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    • 5. 发明授权
    • Method for manufacturing thin film transistor array panel
    • 制造薄膜晶体管阵列面板的方法
    • US08476123B2
    • 2013-07-02
    • US13109686
    • 2011-05-17
    • Dong-Ju YangYu-Gwang JeongJean-Ho SongKi-Yeup LeeShin-Il ChoiTae-Woo Kim
    • Dong-Ju YangYu-Gwang JeongJean-Ho SongKi-Yeup LeeShin-Il ChoiTae-Woo Kim
    • H01L21/84
    • H01L27/1288H01L21/32138H01L27/1214H01L27/1255H01L29/458
    • A method for manufacturing a thin film transistor array panel includes forming a gate line; forming an insulating layer on the gate line; forming first and second silicon layers first and second metal layers; forming a photoresist pattern having first and second portions; forming first and second metal patterns by etching the first and second metal layers; processing the first metal pattern with SF6 or SF6/He; forming silicon and semiconductor patterns by etching the second and first silicon layers; removing the first portion of the photoresist pattern; forming an upper layer of a data wire by wet etching the second metal pattern; forming a lower layer of the data wire and an ohmic contact by etching the first metal and amorphous silicon patterns; forming a passivation layer including a contact hole on the upper layer; and forming a pixel electrode on the passivation layer.
    • 薄膜晶体管阵列板的制造方法包括:形成栅极线; 在栅极线上形成绝缘层; 第一和第二硅层第一和第二金属层; 形成具有第一和第二部分的光致抗蚀剂图案; 通过蚀刻第一和第二金属层来形成第一和第二金属图案; 用SF6或SF6 / He处理第一金属图案; 通过蚀刻第二和第一硅层形成硅和半导体图案; 去除光致抗蚀剂图案的第一部分; 通过湿法蚀刻第二金属图案形成数据线的上层; 通过蚀刻第一金属和非晶硅图案形成数据线的下层和欧姆接触; 在上层形成包括接触孔的钝化层; 以及在所述钝化层上形成像素电极。
    • 6. 发明申请
    • Metal wiring layer and method of fabricating the same
    • 金属布线层及其制造方法
    • US20090115066A1
    • 2009-05-07
    • US12290594
    • 2008-10-31
    • Dong-Ju YangShin-Il ChoiSang-Gab KimMin-Seok OhHong-Kee ChinKi-Yeup LeeYu-Gwang JeongSeung-Ha Choi
    • Dong-Ju YangShin-Il ChoiSang-Gab KimMin-Seok OhHong-Kee ChinKi-Yeup LeeYu-Gwang JeongSeung-Ha Choi
    • H01L23/535H01L21/768
    • H01L23/535H01L21/743H01L27/1218H01L27/124H01L2924/0002H01L2924/00
    • A metal wiring layer and a method of fabricating the metal wiring layer are provided. The method includes forming a dielectric layer on a substrate, forming a plurality of dielectric layer patterns and holes therein on the substrate by etching part of the dielectric layer, with a cross sectional area of the holes in the dielectric layer patterns decreasing with increasing distance away from the substrate and the holes exposing the substrate, forming a trench by etching a portion of the substrate exposed through the holes in the dielectric layer patterns, and forming a metal layer which fills the trench and the holes in the dielectric layer patterns. Thus, it is possible to prevent the occurrence of an edge build-up phenomenon by forming a metal layer in a plurality of holes in the dielectric layer patterns having a cross sectional area decreasing with increasing distance away from the substrate. Therefore, it is possible to prevent the transmittance of a liquid crystal layer from decreasing due to a failure to properly fill liquid crystal molecules in the liquid crystal layer, and thus to increase the quality of display.
    • 提供金属布线层和制造金属布线层的方法。 该方法包括在衬底上形成电介质层,通过蚀刻介电层的一部分,在衬底上形成多个介电层图案和孔,电介质层图案中的孔的横截面积随距离的增加而减小 从衬底和暴露衬底的孔,通过蚀刻通过介电层图案中的孔暴露的衬底的一部分形成沟槽,以及形成填充沟槽和介电层图案中的空穴的金属层。 因此,可以通过在电介质层图案中的多个孔中形成金属层来防止边缘积聚现象的发生,该电介质层图案的横截面积随离开距衬底的距离的增加而减小。 因此,可以防止液晶层的透射率由于不能适当地填充液晶层中的液晶分子而降低,从而提高显示质量。