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1. 发明申请

US20060164813A1 Semiconductor package and semiconductor module 审中-公开
标题翻译：半导体封装和半导体模块
公开(公告)号：US20060164813A1
公开(公告)日：2006-07-27
申请号：US11289487
申请日：2005-11-30
申请人： Shimpei Yoshioka , Yukihiro Ikeya , Naotake Watanabe , Nobumitsu Tada , Masakazu Shindome
发明人： Shimpei Yoshioka , Yukihiro Ikeya , Naotake Watanabe , Nobumitsu Tada , Masakazu Shindome
IPC分类号： H05K7/20
CPC分类号： H01L23/49844 , H01L24/34 , H01L24/37 , H01L2224/37124 , H01L2224/37599 , H01L2224/45124 , H01L2224/48137 , H01L2224/4847 , H01L2224/48472 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor package includes a plate-like semiconductor element having a first power terminal and a control terminal on a main surface, and a second power terminal on a rear surface; a first power electrode plate positioned to face with the main surface of the semiconductor element, and including a first power electrode joined to the first power terminal by soldering; a second power electrode plate positioned to face with the rear surface of the semiconductor element, and including a second power electrode joined to the second power terminal by soldering; and an insulating substrate positioned between the semiconductor element and the first electrode plate, and including a control electrode joined to the control terminal by soldering.
摘要翻译：半导体封装包括在主表面上具有第一电源端子和控制端子的板状半导体元件和在后表面上的第二电源端子; 定位成与半导体元件的主表面相对的第一电极板，并且包括通过焊接而与第一电源端子接合的第一电力电极; 定位成与半导体元件的后表面相对的第二电极板，并且包括通过焊接连接到第二电源端子的第二电源电极; 以及位于所述半导体元件和所述第一电极板之间的绝缘基板，并且包括通过焊接而与所述控制端子接合的控制电极。

2. 发明授权

US07487581B2 Method of manufacturing an inverter device 失效
标题翻译：制造逆变器装置的方法
公开(公告)号：US07487581B2
公开(公告)日：2009-02-10
申请号：US11723826
申请日：2007-03-22
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
IPC分类号： H01F7/06
CPC分类号： H02M7/003 , H01L25/18 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , Y10T29/49002 , Y10T29/4902 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor said first conductor and second conductor are connected connected to said wide conductor; and a cooler to which through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.
摘要翻译：通过提供并联连接并构成逆变器的一个臂的多个半导体芯片; 连接所述多个半导体芯片的一侧的面的第一导体; 所述多个半导体芯片的另一侧的面连接的宽导体; 第二导体，所述第一导体和第二导体连接到所述宽导体; 以及冷却器，通过绝缘树脂片将半导体芯片中产生的热损失的一部分热传导到第一导体，然后热传导到冷却器，产生冷却，而另一部分被热传导到宽导体，然后连接到第二导体，从而将其传导到冷却器，产生冷却。

3. 发明申请

US20070165383A1 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof 失效
标题翻译：逆变器装置及其装置的制造方法以及其逆变器装置的电动汽车
公开(公告)号：US20070165383A1
公开(公告)日：2007-07-19
申请号：US11723826
申请日：2007-03-22
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L25/18 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , Y10T29/49002 , Y10T29/4902 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.
摘要翻译：通过提供并联连接并构成逆变器的一个臂的多个半导体芯片; 连接所述多个半导体芯片的一侧的面的第一导体; 所述多个半导体芯片的另一侧的面连接的宽导体; 连接到所述宽导体的第二导体; 以及通过绝缘树脂片将所述第一导体和第二导体连接到的冷却器，半导体芯片中产生的热损失的一部分被热传导到第一导体，并且被热传导到冷却器，产生冷却，而另一个其一部分被热传导到宽导体，然后被传导到第二导体，由此被传导到冷却器，从而产生冷却。

4. 发明申请

US20050057901A1 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof 失效
标题翻译：逆变器装置及其装置的制造方法以及其逆变器装置的电动汽车
公开(公告)号：US20050057901A1
公开(公告)日：2005-03-17
申请号：US10813444
申请日：2004-03-31
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
IPC分类号： H01L23/373 , H01L25/07 , H01L25/18 , H02M7/48 , H02M7/5387
CPC分类号： H02M7/003 , H01L25/18 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , Y10T29/49002 , Y10T29/4902 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.
摘要翻译：通过提供并联连接并构成逆变器的一个臂的多个半导体芯片; 连接所述多个半导体芯片的一侧的面的第一导体; 所述多个半导体芯片的另一侧的面连接的宽导体; 连接到所述宽导体的第二导体; 以及通过绝缘树脂片将所述第一导体和第二导体连接到的冷却器，半导体芯片中产生的热损失的一部分被热传导到第一导体，并且然后被热传导到冷却器，产生冷却，而另一个其一部分被热传导到宽导体，然后被传导到第二导体，由此被传导到冷却器，从而产生冷却。

