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1. 发明专利

JP2006165132A Method of manufacturing multilayer wiring board 审中-公开
标题翻译：制造多层接线板的方法
公开(公告)号：JP2006165132A
公开(公告)日：2006-06-22
申请号：JP2004352059
申请日：2004-12-03
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： SHIMIZU KAZUHIRO , YAGI MASANOBU , HANAMURA KENICHIRO , TAKAYASU MITSUYUKI , NAGAI KIYOE
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To enable manufacturing a multilayer wiring board having dimension stability which will not cause wrinkle or unevenness by preventing a product, after molding (copper foil cladding) from adhering to a stainless plate.
SOLUTION: A method of manufacturing the multilayer wiring board has a process of forming an insulating layer 5 on a base on which bumps 4 for interlayer connection are formed, a process of sandwiching the base with stainless plates 22 and thermocompression-bonding the copper foil 3 onto the insulating layer 5, and a process of patterning the copper foil 3. In thermocompression bonding of the copper foil, a release layer is formed on at least the each of surface of the stainless plates 22, where the stainless plate 22 faces the copper foil 3. The release layer is formed of a composite plating layer etc., such as a composite layer of nickel and tungsten.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了制造具有尺寸稳定性的多层布线板，其在模制（铜箔包层）粘附到不锈钢板上之后，通过防止产品不会引起褶皱或不均匀。解决方案：制造多层布线板的方法具有在基底上形成绝缘层5的工艺，其上形成有用于层间连接的凸块4，将不锈钢板22夹住基底并热压粘合铜箔3到绝缘层5上，以及图案化铜箔3的工艺。在铜箔的热压接中，至少在不锈钢板22的表面上形成剥离层，其中不锈钢板22 面对铜箔3.剥离层由复合镀层等形成，例如镍和钨的复合层。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006165131A Manufacturing method of multilayer wiring substrate 审中-公开
标题翻译：多层布线基板的制造方法
公开(公告)号：JP2006165131A
公开(公告)日：2006-06-22
申请号：JP2004352058
申请日：2004-12-03
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： YAGI MASANOBU , SHIMIZU KAZUHIRO , TAKAYASU MITSUYUKI , NAGAI KIYOE , KOBAYASHI KAZUYOSHI , TANIGUCHI MASATO , OMORI YOSHIO
IPC分类号： H05K3/46 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To enable manufacture of a multilayer wiring substrate that is superior in reliability, without careless short circuiting or the like.
SOLUTION: The manufacturing method of a multilayer wiring substrate comprises a bump forming process of forming bumps for interlayer connection on a substrate, an insulating layer formation process of forming an insulating layer on the substrate, wherein the bumps are formed, a thermocompression bonding process for bonding copper foil by thermocompression on an insulating layer, and a patterning process of patterning copper foil. In the bump formation process, there are formed dummy bumps which have do not participate in interlayer connection, in addition to the bump for interlayer connection. The dummy bumps are formed in the discarded substrate regions which are separated and removed from a product the substrate region, or are formed in product substrate regions. Information indication function may be given to a dummy bump group.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了能够制造可靠性优异的多层布线基板，不需要短暂的短路等。解决方案：多层布线基板的制造方法包括在基板上形成用于层间连接的凸块的凸块形成工艺，在基板上形成绝缘层的绝缘层形成工艺，其中形成凸块，热压缩通过热绝缘层将铜箔接合的接合工艺以及铜箔图形化工艺。除了用于层间连接的凸块之外，在凸块形成工艺中还形成了不参与层间连接的虚设凸块。在从衬底区域的产品中分离出去除或形成在产品衬底区域中的废弃衬底区域中形成虚设凸块。信息指示功能可以被提供给虚拟凸块组。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2004282487A Antenna element and its manufacturing method 审中-公开
公开(公告)号：JP2004282487A
公开(公告)日：2004-10-07
申请号：JP2003072206
申请日：2003-03-17
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： FUJII YOSHITO , TANAKA HIDEO , KOMATSU NOBUO , NAGAI KIYOE , SOGA TOSHIO , HASEGAWA HIROSHI
IPC分类号： H01Q1/40 , H01Q1/38
摘要： PROBLEM TO BE SOLVED: To provide an antenna element that has characteristics comparable to a mold-type chip antenna or a ceramic antenna, and is manufactured with a high productivity and at low costs.
