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    • 8. 发明授权
    • Method for forming a resist pattern on a substrate surface and a
scum-remover therefor
    • 在基板表面上形成抗蚀剂图案的方法和用于其的浮渣除去器
    • US4873177A
    • 1989-10-10
    • US229762
    • 1988-08-05
    • Hatsuyuki TanakaYoshiyuki SatoHidekatsu KoharaToshimasa Nakayama
    • Hatsuyuki TanakaYoshiyuki SatoHidekatsu KoharaToshimasa Nakayama
    • G03F7/32
    • G03F7/322
    • The pattern-wise photoresist layer formed on the surface of a substrate according to the inventive method is imparted with a greatly improved resolving power as a result of complete removal of the scum residua left after the development treatment. Namely, the positive-working photoresist layer formed on the substrate surface is exposed pattern-wise to actinic rays, developed with a developer solution which is typically a 2-7% aqueous solution of a quaternary ammonium hydroxide and then rinsed with a scum-remover solution which is a mixture of 100 parts of a 0.1-1.5% aqueous solution of a quaternary ammonium hydroxide and 1-30 parts of a water-miscible organic solvent and capable of dissolving away the scum residua in the pattern-wise photoresist layer without affecting the quality of the photoresist pattern reproduction.
    • 根据本发明方法形成在基材表面上的图案光致抗蚀剂层由于在显影处理后完全除去剩余的浮渣残留物而赋予极大改进的分辨能力。 也就是说,形成在基板表面上的正性光致抗蚀剂层以图案方式暴露于光化学射线,用显影剂溶液显影,显影剂溶液通常为2-7%氢氧化季铵水溶液,然后用浮渣除去剂 溶液,其为100份0.1-1.5%的季铵氢氧化物水溶液和1-30份水混溶性有机溶剂的混合物,并且能够将浮渣残留物溶解在图案化光致抗蚀剂层中而不影响 光刻胶图案再现的质量。