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    • 5. 发明授权
    • Solar battery and method of manufacturing the same
    • 太阳能电池及其制造方法
    • US5103851A
    • 1992-04-14
    • US623526
    • 1990-12-07
    • Shoji NishidaTakao Yonehara
    • Shoji NishidaTakao Yonehara
    • H01L31/04H01L21/20H01L27/142H01L31/042H01L31/18
    • H01L21/0242H01L21/02532H01L21/02546H01L21/02576H01L21/02579H01L21/0262H01L21/02639H01L31/03682H01L31/0475H01L31/076H01L31/1804H01L31/1852Y02E10/544Y02E10/546Y02E10/547Y02E10/548Y02P70/521
    • A solar battery characterized in the following respects of having at least one semiconductor multilayer structure (A) having at least, an electrode (a.sub.1); a semiconductor crystal (a.sub.2) of a first conductivity type formed on the electrode (a.sub.1); and at least one set of laminate layers consisting of a high resistance semiconductor layer (a.sub.3) and a semiconductor layer (a.sub.4) of a second conductivity type and a semiconductor layer (a.sub.5) of the first conductivity type which sequentially formed so as to cover the semiconductor crystal (a.sub.2) of the first conductivity type and at least one semiconductor multilayer structure (B) having at least: an electrode (b.sub.1); a semiconductor crystal (b.sub.2) of the second conductivity type formed on the electrode (b.sub.1); and at least one set of laminate layers consisting of a high resistance semiconductor layer (b.sub.3) and a semiconductor layer (b.sub.4) of the first conductivity type and a semiconductor layer (b.sub.5) of the second conductivity type which are alternately arranged on the same insulative substrate. The semiconductor multilayer structure sections (A) and (B) are alternately electrically connected by high resistance semiconductor layers (C) formed so as to cover the semiconductor multilayer structure sections (A) and (B). The surfaces of the high resistance semiconductor layers (C) form light receiving surfaces.
    • 一种太阳能电池,其特征在于具有至少一个至少具有电极(a1)的至少一个半导体多层结构(A) 形成在电极(a1)上的第一导电类型的半导体晶体(a2); 以及由高电阻半导体层(a3)和第二导电类型的半导体层(a4)和第一导电类型的半导体层(a5)组成的至少一组层叠层,其顺序地形成为覆盖 具有第一导电类型的半导体晶体(a2)和至少一个至少具有电极(b1)的半导体多层结构(B) 形成在电极(b1)上的第二导电类型的半导体晶体(b2); 以及由第一导电类型的高电阻半导体层(b3)和半导体层(b4)和第二导电类型的半导体层(b5)组成的层叠层的至少一组交替地布置在相同的绝缘体 基质。 半导体多层结构部(A)和(B)通过形成为覆盖半导体多层结构部(A)和(B)的高电阻半导体层(C)交替电连接。 高电阻半导体层(C)的表面形成光接收表面。
    • 6. 发明授权
    • Process for producing single crystal silicon wafers
    • 制造单晶硅片的工艺
    • US07077901B2
    • 2006-07-18
    • US10402214
    • 2003-03-31
    • Katsumi NakagawaTakao YoneharaKazuaki OhmiShoji Nishida
    • Katsumi NakagawaTakao YoneharaKazuaki OhmiShoji Nishida
    • C30B19/02
    • C30B19/12C30B19/02C30B29/06
    • A process for producing a single crystal silicon wafer, comprising the steps of forming a porous layer on a single crystal silicon substrate comprising a silicon whose concentration of mass number 28 silicon isotope is less than 92.5% on an average; dissolving a starting silicon whose concentration of mass number 28 silicone isotope whose mass number is more than 98% on an average in a melt for liquid-phase epitaxy until said starting silicon becomes to be a supersaturated state in said melt under reductive atmosphere maintained at high temperature: immersing said single crystal silicon substrate in said melt to grow a single crystal silicon layer on the surface of said porous layer of said single crystal silicon substrate; and peeling said single crystal silicon layer from a portion of said porous layer.
    • 一种制造单晶硅晶片的方法,包括以下步骤:在单晶硅衬底上形成多孔层,该单晶硅衬底包含平均浓度为28%硅同位素的硅的浓度小于92.5%的硅; 将其质量数为28的硅同位素的质量数大于98%的起始硅溶解在用于液相外延的熔体中,直到所述起始硅在所述熔体中在还原气氛保持在高温下变为过饱和状态为止 温度:将所述单晶硅衬底浸入所述熔体中以在所述单晶硅衬底的所述多孔层的表面上生长单晶硅层; 以及从所述多孔层的一部分剥离所述单晶硅层。
    • 8. 发明授权
    • Method and apparatus for producing photoelectric conversion device
    • 光电转换装置的制造方法及装置
    • US06391743B1
    • 2002-05-21
    • US09401775
    • 1999-09-22
    • Masaaki IwaneTakao YoneharaKazuaki OhmiShoji NishidaKiyofumi SakaguchiKazutaka Yanagita
    • Masaaki IwaneTakao YoneharaKazuaki OhmiShoji NishidaKiyofumi SakaguchiKazutaka Yanagita
    • H01L2130
    • H01L31/072H01L21/67092H01L21/76254H01L2221/68363Y02E10/50
    • There is disclosed a method of producing a photoelectric conversion device comprising the steps of forming a semiconductor substrate comprising a first and a second semiconductor layers with a separation layer therebetween; bonding a support substrate to a surface of the second semiconductor layer opposite to the separation-layer-side surface to form a bonded substrate; separating the first and the second semiconductor layers by the separation layer; and producing a photoelectric conversion device in the second semiconductor layer, wherein when bonding the semiconductor substrate and the support substrate to each other, at least a portion is formed in the bonded substrate in which at least a part of end portions of the semiconductor substrate and the support substrate is not bonded to the other substrate and a fluid is jetted against a side surface of the bonded substrate, thereby separating the first and the second semiconductor layers. The method makes it possible to separate a bonded substrate with a high yield, thereby supplying photoelectric conversion devices with a high quality at a low production cost.
    • 公开了一种制造光电转换装置的方法,包括以下步骤:形成包括第一和第二半导体层的半导体衬底,其间具有分离层; 将支撑基板接合到与分离层侧表面相对的第二半导体层的表面,以形成键合衬底; 通过分离层分离第一和第二半导体层; 以及在所述第二半导体层中制造光电转换器件,其中当将所述半导体衬底和所述支撑衬底彼此接合时,至少一部分形成在所述键合衬底中,其中所述半导体衬底和所述支撑衬底的至少一部分端部和 支撑基板不与另一个基板接合,并且流体相对于键合衬底的侧表面喷射,从而分离第一和第二半导体层。 该方法可以以高产率分离粘合的基片,从而以低的生产成本提供高质量的光电转换装置。