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    • 1. 发明授权
    • Adaptive vibration control for servo systems in data storage devices
    • 数据存储设备伺服系统的自适应振动控制
    • US06549349B2
    • 2003-04-15
    • US09955391
    • 2001-09-18
    • Sri Muthuthamby Sri-JayanthaArun SharmaHien Phu DangNaoyuki KagamiYuzo NakagawaAkira TokizonoIsao Yoneda
    • Sri Muthuthamby Sri-JayanthaArun SharmaHien Phu DangNaoyuki KagamiYuzo NakagawaAkira TokizonoIsao Yoneda
    • G11B2736
    • G11B21/106G11B5/59611
    • Methods and systems for detecting and correcting for undesirable vibrations impacting the servo systems in data storage devices. A detection technique is provided wherein a detection filter is configured to scan a position signal of the servo system across a range of frequencies, and, at each respective scanned frequency, record an amplitude associated therewith. The recorded amplitudes are examined to determine whether any exceed a threshold, thereby locating a peak frequency of the vibration. Using the detected peak frequency of the vibration, a corrective filter is configured to operate about the peak frequency of vibration, thereby reducing its impact on the position signal in the servo system. Optimum detection and correction filter structures are disclosed, as are techniques for addressing filter state vectors as initial conditions as the corrective filters are repeatedly engaged during successive settle-out and track follow cycles (between seeks), as are continuous adaptation techniques for changing vibration environments.
    • 用于检测和校正影响数据存储设备中的伺服系统的不期望的振动的方法和系统。 提供了一种检测技术,其中检测滤波器被配置为扫描频率范围内的伺服系统的位置信号,并且在每个相应的扫描频率处记录与之相关联的振幅。 检查记录的振幅以确定是否有超过阈值,从而定位振动的峰值频率。 使用检测到的振动峰值频率,校正滤波器被配置为围绕振动的峰值频率运行,从而减小其对伺服系统中位置信号的影响。 公开了最佳检测和校正滤波器结构,作为用于将滤波器状态向量寻址作为初始条件的技术,校正滤波器在连续的稳定和跟踪周期(寻找之间)期间重复接合),以及用于改变振动环境的连续自适应技术 。
    • 6. 发明申请
    • Method to Extract and Apply Circuit Features in Organic Substrate for Automation of Warp Modeling
    • 在有机基板中提取和应用电路特征的方法,用于自动化变形建模
    • US20090313588A1
    • 2009-12-17
    • US12260957
    • 2008-10-29
    • Hien Phu DangVijayeshwar Das KhannaArun SharmaSri M. Sri-Jayantha
    • Hien Phu DangVijayeshwar Das KhannaArun SharmaSri M. Sri-Jayantha
    • G06F17/50
    • H05K3/0005H05K1/0271H05K2201/09136
    • A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images.
    • 提供了表征包括多个电路层的有机衬底的方法包括以下步骤:接收有机衬底的图像,该图像包括衬底的电路层的几何描述; 至少部分地基于在衬底的图像中限定的电路结构的几何坐标将衬底分割成多个处理区域; 生成与所述基板的所述选择的一个所述处理区域对应的电路层图像; 识别电路层图像中的一个或多个几何特征; 估计电路层图像的至少一个热机械性质作为所识别的几何特征的函数; 重复接收图像的步骤,生成电路层图像,识别电路层图像中的一个或多个几何特征,以及估计电路层图像的至少一个热机械特性,直到已经处理了基板中的所有电路层; 以及根据所述多个电路层图像中的每一个的所述至少一个热机械特性,生成包括所述多个电路层图像的所述基板的所选择的一个处理区域的3-D表示。
    • 8. 发明授权
    • Method to extract and apply circuit features in organic substrate for automation of warp modeling
    • 提取和应用电路特征的方法,用于有机衬底自动化的翘曲建模
    • US08127255B2
    • 2012-02-28
    • US12260957
    • 2008-10-29
    • Hien Phu DangVijayeshwar Das KhannaArun SharmaSri M. Sri-Jayantha
    • Hien Phu DangVijayeshwar Das KhannaArun SharmaSri M. Sri-Jayantha
    • G06F17/50
    • H05K3/0005H05K1/0271H05K2201/09136
    • A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images.
