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1. 发明专利

JP2006216474A Wiring body, electronic apparatus, manufacturing method of wiring body and manufacturing method of electronic apparatus 审中-公开
标题翻译：接线体，电子设备，接线体的制造方法及电子设备的制造方法
公开(公告)号：JP2006216474A
公开(公告)日：2006-08-17
申请号：JP2005030026
申请日：2005-02-07
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： UENO YOSHIFUMI
IPC分类号： H01B5/02 , H01B13/00
摘要： PROBLEM TO BE SOLVED: To provide a new wiring body and its manufacturing method.
SOLUTION: This manufacturing method of the wiring body has a process for changing a surface of the wiring body to predetermined surface roughness. A laser beam is intermittently radiated to a surface of a plated composition layer while moving it. The output of the laser beam is in the range of 1-10 W. The spot diameter of the laser beam is in the range of 30-100 μm. The overlapping rate of the spot of the laser beam is in the range of 30-95%. The wiring body has the plated composition layer, and the arithmetic average roughness Ra of the surface roughness thereof is in the range of 0.1-0.5 μm. The plated composition layer contains elemental tin or a mixture of any kind or any combination selected from copper, bismuth and silver and tin. The height difference of the surface roughness is in the range of 0.3-1.5 μm. The thickness of the plated composition layer is not greater than 0.5 μm.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种新的布线体及其制造方法。解决方案：该布线体的制造方法具有将配线体的表面改变为规定的表面粗糙度的工序。激光束在移动时间歇地照射到镀层组合物层的表面。激光束的输出范围为1-10W。激光束的光点直径在30-100μm的范围内。激光束点的重叠率在30-95％的范围内。布线体具有电镀组合物层，其表面粗糙度的算术平均粗糙度Ra在0.1-0.5μm的范围内。镀组合物层含有元素锡或任何种类的混合物，或选自铜，铋和银和锡的任何组合。表面粗糙度的高差在0.3〜1.5μm的范围内。镀层组合物层的厚度不大于0.5μm。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2006165133A Method of manufacturing multilayer wiring board 有权
标题翻译：制造多层接线板的方法
公开(公告)号：JP2006165133A
公开(公告)日：2006-06-22
申请号：JP2004352060
申请日：2004-12-03
申请人： North:Kk , Sony Chem Corp , ソニーケミカル株式会社 , 株式会社ノース
发明人： SHIMIZU KAZUHIRO , YAGI MASANOBU , HANAMURA KENICHIRO , TAKAYASU MITSUYUKI , NAGAI KIYOE , IIJIMA ASAO
IPC分类号： H05K3/46
CPC分类号： H05K3/4038 , B32B37/26 , B32B2457/08 , H05K3/022 , H05K3/06 , H05K3/4647 , H05K2201/0355 , H05K2203/0384 , H05K2203/0733 , H05K2203/1461 , Y10T29/49128 , Y10T29/49156 , Y10T29/49163
摘要： PROBLEM TO BE SOLVED: To enable manufacturing a multilayer wiring board having dimensional stability which will not cause wrinkles or unevenness, by preventing a product after molding (copper foil cladding) from adhering to a stainless steel plate. SOLUTION: This method has a process of forming an insulating layer on a base on which bumps for interlayer connection are formed, a process of sandwiching the base with stainless plates to thermocompression-bond a copper foil onto the insulating layer, and a process of patterning the copper foil. In thermocompression-bonding the copper foil, at least a metal foil is provided between the stainless plates and the copper foil. At this time, a release layer is formed on the surface of the metal foil to be provided. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过防止成型后的产品（铜箔包覆）粘附到不锈钢板上，能够制造具有不会引起褶皱或不均匀的尺寸稳定性的多层布线板。解决方案：该方法具有在基底上形成绝缘层的工艺，在其上形成用于层间连接的凸块，将不锈钢板夹住基底以将铜箔热压粘合到绝缘层上的工艺，以及图案化铜箔的工艺。在铜箔的热压接中，在不锈钢板和铜箔之间设置至少一个金属箔。此时，在要设置的金属箔的表面上形成剥离层。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2006165130A Multilayer wiring board and manufacturing method thereof 有权