SOLUTION: A printed board where an antenna pattern is formed is the core of the antenna element. One or more high dielectric constant layers are piled on both sides of the board and antenna terminals are formed. The antenna terminals are electrically connected with the antenna pattern on the surface of the high dielectric constant layers. An antenna pattern can be formed using a printed board process, and a highly reliable antenna pattern can be formed with a high productivity and at low costs. A high dielectric constant is secured by piling high dielectric constant layers such as high dielectric constant resin sheets, thereby realizing characteristics comparable to a mold-type chip antenna or a ceramic antenna.
COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2006165133A Method of manufacturing multilayer wiring board 有权
标题翻译：制造多层接线板的方法
公开(公告)号：JP2006165133A
公开(公告)日：2006-06-22
申请号：JP2004352060
申请日：2004-12-03
申请人： North:Kk , Sony Chem Corp , ソニーケミカル株式会社 , 株式会社ノース
发明人： SHIMIZU KAZUHIRO , YAGI MASANOBU , HANAMURA KENICHIRO , TAKAYASU MITSUYUKI , NAGAI KIYOE , IIJIMA ASAO
IPC分类号： H05K3/46
CPC分类号： H05K3/4038 , B32B37/26 , B32B2457/08 , H05K3/022 , H05K3/06 , H05K3/4647 , H05K2201/0355 , H05K2203/0384 , H05K2203/0733 , H05K2203/1461 , Y10T29/49128 , Y10T29/49156 , Y10T29/49163
摘要： PROBLEM TO BE SOLVED: To enable manufacturing a multilayer wiring board having dimensional stability which will not cause wrinkles or unevenness, by preventing a product after molding (copper foil cladding) from adhering to a stainless steel plate. SOLUTION: This method has a process of forming an insulating layer on a base on which bumps for interlayer connection are formed, a process of sandwiching the base with stainless plates to thermocompression-bond a copper foil onto the insulating layer, and a process of patterning the copper foil. In thermocompression-bonding the copper foil, at least a metal foil is provided between the stainless plates and the copper foil. At this time, a release layer is formed on the surface of the metal foil to be provided. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过防止成型后的产品（铜箔包覆）粘附到不锈钢板上，能够制造具有不会引起褶皱或不均匀的尺寸稳定性的多层布线板。解决方案：该方法具有在基底上形成绝缘层的工艺，在其上形成用于层间连接的凸块，将不锈钢板夹住基底以将铜箔热压粘合到绝缘层上的工艺，以及图案化铜箔的工艺。在铜箔的热压接中，在不锈钢板和铜箔之间设置至少一个金属箔。此时，在要设置的金属箔的表面上形成剥离层。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006165130A Multilayer wiring board and manufacturing method thereof 有权
标题翻译：多层接线板及其制造方法
公开(公告)号：JP2006165130A
公开(公告)日：2006-06-22
申请号：JP2004352057
申请日：2004-12-03
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： SHIMIZU KAZUHIRO , TAKAYASU MITSUYUKI , NAGAI KIYOE
IPC分类号： H05K3/46 , H05K1/09 , H05K3/40
CPC分类号： H05K3/4038 , H05K3/06 , H05K3/385 , H05K3/4647 , H05K3/4652 , H05K2201/0355 , H05K2203/0315 , H05K2203/0733 , H05K2203/1189 , Y10T29/49155 , Y10T29/49156 , Y10T29/49162
摘要： PROBLEM TO BE SOLVED: To fully ensure electrical connection reliability between a copper foil and bumps, and to sufficiently ensure mechanical connection reliability between the copper foil and an insulating layer. SOLUTION: A multilayer wiring board is formed in such a way that the copper foil is thermo-compression-bonded on the insulating layer in which the bumps for interlayer connection are embedded, and the copper foil and the bumps are connected electrically. In the copper foil, an oxide film having a thickness range of 50 Å-350 Å is formed on a surface, contacting the bumps and the insulating layer. In manufacturing, for example, after an oxide coating of the copper foil to be thermocompression-bonded by acid cleaning is removed, ultraviolet ray is irradiated and an oxide film having a proper thickness is formed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：充分确保铜箔和凸点之间的电连接可靠性，并充分确保铜箔和绝缘层之间的机械连接可靠性。解决方案：多层布线板以这样的方式形成，即铜箔被热压接在其上嵌入有用于层间连接的凸块的绝缘层上，并且铜箔和凸块电连接。在铜箔中，在与凸块和绝缘层接触的表面上形成厚度范围为50埃的氧化膜。在制造时，例如，在通过酸洗清洗热压接铜箔的氧化物被覆后，照射紫外线，形成适当厚度的氧化膜。版权所有（C）2006，JPO＆NCIPI

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