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1. 发明授权

US06906935B2 Inverter apparatus and method of manufacturing the same 失效
标题翻译：逆变器及其制造方法
公开(公告)号：US06906935B2
公开(公告)日：2005-06-14
申请号：US10291637
申请日：2002-11-12
申请人： Masami Nakamura , Atsushi Amano , Iwao Shimane , Yasuyuki Danjou , Shigekazu Saito , Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya
发明人： Masami Nakamura , Atsushi Amano , Iwao Shimane , Yasuyuki Danjou , Shigekazu Saito , Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya
IPC分类号： H01L23/36 , H02M7/00 , H02M7/48 , H02M7/5387 , H02M1/00 , H05K7/20
CPC分类号： H02M7/003 , H01L2224/32225 , H01L2224/49111 , H01L2224/49175 , H01L2924/13055 , H01L2924/19107 , H01L2924/00
摘要： In an inverter apparatus in which a three-phase inverter main circuit having a plurality of arms comprises a plurality of semiconductor chips for electric power, one arm of the three-phase inverter main circuit includes IGBTs and diodes of semiconductor chips having a size of 10 mm by 10 mm or less with the semiconductor chips connected in parallel, while the IGBTs and the diodes are bonded to a conductor having a thickness of 1.5 mm or more and 5 mm or less, and the conductor is glued to a cooler through an insulating resin sheet containing ceramics.
摘要翻译：在具有多个臂的三相逆变器主电路包括多个用于电力的半导体芯片的逆变器装置中，三相逆变器主电路的一个臂包括IGBT和二极管，半导体芯片的尺寸为10 mm×10 mm以下，半导体芯片并联连接，IGBT和二极管接合到厚度为1.5mm以上且5mm以下的导体，导体通过绝缘体粘合到冷却器含有陶瓷的树脂片。

2. 发明授权

US07487581B2 Method of manufacturing an inverter device 失效
标题翻译：制造逆变器装置的方法
公开(公告)号：US07487581B2
公开(公告)日：2009-02-10
申请号：US11723826
申请日：2007-03-22
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
IPC分类号： H01F7/06
CPC分类号： H02M7/003 , H01L25/18 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , Y10T29/49002 , Y10T29/4902 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor said first conductor and second conductor are connected connected to said wide conductor; and a cooler to which through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.
摘要翻译：通过提供并联连接并构成逆变器的一个臂的多个半导体芯片; 连接所述多个半导体芯片的一侧的面的第一导体; 所述多个半导体芯片的另一侧的面连接的宽导体; 第二导体，所述第一导体和第二导体连接到所述宽导体; 以及冷却器，通过绝缘树脂片将半导体芯片中产生的热损失的一部分热传导到第一导体，然后热传导到冷却器，产生冷却，而另一部分被热传导到宽导体，然后连接到第二导体，从而将其传导到冷却器，产生冷却。

3. 发明申请

US20050057901A1 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof 失效
标题翻译：逆变器装置及其装置的制造方法以及其逆变器装置的电动汽车
公开(公告)号：US20050057901A1
公开(公告)日：2005-03-17
申请号：US10813444
申请日：2004-03-31
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
IPC分类号： H01L23/373 , H01L25/07 , H01L25/18 , H02M7/48 , H02M7/5387
CPC分类号： H02M7/003 , H01L25/18 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , Y10T29/49002 , Y10T29/4902 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.
摘要翻译：通过提供并联连接并构成逆变器的一个臂的多个半导体芯片; 连接所述多个半导体芯片的一侧的面的第一导体; 所述多个半导体芯片的另一侧的面连接的宽导体; 连接到所述宽导体的第二导体; 以及通过绝缘树脂片将所述第一导体和第二导体连接到的冷却器，半导体芯片中产生的热损失的一部分被热传导到第一导体，并且然后被热传导到冷却器，产生冷却，而另一个其一部分被热传导到宽导体，然后被传导到第二导体，由此被传导到冷却器，从而产生冷却。

4. 发明授权

US07605456B2 Inverter unit 有权
标题翻译：变频器单元
公开(公告)号：US07605456B2
公开(公告)日：2009-10-20
申请号：US11628250
申请日：2005-06-01
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Gou Ninomiya
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Gou Ninomiya
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L25/115 , H01L2224/49111 , H01L2924/13055 , H01L2924/30107 , H01L2924/00
摘要： To provide an inverter unit with excellent manufacturing performance and with current carrying capacity increased and size reduced by further increasing the cooling efficiency of a power efficiency device.The inverter unit includes: a semiconductor chip constituting an arm of an inverter; a first conductor 33 joined to a positive side of the semiconductor chip; and a second conductor 35 joined to a negative side of the semiconductor chip. The first and second conductors are disposed above a cooler 22 cooling the semiconductor chip so that a joint surface of the first conductor 33 which is joined to a positive electrode of the semiconductor chip and a joint surface of the second conductor 35 which is joined to a negative electrode of the semiconductor chip are not in parallel to a surface of the cooler 22.
摘要翻译：通过进一步提高功率效率器件的冷却效率，提供具有优良制造性能和电流承载能力的逆变器单元，从而提高了尺寸。逆变器单元包括：构成逆变器的臂的半导体芯片; 连接到半导体芯片的正极侧的第一导体33; 以及连接到半导体芯片的负极侧的第二导体35。第一和第二导体设置在冷却器22的上方，冷却半导体芯片，使得接合到半导体芯片的正电极的第一导体33的接合表面和与第二导体35接合的第二导体35的接合表面半导体芯片的负电极不与冷却器22的表面平行。