标题翻译：多层接线板及其制造方法
公开(公告)号：JP2006165130A
公开(公告)日：2006-06-22
申请号：JP2004352057
申请日：2004-12-03
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： SHIMIZU KAZUHIRO , TAKAYASU MITSUYUKI , NAGAI KIYOE
IPC分类号： H05K3/46 , H05K1/09 , H05K3/40
CPC分类号： H05K3/4038 , H05K3/06 , H05K3/385 , H05K3/4647 , H05K3/4652 , H05K2201/0355 , H05K2203/0315 , H05K2203/0733 , H05K2203/1189 , Y10T29/49155 , Y10T29/49156 , Y10T29/49162
摘要： PROBLEM TO BE SOLVED: To fully ensure electrical connection reliability between a copper foil and bumps, and to sufficiently ensure mechanical connection reliability between the copper foil and an insulating layer. SOLUTION: A multilayer wiring board is formed in such a way that the copper foil is thermo-compression-bonded on the insulating layer in which the bumps for interlayer connection are embedded, and the copper foil and the bumps are connected electrically. In the copper foil, an oxide film having a thickness range of 50 Å-350 Å is formed on a surface, contacting the bumps and the insulating layer. In manufacturing, for example, after an oxide coating of the copper foil to be thermocompression-bonded by acid cleaning is removed, ultraviolet ray is irradiated and an oxide film having a proper thickness is formed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：充分确保铜箔和凸点之间的电连接可靠性，并充分确保铜箔和绝缘层之间的机械连接可靠性。解决方案：多层布线板以这样的方式形成，即铜箔被热压接在其上嵌入有用于层间连接的凸块的绝缘层上，并且铜箔和凸块电连接。在铜箔中，在与凸块和绝缘层接触的表面上形成厚度范围为50埃的氧化膜。在制造时，例如，在通过酸洗清洗热压接铜箔的氧化物被覆后，照射紫外线，形成适当厚度的氧化膜。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2006086153A Flexible wiring board and its manufacturing method 审中-公开
标题翻译：柔性接线板及其制造方法
公开(公告)号：JP2006086153A
公开(公告)日：2006-03-30
申请号：JP2004266338
申请日：2004-09-14
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： MURANAKA HIDENOBU , YASUDA SHUICHIRO
IPC分类号： H05K1/02 , H05K3/06 , H05K3/20 , H05K3/28 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To manufacture a flexible wiring board which is provided with a highly accurate projection. SOLUTION: In the flexible wiring board 1a, a base film 11 is deformed together with a wiring film 15, and a projection 18 is formed in the wiring film 15. At the same time, a recess 17 is formed at the rear position of the projection 18 of the base film 11. A resin material 22 is arranged within the recess 17, of which space is made small. Thus, even if any load is applied to the projection 18 when an electric part 4 is connected to the flexible wiring board 1a, the flexible wiring board 1a is hard to be deformed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：制造设置有高精度投影的柔性布线板。解决方案：在柔性布线板1a中，基膜11与布线膜15一起变形，并且在布线膜15中形成突起18.同时，在后面形成有凹部17 基片11的突起18的位置。树脂材料22布置在凹部17内，其空间变小。因此，即使当电气部件4连接到柔性布线板1a时，即使在突起18上施加任何载荷，柔性布线板1a也难以变形。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005347308A Method for manufacturing multilayer wiring board 审中-公开
标题翻译：制造多层接线板的方法
公开(公告)号：JP2005347308A
公开(公告)日：2005-12-15
申请号：JP2004161707
申请日：2004-05-31
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： MOTOYOSHI HITOSHI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To simplify a step or shorten a plating time, or to form a metal pad for connection which is superior in bondability.
