. Weber, JR.
发明人： Patrick A. Coico , David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Roger R. Schmidt , Gerard V. Weber, JR.
IPC分类号： F17D3/00
CPC分类号： H05K7/20836 , F17D3/00 , H05K7/20 , H05K7/20181 , H05K7/20745 , Y10T137/0324 , Y10T137/6851
摘要： An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile.
摘要翻译：用于控制到服务器机架的空气流的气流控制组件，系统和方法。示例性空气流量控制组件包括可缩回屏障，所述可伸缩屏障被配置为阻挡空气流，至少部分地阻止穿过穿孔的地板砖到服务器机架。空气流量控制组件还包括被配置为将可伸缩的屏障固定在穿孔地板砖附近的阻挡安装座。

3. 发明申请

US20110056675A1 APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) 审中-公开
标题翻译：通过液体冷却电子架（S）调节冷却剂流动阻力的装置和方法
公开(公告)号：US20110056675A1
公开(公告)日：2011-03-10
申请号：US12556040
申请日：2009-09-09
申请人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, JR.
发明人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, JR.
IPC分类号： G05D23/00 , F28F13/00
CPC分类号： H05K7/20709 , H05K7/20272 , H05K7/20281 , H05K7/20736 , H05K7/20763 , H05K7/2079
摘要： Apparatuses and methods are presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies.
摘要翻译：提出了通过一个或多个液冷电子机架来调节冷却剂流动阻力的装置和方法。流量限制器与热交换组件的多个热交换管部分相关联地使用，或者与供给多个热交换组件的多个冷却剂供应管线或冷却剂返回管路相关联地使用。与相应的热交换管部分（或相应的热交换组件）相关联的流量限制器设置在管部分（或热交换组件）的冷却剂通道入口或冷却剂通道出口处。这些流量限制器通过热交换管部分或通过热交换组件来调节冷却剂流动阻力，以通过调整冷却剂流量来增强管部分内部或通过热交换组件的整体热传递。在一个实施例中，流量限制器定制跨越多个热交换管部分或跨多个热交换组件的冷却剂流量分配差。

4. 发明授权

US09045995B2 Electronics rack with liquid-coolant-driven, electricity-generating system 有权
标题翻译：电子机架采用液冷驱动，发电系统
公开(公告)号：US09045995B2
公开(公告)日：2015-06-02
申请号：US13103233
申请日：2011-05-09
申请人： David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Donald W. Porter , Enrico A. Romano , Roger R. Schmidt , Gerard V. Weber, Jr.
发明人： David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Donald W. Porter , Enrico A. Romano , Roger R. Schmidt , Gerard V. Weber, Jr.
IPC分类号： F01D15/10 , F02C6/00 , H02K7/18 , H02P9/04 , F02B63/04 , F03G7/08 , F03B13/00 , F03B13/10 , F01D15/08
CPC分类号： F01D15/10 , F01D15/08 , F03B13/00
摘要： An electronics rack with a cooling apparatus and a liquid-coolant-driven, electricity-generating system. The generating system includes a housing coupled in fluid communication with a fluid transport pipe of the cooling apparatus, an impeller disposed within the housing and positioned to turn with flow of fluid across the impeller, one or more magnetic structures disposed to turn with turning of the impeller, and an electrical circuit. Electricity is generated for the electrical circuit with turning of the one or more magnetic structures, and is supplied to an electrical load disposed within or associated with the electronics rack.
摘要翻译：具有冷却装置和液体冷却剂驱动的发电系统的电子机架。所述发电系统包括与所述冷却装置的流体输送管道流体连通的壳体，设置在所述壳体内并且被定位成随着流过所述叶轮的流体而转动的叶轮，一个或多个磁性结构，叶轮和电路。通过一个或多个磁性结构的转动为电路产生电，并且被提供给设置在电子机架中或与电子机架相关联的电负载。

5. 发明授权

US08077462B2 Stress relieved hose routing to liquid-cooled electronics rack door 失效
标题翻译：减轻软管布置到液冷电子机柜门
公开(公告)号：US08077462B2
公开(公告)日：2011-12-13
申请号：US12552479
申请日：2009-09-02
申请人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, Jr.
发明人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, Jr.
IPC分类号： H05K7/20
CPC分类号： H05K7/20781 , H05K7/2079 , H05K7/20818 , Y10T29/4935
摘要： A cooling apparatus and method are provided which include an air-to-liquid heat exchanger and system coolant inlet and outlet plenums mounted to an electronics rack door along an edge of the door remote from the edge hingedly mounted to the rack. The plenums are in fluid communication with the heat exchanger and respectively include an inlet and outlet. Coolant supply and return hoses are disposed above the electronics rack and couple the inlet plenum to a coolant supply header and the outlet plenum to a coolant return header. The hoses are sufficiently long and flexible to open or close the door. A stress relief structure is attached to the top of the door and clamps the supply and return hoses in fixed relation to relieve stress on connect couplings at the ends of the hoses to the plenum inlet and outlet during opening or closing of the door.
摘要翻译：提供了一种冷却装置和方法，其包括空气 - 液体热交换器和系统冷却剂入口和出口集气室，其沿着门的边缘安装到电子机架门，远离铰接安装到机架的边缘。增压室与热交换器流体连通，分别包括入口和出口。冷却剂供应和返回软管设置在电子机架上方，并将进气室连接到冷却剂供应集管，并将出口压力室连接到冷却剂返回集管。软管足够长且灵活以打开或关闭门。应力消除结构连接到门的顶部，并且固定地夹紧供应和返回软管，以在门的打开或关闭期间将软管端部处的连接联接器上的压力释放到通风口入口和出口。