5. 发明申请

US20070165383A1 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof 失效
标题翻译：逆变器装置及其装置的制造方法以及其逆变器装置的电动汽车
公开(公告)号：US20070165383A1
公开(公告)日：2007-07-19
申请号：US11723826
申请日：2007-03-22
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L25/18 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , Y10T29/49002 , Y10T29/4902 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.
摘要翻译：通过提供并联连接并构成逆变器的一个臂的多个半导体芯片; 连接所述多个半导体芯片的一侧的面的第一导体; 所述多个半导体芯片的另一侧的面连接的宽导体; 连接到所述宽导体的第二导体; 以及通过绝缘树脂片将所述第一导体和第二导体连接到的冷却器，半导体芯片中产生的热损失的一部分被热传导到第一导体，并且被热传导到冷却器，产生冷却，而另一个其一部分被热传导到宽导体，然后被传导到第二导体，由此被传导到冷却器，从而产生冷却。

6. 发明申请

US20070217241A1 Inverter Unit 有权
标题翻译：变频器单元
公开(公告)号：US20070217241A1
公开(公告)日：2007-09-20
申请号：US11628250
申请日：2005-06-01
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Gou Ninomiya
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Gou Ninomiya
IPC分类号： H02M7/42
CPC分类号： H02M7/003 , H01L25/115 , H01L2224/49111 , H01L2924/13055 , H01L2924/30107 , H01L2924/00
摘要： To provide an inverter unit with excellent manufacturing performance and with current carrying capacity increased and size reduced by further increasing the cooling efficiency of a power efficiency device. The inverter unit includes: a semiconductor chip constituting an arm of an inverter; a first conductor 33 joined to a positive side of the semiconductor chip; and a second conductor 35 joined to a negative side of the semiconductor chip. The first and second conductors are disposed above a cooler 22 cooling the semiconductor chip so that a joint surface of the first conductor 33 which is joined to a positive electrode of the semiconductor chip and a joint surface of the second conductor 35 which is joined to a negative electrode of the semiconductor chip are not in parallel to a surface of the cooler 22.
摘要翻译：通过进一步提高功率效率器件的冷却效率，提供具有优良制造性能和电流承载能力的逆变器单元，从而提高了尺寸。逆变器单元包括：构成逆变器的臂的半导体芯片; 连接到半导体芯片的正极侧的第一导体33; 以及连接到半导体芯片的负极侧的第二导体35。第一和第二导体设置在冷却器22的上方，冷却半导体芯片，使得接合到半导体芯片的正电极的第一导体33的接合表面和与第二导体35接合的第二导体35的接合表面半导体芯片的负电极不与冷却器22的表面平行。

7. 发明授权

US07206205B2 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof 失效
公开(公告)号：US07206205B2
公开(公告)日：2007-04-17
申请号：US10813444
申请日：2004-03-31
申请人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
发明人： Toshiharu Obu , Nobumitsu Tada , Hiroki Sekiya , Keizo Hagiwara , Shimpei Yoshioka
IPC分类号： H05K7/20
CPC分类号： H02M7/003 , H01L25/18 , H01L2224/49111 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , Y10T29/49002 , Y10T29/4902 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , H01L2924/00
摘要： By providing a plurality of semiconductor chips that are connected in parallel and constitute one arm of an inverter; a first conductor to which a face on one side of said plurality of semiconductor chips is connected; a wide conductor to which a face on the other side of said plurality of semiconductor chips is connected; a second conductor connected to said wide conductor; and a cooler to which said first conductor and second conductor are connected through an insulating resin sheet, part of the heat loss generated in the semiconductor chips is thermally conducted to the first conductor and is thence thermally conducted to the cooler, producing cooling, while another part thereof is thermally conducted to the wide conductor and thence to the second conductor, whence it is thermally conducted to the cooler, producing cooling.