5. 发明授权

US07206205B2 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof 失效
公开(公告)号：US07206205B2
公开(公告)日：2007-04-17
申请号：US10813444
申请日：2004-03-31
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L25/18 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , Y10T29/49002 , Y10T29/4902 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

6. 发明授权

US07605456B2 Inverter unit 有权
标题翻译：变频器单元
公开(公告)号：US07605456B2
公开(公告)日：2009-10-20
申请号：US11628250
申请日：2005-06-01
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Gou Ninomiya
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Gou Ninomiya
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L25/115 , H01L2224/49111 , H01L2924/13055 , H01L2924/30107 , H01L2924/00
摘要： To provide an inverter unit with excellent manufacturing performance and with current carrying capacity increased and size reduced by further increasing the cooling efficiency of a power efficiency device.The inverter unit includes: a semiconductor chip constituting an arm of an inverter; a first conductor 33 joined to a positive side of the semiconductor chip; and a second conductor 35 joined to a negative side of the semiconductor chip. The first and second conductors are disposed above a cooler 22 cooling the semiconductor chip so that a joint surface of the first conductor 33 which is joined to a positive electrode of the semiconductor chip and a joint surface of the second conductor 35 which is joined to a negative electrode of the semiconductor chip are not in parallel to a surface of the cooler 22.
摘要翻译：通过进一步提高功率效率器件的冷却效率，提供具有优良制造性能和电流承载能力的逆变器单元，从而提高了尺寸。逆变器单元包括：构成逆变器的臂的半导体芯片; 连接到半导体芯片的正极侧的第一导体33; 以及连接到半导体芯片的负极侧的第二导体35。第一和第二导体设置在冷却器22的上方，冷却半导体芯片，使得接合到半导体芯片的正电极的第一导体33的接合表面和与第二导体35接合的第二导体35的接合表面半导体芯片的负电极不与冷却器22的表面平行。

7. 发明授权

US06906935B2 Inverter apparatus and method of manufacturing the same 失效
标题翻译：逆变器及其制造方法
公开(公告)号：US06906935B2
公开(公告)日：2005-06-14
申请号：US10291637
申请日：2002-11-12
申请人： Masami Nakamura , Atsushi Amano , Iwao Shimane , Yasuyuki Danjou , Shigekazu Saito , Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya
发明人： Masami Nakamura , Atsushi Amano , Iwao Shimane , Yasuyuki Danjou , Shigekazu Saito , Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya
IPC分类号： H01L23/36 , H02M7/00 , H02M7/48 , H02M7/5387 , H02M1/00 , H05K7/20
CPC分类号： H02M7/003 , H01L2224/32225 , H01L2224/49111 , H01L2224/49175 , H01L2924/13055 , H01L2924/19107 , H01L2924/00
摘要： In an inverter apparatus in which a three-phase inverter main circuit having a plurality of arms comprises a plurality of semiconductor chips for electric power, one arm of the three-phase inverter main circuit includes IGBTs and diodes of semiconductor chips having a size of 10 mm by 10 mm or less with the semiconductor chips connected in parallel, while the IGBTs and the diodes are bonded to a conductor having a thickness of 1.5 mm or more and 5 mm or less, and the conductor is glued to a cooler through an insulating resin sheet containing ceramics.
摘要翻译：在具有多个臂的三相逆变器主电路包括多个用于电力的半导体芯片的逆变器装置中，三相逆变器主电路的一个臂包括IGBT和二极管，半导体芯片的尺寸为10 mm×10 mm以下，半导体芯片并联连接，IGBT和二极管接合到厚度为1.5mm以上且5mm以下的导体，导体通过绝缘体粘合到冷却器含有陶瓷的树脂片。