6. 发明申请

US20110036540A1 ENVIRONMENTAL CONDITIONING SYSTEM FOR A COMPUTER ROOM 审中-公开
标题翻译：计算机室环境调节系统
公开(公告)号：US20110036540A1
公开(公告)日：2011-02-17
申请号：US12540485
申请日：2009-08-13
申请人： Steven J. Ahladas , David P. Graybill , Donald W. Porter , Roger R. Schmidt , Gerard V. Weber, JR.
发明人： Steven J. Ahladas , David P. Graybill , Donald W. Porter , Roger R. Schmidt , Gerard V. Weber, JR.
IPC分类号： F24H9/06 , F28D15/00
CPC分类号： H05K7/20836 , F24F2221/40 , F28D1/024 , F28D1/0477 , H05K7/20745
摘要： An environmental conditioning system for a computer room includes a perforated tile, a heat exchanger mounted to the perforated tile, and a forced air system mounted to the heat exchanger. The forced air system being configured and disposed to direct a flow of air having a first temperature into the heat exchanger. The flow of air exits the heat exchanger at a second temperature and passes through the perforated tile into the computer room. The second temperature is distinct from the first temperature.
摘要翻译：用于计算机室的环境调节系统包括穿孔瓦片，安装到穿孔瓦片上的热交换器和安装到热交换器的强制空气系统。强制空气系统被构造和设置成将具有第一温度的空气流引导到热交换器中。空气流在第二温度下离开热交换器，并穿过穿孔的瓦片进入计算机室。第二个温度与第一个温度不同。

7. 发明授权

US07837352B2 Light source for illuminating an electronics rack to facilitate servicing thereof 有权
标题翻译：用于照亮电子机架以便于维修的光源
公开(公告)号：US07837352B2
公开(公告)日：2010-11-23
申请号：US11954272
申请日：2007-12-12
申请人： David P. Graybill , Madhusudan K. Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber
发明人： David P. Graybill , Madhusudan K. Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber
IPC分类号： F21S4/00
CPC分类号： H05K7/1488 , F21K9/00 , F21S4/20 , F21V21/30
摘要： An apparatus is provided for facilitating servicing of an electronics rack. The apparatus includes a light source, which includes a plurality of light-emitting diodes. The plurality of light-emitting diodes are secured to the electronics rack or a floor tile disposed adjacent to the electronics rack, and are configured to illuminate at least a lower portion of the electronics rack at either the air inlet or air outlet side of the rack. A power supply is also provided for selectively supplying power to the plurality of light-emitting diodes. In one implementation, the light source includes an elongate light bar, which is configured to mount to either the inlet door or outlet door of the electronics rack, and the plurality of light-emitting diodes are secured to an elongate housing structure which pivotally couples to a base plate for adjustment of a direction of illumination by the light-emitting diodes.
摘要翻译：提供了一种便于维护电子机架的装置。该装置包括一个包括多个发光二极管的光源。多个发光二极管被固定到电子机架或邻近电子机架设置的地板瓦片，并且被构造成在机架的空气入口或空气出口侧的至少一部分照明电子机架。还提供用于选择性地向多个发光二极管供电的电源。在一个实施方案中，光源包括细长的光条，其被配置为安装到电子机架的入口门或出口门，并且多个发光二极管被固定到细长的壳体结构，其被枢转地耦合到用于调节发光二极管的照明方向的基板。

8. 发明授权

US08649177B2 Method of fabricating a cooled electronic system 失效
标题翻译：冷却电子系统的制造方法
公开(公告)号：US08649177B2
公开(公告)日：2014-02-11
申请号：US13451714
申请日：2012-04-20
申请人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
发明人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781 , H05K7/2079
摘要： A method of fabricating a liquid-cooled electronic system is provided which includes an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket. The method includes providing a liquid-cooled cold rail at the one end of the socket, and a thermal spreader to couple the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
摘要翻译：提供一种制造液冷电子系统的方法，其包括具有电子卡的电子组件和在一端具有闩锁的插座。闩锁有助于将卡固定在插座内。该方法包括在插座的一端提供液冷冷轨，以及将电子卡耦合到冷轨的散热器。热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。延伸件设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除，而不移除冷轨或散热器。

9. 发明授权

US08913384B2 Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) 有权
标题翻译：将电子卡耦合到冷却剂冷却结构的热转印结构
公开(公告)号：US08913384B2
公开(公告)日：2014-12-16
申请号：US13527947
申请日：2012-06-20
申请人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
发明人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H05K7/20 , H05K13/00
CPC分类号： H05K7/20745 , H05K7/2079 , H05K13/00
摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
摘要翻译：提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面卡到散热器的第一表面，使电子卡在电子系统的插座内对接。在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

10. 发明授权

US09307674B2 Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component 有权
公开(公告)号：US09307674B2
公开(公告)日：2016-04-05
申请号：US13102200
申请日：2011-05-06
申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H01L23/427 , H01L23/473 , H05K7/20 , F28D15/02
CPC分类号： H05K7/20336 , F28D15/02 , H05K7/20509 , H05K7/20772 , H05K7/20936
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

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