SOLUTION: This method includes a step to form a wiring layer on a conductive supporting body, a step to form a solder resist layer having an opening as corresponding to a connection part on the wiring layer, a step to apply metallic plating in the opening of the solder resist by electrolytic plating and to form a metallic pad for connection, and a step to transfer the laminated body formed in every step on a substrate where a conductor for interlayer connection penetrates. After the laminated body transferred on the conductive supporting body is transferred onto a support film, the laminated body transferred onto the support film may be further transferred onto the substrate. The wiring layer or the metal pad for connection is formed by electrolytic plating while the conductive supporting body is used as an electrode.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了简化步骤或缩短电镀时间，或形成连接性优异的金属焊盘。解决方案：该方法包括在导电支撑体上形成布线层的步骤，形成具有对应于布线层上的连接部分的开口的阻焊层的步骤，将金属镀层通过电解电镀打开阻焊剂并形成用于连接的金属焊盘，以及将层压连接导体穿透的基板上的每一步形成的层压体转印的步骤。将转印在导电性支撑体上的层叠体转印到支撑膜上之后，转印到支撑膜上的层叠体可以进一步转印到基板上。用于连接的布线层或金属焊盘通过电解电镀形成，而导电支撑体用作电极。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005329656A Adhesive film, method for manufacturing substrate with adhesive and method for manufacturing adhesive film 有权
标题翻译：粘合膜，用粘合剂制造基材的方法和制造粘合膜的方法
公开(公告)号：JP2005329656A
公开(公告)日：2005-12-02
申请号：JP2004151231
申请日：2004-05-21
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： KAWASHIMA TADASHI , KODAIRA YOSHIKATSU , KATO TSUTOMU , SATO IKUMI
IPC分类号： B32B27/00 , B32B7/10 , B32B27/18
摘要： PROBLEM TO BE SOLVED: To provide an adhesive film which has an antistatic function and enables judgement of whether an adhesive is normally applied or not. SOLUTION: This adhesive film 10 indicates a low surface resistance in a conductive layer 15 as a conductive particle 17 is added to at least the conductive layer 15, and static electricity due to friction leaks through the conductive layer 15, when an adhesive layer 25 is pasted to a substrate 4, hence no charging of the adhesive layer 25 occurs. In addition, since the conductive layer 15 is transparent and the adhesive layer 25 is of a different color from a base material 12, the color of the base material 12 is seen through the conductive layer 25, when the adhesive layer 25 is directed toward the substrate 4 and the color of the adhesive layer 25 is seen, when a first release film 11 is twisted, through an observation of the opposite surface to the substrate 4 of the first release film 11. Consequently, it is possible to easily judge, prior to the pasting process, whether the first release film 11 travels in the normal direction or not. Also, the method for manufacturing the substrate with an adhesive and the method for manufacturing the adhesive film are provided. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有抗静电功能并能够判断粘合剂是否通常被施加的粘合剂膜。解决方案：当粘合剂膜10至少导电层15中添加导电粒子17时，该粘合膜10表示导电层15中的低表面电阻，并且当粘合剂层25粘贴到基板4上，因此不会发生粘合层25的充电。此外，由于导电层15是透明的并且粘合剂层25与基底材料12具有不同的颜色，所以当粘合剂层25指向基底材料12时，通过导电层25看到基底材料12的颜色。通过观察与第一剥离膜11的基板4相反的表面，当第一剥离膜11被扭曲时，可以看到基材4和粘合剂层25的颜色。因此，可以容易地判断先前在粘贴过程中，第一剥离膜11是否沿正常方向移动。此外，提供了使用粘合剂制造基板的方法和粘合剂膜的制造方法。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005320553A Method and apparatus for producing pressure-sensitive adhesive tape 有权
标题翻译：用于生产压力敏感胶带的方法和装置
公开(公告)号：JP2005320553A
公开(公告)日：2005-11-17
申请号：JP2005223489
申请日：2005-08-01
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： AZUMA KAZUNORI , ARAKI NOBORU
IPC分类号： C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer free from thickness unevenness by irradiating a pressure-sensitive adhesive composition with an energy beam to perform a polymerization reaction.
SOLUTION: In this method for producing the pressure-sensitive adhesive tape having the pressure-sensitive adhesive layer formed by irradiating the pressure-sensitive adhesive composition with the energy beam to perform the polymerization reaction, the thickness of the pressure-sensitive adhesive composition is regulated by a thickness controlling means during a time after the irradiation of the pressure-sensitive adhesive composition with the energy beam is started and before the polymerization reaction of the pressure-sensitive adhesive composition is completed.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种通过用能量束照射压敏粘合剂组合物来进行聚合反应来制造具有不具有厚度不均匀性的压敏粘合剂层的压敏粘合带的方法。解决方案：在制造具有通过用能量束照射压敏粘合剂组合物以形成聚合反应形成的压敏粘合剂层的压敏粘合带的方法中，压敏粘合剂的厚度在压力敏感性粘合剂组合物开始照射之后的时间内，并且压敏粘合剂组合物的聚合反应完成之前，组合物由厚度控制装置调节。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005314600A Composition for protecting optical disc 有权
标题翻译：保护光盘的组合物
公开(公告)号：JP2005314600A
公开(公告)日：2005-11-10