8. 发明申请

US20110032001A1 TEMPERATURE DETECTION CIRCUIT 失效
标题翻译：温度检测电路
公开(公告)号：US20110032001A1
公开(公告)日：2011-02-10
申请号：US12906715
申请日：2010-10-18
申请人： Ryuta HASEGAWA , Ryuichi Morikawa , Nobumitsu Tada , Masami Hirata
发明人： Ryuta HASEGAWA , Ryuichi Morikawa , Nobumitsu Tada , Masami Hirata
IPC分类号： H03K5/00
CPC分类号： H02M1/32 , G01K3/005 , G01K7/01 , G01K2219/00 , H02M7/5387 , H02M2001/327
摘要： According to one embodiment, a temperature detection circuit is provided which requires only a small number of additional components, thus minimizing an increase in costs and which offers an insulating property and high responsiveness. A temperature detection circuit outputs a first PWM signal corresponding to a temperature of a first temperature sensor from a photointerrupter as a signal insulated from the first temperature sensor. A temperature detection circuit outputs a second PWM signal corresponding to a temperature of a second temperature sensor from a photointerrupter as a signal insulated from the second temperature sensor. A controlling arithmetic apparatus calculates a higher one of the temperatures detected by the first and second temperature sensors based on the PWM signals output from the photointerrupter.
摘要翻译：根据一个实施例，提供了仅需要少量附加部件的温度检测电路，从而最小化成本的增加并且提供绝缘性能和高响应性。温度检测电路作为与第一温度传感器绝缘的信号，从光断续器输出对应于第一温度传感器的温度的第一PWM信号。温度检测电路作为与第二温度传感器绝缘的信号，从光断续器输出对应于第二温度传感器的温度的第二PWM信号。控制运算装置基于从光断续器输出的PWM信号，计算由第一温度传感器和第二温度传感器检测出的温度中的较高值。

9. 发明授权

US08247099B2 Gas exhaust structure of battery 有权
标题翻译：电池排气结构
公开(公告)号：US08247099B2
公开(公告)日：2012-08-21
申请号：US12567056
申请日：2009-09-25
申请人： Takafumi Nakahama , Takeo Kakuchi , Nobumitsu Tada , Taihei Koyama , Norihito Togashi , Kenya Kurokawa , Tadashi Shudo , Mami Mizutani
发明人： Takafumi Nakahama , Takeo Kakuchi , Nobumitsu Tada , Taihei Koyama , Norihito Togashi , Kenya Kurokawa , Tadashi Shudo , Mami Mizutani
IPC分类号： H01M2/12
CPC分类号： H01M2/12 , H01M2/1241
摘要： A gas exhaust structure of a battery includes a rupture valve formed in a battery body, and a pipe unit composed by integrating a coupling pipe and an exhaust pipe with each other. A one-side opening of the coupling pipe is coupled to the rupture valve. The exhaust pipe is coupled to an other-side opening of the coupling pipe, guides gas that spouts out from an inside of the battery body through the rupture valve and the one-side opening of the coupling pipe, and exhausts the gas to an outside. The exhaust pipe is arranged to be offset with respect to the rupture valve without allowing an extended line that passes through a center of the rupture valve and a centerline of the exhaust pipe to be perpendicular to each other.
摘要翻译：电池的排气结构包括形成在电池主体中的断裂阀和通过将联接管和排气管相互集成而构成的管单元。联接管的单侧开口连接到破裂阀。排气管联接到联接管的另一侧开口，引导通过破裂阀和联接管的单侧开口从电池体的内部喷出的气体，并将气体排出到外部。排气管被布置成相对于破裂阀偏移，而不允许通过破裂阀的中心的延伸线和排气管的中心线彼此垂直。

10. 发明授权

US07969227B2 Temperature detection circuit 失效
标题翻译：温度检测电路
公开(公告)号：US07969227B2
公开(公告)日：2011-06-28
申请号：US12906715
申请日：2010-10-18
申请人： Ryuta Hasegawa , Ryuichi Morikawa , Nobumitsu Tada , Masami Hirata
发明人： Ryuta Hasegawa , Ryuichi Morikawa , Nobumitsu Tada , Masami Hirata
IPC分类号： H03K3/42
CPC分类号： H02M1/32 , G01K3/005 , G01K7/01 , G01K2219/00 , H02M7/5387 , H02M2001/327
摘要： According to one embodiment, a temperature detection circuit is provided which requires only a small number of additional components, thus minimizing an increase in costs and which offers an insulating property and high responsiveness. A temperature detection circuit outputs a first PWM signal corresponding to a temperature of a first temperature sensor from a photointerrupter as a signal insulated from the first temperature sensor. A temperature detection circuit outputs a second PWM signal corresponding to a temperature of a second temperature sensor from a photointerrupter as a signal insulated from the second temperature sensor. A controlling arithmetic apparatus calculates a higher one of the temperatures detected by the first and second temperature sensors based on the PWM signals output from the photointerrupter.
摘要翻译：根据一个实施例，提供了仅需要少量附加部件的温度检测电路，从而最小化成本的增加并且提供绝缘性能和高响应性。温度检测电路作为与第一温度传感器绝缘的信号，从光断续器输出对应于第一温度传感器的温度的第一PWM信号。温度检测电路作为与第二温度传感器绝缘的信号，从光断续器输出对应于第二温度传感器的温度的第二PWM信号。控制运算装置基于从光断续器输出的PWM信号，计算由第一温度传感器和第二温度传感器检测出的温度中的较高值。

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