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    • 1. 发明授权
    • Apparatus and method for facilitating air cooling of an electronics rack
    • 用于促进电子机架的空气冷却的装置和方法
    • US09480186B2
    • 2016-10-25
    • US11958528
    • 2007-12-18
    • Steven J. AhladasDavid P. GraybillMadhusudan K. IyengarRoger R. SchmidtPrabjit SinghGerard V. Weber, Jr.
    • Steven J. AhladasDavid P. GraybillMadhusudan K. IyengarRoger R. SchmidtPrabjit SinghGerard V. Weber, Jr.
    • H05K5/00H05K7/20
    • H05K7/20745H05K7/20736
    • Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly.
    • 提供了用于促进电子机架的空气冷却的装置和方法。 该装置包括瓦片组件,温度传感器和控制器。 瓦片组件邻近电子机架布置,并且包括穿孔瓦片和与穿孔瓦片相关联的一个或多个可控空气移动装置,用于使空气移动穿过穿孔瓦片。 温度传感器被定位成用于感测电子机架附近或外部的空气温度,并且控制器耦合到瓦片组件和温度传感器,以控制空气移动装置的操作。 基于感测的空气温度调节通过瓦片组件的气流,从而有助于电子机架的空气冷却。 在一个实施例中,瓦片组件是地板砖组件,其中空气 - 液体热交换器设置在穿孔瓦片和空气移动装置之间,用于冷却通过地板瓦片组件的空气。
    • 4. 发明授权
    • Latent thermal vaporization reduction
    • 潜热蒸发减少
    • US6108164A
    • 2000-08-22
    • US154975
    • 1998-09-17
    • Gerard V. Weber, Jr.
    • Gerard V. Weber, Jr.
    • G11B33/14
    • G11B33/1453G11B33/1446
    • A direct access storage device comprises a frame, a rotating magnetic storage structure positioned within the frame generating air flow within the frame, at least one head writing and reading to and from the rotating storage structure, thermally insulating spacers connected to the frame, a condensation plate connected to the thermally insulating spacers and positioned within the frame, a thermal core connected to the condensation plate and extending through the frame, a heat sink connected to the thermal core and positioned outside the frame and an air ram for directing the air flow toward the condensation plate, wherein the condensation plate, the thermal core and the heat sink are thermally insulated from the frame.
    • 直接存取存储装置包括:框架,位于框架内的旋转磁存储结构,产生框架内的空气流,至少一个写入和读取旋转存储结构的头部,连接到框架的隔热间隔件,冷凝 连接到隔热间隔件并且定位在框架内的热芯,连接到冷凝板并延伸穿过框架的热芯,连接到热芯并位于框架外部的散热器和用于将空气流引向 冷凝板,其中冷凝板,热芯和散热器与框架热绝缘。