    • 提供了表征包括多个电路层的有机衬底的方法包括以下步骤:接收有机衬底的图像,该图像包括衬底的电路层的几何描述; 至少部分地基于在衬底的图像中限定的电路结构的几何坐标将衬底分割成多个处理区域; 生成与所述基板的所述选择的一个所述处理区域对应的电路层图像; 识别电路层图像中的一个或多个几何特征; 估计电路层图像的至少一个热机械性质作为所识别的几何特征的函数; 重复接收图像的步骤,生成电路层图像,识别电路层图像中的一个或多个几何特征,以及估计电路层图像的至少一个热机械特性,直到已经处理了基板中的所有电路层; 以及根据所述多个电路层图像中的每一个的所述至少一个热机械特性,生成包括所述多个电路层图像的所述基板的所选择的一个处理区域的3-D表示。
    • 9. 发明申请
    • Characterizing Thermomechanical Properties of an Organic Substrate Using Finite Element Analysis
    • 使用有限元分析表征有机基板的热机械性能
    • US20090310848A1
    • 2009-12-17
    • US12260693
    • 2008-10-29
    • Hien Phu DangArun SharmaSri M. Sri-Jayantha
    • Hien Phu DangArun SharmaSri M. Sri-Jayantha
    • G06K9/00
    • G06F17/5018G06F2217/80
    • A method for characterizing thermomechanical properties of an organic substrate is provided. The method includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the plurality of circuit layers of the substrate; selecting a given one of the plurality of circuit layers for processing; converting the image to a two-dimensional finite element model (FEM) image of the given one of the circuit layers; determining at least one of a coefficient of thermal expansion (CTE), modulus and Poisson's ratio of the FEM image of the given one of the circuit layers; repeating the steps of selecting a given one of the plurality of circuit layers, converting the image to a two-dimensional FEM image, and determining at least one of a CTE, modulus and Poisson's ratio of the FEM image for all of the plurality of circuit layers corresponding to at least a portion of the organic substrate; and constructing a three-dimensional representation of at least a portion of the organic substrate including the plurality of circuit layers as a function of at least one of the CTE, modulus and Poisson's ratio of each of the plurality of circuit layers.
    • 提供了表征有机基板的热机械性能的方法。 该方法包括以下步骤:接收有机衬底的图像,该图像包括衬底的多个电路层的几何描述; 选择所述多个电路层中的给定一个以进行处理; 将图像转换成给定的一个电路层的二维有限元模型(FEM)图像; 确定给定一个电路层的FEM图像的热膨胀系数(CTE),模数和泊松比中的至少一个; 重复选择多个电路层中的给定的一个电路层的步骤,将图像转换为二维有机图像,以及确定所有多个电路中的有限元图像的CTE,模数和泊松比中的至少一个 对应于有机基材的至少一部分的层; 以及构成包括所述多个电路层的所述有机衬底的至少一部分的三维表示作为所述多个电路层中的每一个的CTE,模数和泊松比中的至少一个的函数。
    • 10. 发明授权
    • Characterizing thermomechanical properties of an organic substrate using finite element analysis
    • 使用有限元分析表征有机基质的热机械性能
    • US08345955B2
    • 2013-01-01
    • US12260693
    • 2008-10-29
    • Hien Phu DangArun SharmaSri M. Sri-Jayantha
    • Hien Phu DangArun SharmaSri M. Sri-Jayantha
    • G06K9/00
    • G06F17/5018G06F2217/80
    • A method for characterizing thermomechanical properties of an organic substrate is provided. The method includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the plurality of circuit layers of the substrate; selecting a given one of the plurality of circuit layers for processing; converting the image to a two-dimensional finite element model (FEM) image of the given one of the circuit layers; determining at least one of a coefficient of thermal expansion (CTE), modulus and Poisson's ratio of the FEM image of the given one of the circuit layers; repeating the steps of selecting a given one of the plurality of circuit layers, converting the image to a two-dimensional FEM image, and determining at least one of a CTE, modulus and Poisson's ratio of the FEM image for all of the plurality of circuit layers corresponding to at least a portion of the organic substrate; and constructing a three-dimensional representation of at least a portion of the organic substrate including the plurality of circuit layers as a function of at least one of the CTE, modulus and Poisson's ratio of each of the plurality of circuit layers.
    • 提供了表征有机基板的热机械性能的方法。 该方法包括以下步骤:接收有机衬底的图像,该图像包括衬底的多个电路层的几何描述; 选择所述多个电路层中的给定一个以进行处理; 将图像转换成给定的一个电路层的二维有限元模型(FEM)图像; 确定给定一个电路层的FEM图像的热膨胀系数(CTE),模数和泊松比中的至少一个; 重复选择多个电路层中的给定的一个电路层的步骤,将图像转换为二维有机图像,以及确定所有多个电路中的有限元图像的CTE,模数和泊松比中的至少一个 对应于有机基材的至少一部分的层; 以及构成包括所述多个电路层的所述有机衬底的至少一部分的三维表示作为所述多个电路层中的每一个的CTE,模数和泊松比中的至少一个的函数。