申请号：JP2004135583
申请日：2004-04-30
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： KOKUNI KIICHIRO
IPC分类号： C08F2/50 , C08F220/20 , C08F290/06 , C09D4/00 , C09D4/02 , C09D4/06 , G11B7/254
CPC分类号： C09D4/06 , C09D4/00 , G11B7/2534 , G11B7/2542 , Y10T428/21 , C08F220/10 , C08F265/06
摘要： PROBLEM TO BE SOLVED: To provide a protective composition without harming scratch resistant property, having a low viscosity and low shrinkage even on without using a dilution solvent, and especially a composition for protecting an optical disc. SOLUTION: This composition for protecting the optical disc consists of an ultraviolet light-curing type acrylic radical-based resin as a main component, and as the raw materials of the acrylic radical-based resin, a polyfunctional acrylic monomer, polyfunctional acrylic oligomer and a bifunctional acrylic monomer containing a recurring unit consisting of ethoxy group or propoxy group are contained therein and a prescribed photo-polymerization initiator is added in it. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：待解决的问题：为了提供不损害耐擦伤性的保护性组合物，即使在不使用稀释溶剂的情况下也具有低粘度和低收缩率，特别是用于保护光盘的组合物。解决方案：用于保护光盘的组合物由紫外光固化型丙烯酸类树脂作为主要成分，作为丙烯酸类基树脂的原料，多官能丙烯酸类单体，多官能丙烯酸类低聚物和含有由乙氧基或丙氧基组成的重复单元的双官能丙烯酸单体，并在其中加入规定的光聚合引发剂。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2005268378A Method of manufacturing substrate with incorporated components 审中-公开
标题翻译：使用合并组件制造基板的方法
公开(公告)号：JP2005268378A
公开(公告)日：2005-09-29
申请号：JP2004075910
申请日：2004-03-17
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： MOTOYOSHI HITOSHI
IPC分类号： H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate with incorporated components with which a via diameter can be reduced and a via pitch can be made narrow. SOLUTION: There are prepared first and second double-coated wiring boards 10 and 20 with predetermined electrical components 6, 7 packaged thereon, and a connecting substrate 13 wherein a connecting pin 12 comprised of a predetermined metal is fixed through the predetermined portion of a sheet-like insulated base material 11 by implanting so that its both terminals are protruded from the front surface of the insulated base material 11. The first and second double coated wiring boards 10 and 20 are disposed to each other while confronting their sides where the electrical components 6, 7 are packaged, and the connecting substrate 13 is disposed between the first and second double coated wiring boards 10 and 20. The first and second double coated wiring boards are then adhered with each other using an anisotropic conductive adhesion film 8, and the first and second double coated wiring boards 10 and 20 are electrically connected with each other by the connecting pin 12 of the connecting substrate 13. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造具有可以减小通孔直径并且可以使通孔间距变窄的组合部件的基板的制造方法。解决方案：制备第一和第二双面布线板10和20，其上封装有预定的电气部件6,7，以及连接基板13，其中由预定金属组成的连接销12通过预定部分固定通过注入使其两端部从绝缘基材11的前表面突出而形成的片状绝缘基材11.第一和第二双面涂布电路板10和20彼此相对设置，电气部件6,7被封装，连接基板13配置在第一和第二双面涂布线路板10和20之间。然后，使用各向异性导电粘合膜8将第一和第二双面涂布线路板彼此粘合并且第一和第二双面涂布的布线板10和20通过连接器的连接销12彼此电连接 g衬底13.版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2005260012A Method for manufacturing double-sided wiring board and multilayer wiring board 审中-公开
标题翻译：制造双面接线板和多层接线板的方法
公开(公告)号：JP2005260012A
公开(公告)日：2005-09-22
申请号：JP2004069942
申请日：2004-03-12
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： ODAJIMA TORU , MOTOYOSHI HITOSHI
IPC分类号： H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a double-sided wiring board and a multilayer wiring board which can cope with turning into fine pitch, and in which conduction resistance is small and thermal conductivity is large. SOLUTION: The manufacturing method is provided with a process, wherein penetration fixing of a pin 2 for connection which is formed of oxygen-free rolling cooper is performed on a predetermined portion of an insulating adhesion substrate 1 of sheet-like, by using an in plant method so that both ends project from surfaces of the insulating adhesion substrate 1; a process, wherein pushing lamination of a metal foil 4, which consists of a rolling copper foil is performed from both surface sides of the insulating adhesion substrate 1 and the metal foil 4 and the pin 2 for connection are connected electrically; and a process of pattern-treating the metal foil 4. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供一种能够应对变成微细间距并且导电电阻小且导热性大的双面布线板和多层布线板的制造方法。解决方案：制造方法具有这样一种方法，其中，通过无氧轧制法形成的用于连接的销2的穿透固定在板状绝缘粘合基板1的预定部分上进行，通过使用植入方法，使得两端从绝缘粘合基板1的表面突出; 从绝缘粘合基板1和金属箔4的两个表面侧和连接用引脚2电连接进行由轧制铜箔构成的金属箔4的层叠的工序，和金属箔4的图案处理过程。版权所有（C）2005，JPO＆NCIPI

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