8. 发明申请

US20090237890A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20090237890A1
公开(公告)日：2009-09-24
申请号：US12299877
申请日：2007-02-01
申请人： Hiroki Sekiya , Toshiharu Oobu , Ryuichi Morikawa , Gou Ninomiya , Hiroyuki Hiramoto
发明人： Hiroki Sekiya , Toshiharu Oobu , Ryuichi Morikawa , Gou Ninomiya , Hiroyuki Hiramoto
IPC分类号： H05K7/20 , H01L21/50
CPC分类号： H01L25/071 , H01L23/3735 , H01L24/48 , H01L25/115 , H01L25/50 , H01L2224/48137 , H01L2224/48227 , H01L2224/48472 , H01L2924/00014 , H01L2924/0102 , H01L2924/01078 , H01L2924/12041 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/30107 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes: a semiconductor element (106) having a surface on a positive electrode side and a surface on a negative electrode side; multiple conductors (13 to 15) bonded respectively to the surface on the positive electrode side and to the surface on the negative electrode side of the semiconductor element; a heat sink plate (11) disposed as intersecting a junction interface between the semiconductor element and each of the multiple conductors and configured to discharge heat of the semiconductor element; and an insulator (12) bonding the heat sink plate to the multiple conductors. The insulator includes a heat conductive insulator (16) disposed inside a portion facing all of the multiple conductors and a flexible insulator (17) disposed at a portion other than the heat conductive insulator.
摘要翻译：半导体器件包括：具有在正极侧表面和负极侧的表面的半导体元件（106）; 多个导体（13〜15）分别与半导体元件的正极侧和负极侧的表面接合，散热板（11），设置成与所述半导体元件和所述多个导体中的每一个之间的结界面相交并且被配置为放电所述半导体元件的热; 以及将散热板连接到多个导体的绝缘体（12）。绝缘体包括设置在面向所有多个导体的部分内的导热绝缘体（16），以及布置在导热绝缘体以外的部分的柔性绝缘体（17）。

9. 发明授权

US06897396B2 Switch gear and method of manufacturing thereof 有权
标题翻译：开关装置及其制造方法
公开(公告)号：US06897396B2
公开(公告)日：2005-05-24
申请号：US09726411
申请日：2000-12-01
申请人： Yoshihiro Ito , Susumu Kinoshita , Satoshi Makishima , Hiroki Sekiya , Masaru Miyagawa , Toshio Shimizu
发明人： Yoshihiro Ito , Susumu Kinoshita , Satoshi Makishima , Hiroki Sekiya , Masaru Miyagawa , Toshio Shimizu
IPC分类号： H02B13/02 , H01H11/00 , H01H31/00 , H01H33/02 , H01H33/66 , H02B1/56 , H02B13/01 , H02B13/035
CPC分类号： H02B1/56 , H01H11/0031 , H01H31/003 , H01H33/027 , H01H33/66 , H01H2009/523 , H01H2033/566 , H01H2033/6613 , H01H2033/6623 , H02B13/01 , H02B13/0354
摘要： By molding a plurality of vacuum valves (7), (13) having differing functions together with an input member (3) and an output member (21) en bloc in a resin layer (23) to form a switch gear (1), the present invention seeks to achieve dielectric strength without resorting to the use of SF6 gas, while rendering the whole device more compact and reducing both the number of parts and the man hours required for molding.
摘要翻译：通过将具有不同功能的多个真空阀（7），（13）与输入构件（3）和输出构件（21）一体地模制在树脂层（23）中以形成开关装置（1），本发明寻求在不利用SF6气体的情况下实现介电强度，同时使整个装置更紧凑，并减少了成型所需的部件数量和工时。

10. 发明授权

US06906258B2 Enameled wire 有权
标题翻译：漆包线
公开(公告)号：US06906258B2
公开(公告)日：2005-06-14
申请号：US10619522
申请日：2003-07-16
申请人： Hisayuki Hirai , Susumu Kojima , Tamon Ozaki , Toshio Shimizu , Takahiro Imai , Hiroki Sekiya , Isao Onodera
发明人： Hisayuki Hirai , Susumu Kojima , Tamon Ozaki , Toshio Shimizu , Takahiro Imai , Hiroki Sekiya , Isao Onodera
IPC分类号： C09D7/12 , C09D179/08 , C09D201/00 , H01B3/00 , H01B3/30 , H01B3/42 , H01B3/44 , H01B7/00 , H01B7/02 , H01B7/29 , H01B7/34
CPC分类号： H01B3/421 , H01B3/305 , H01B3/446
摘要： An enameled wire capable of improving withstand lifetime with respect to the application of surge voltage of an inverter and thermal degradation thereof while restricting an amount of an inorganic filler material is provided. The enameled wire includes an electrically conductive wire (11) and a coating (12) formed of a high molecular compound uniformly mixed with an inorganic filler material in the form of fine flat particles provided around the electrically conductive wire (11). The enameled wire may include an electrically conductive wire (21), a coating (23) formed of a polyester imide resin solution mixed with an inorganic filler material in the form of fine flat particles and provided on the conductive wire and a coating (24) formed of polyamide imide and provided on the coating (23).
摘要翻译：提供一种能够在限制一定量的无机填充材料的同时提高耐逆变器的浪涌电压的耐久寿命及其热劣化的漆包线。漆包线包括导电线（11）和由设置在导电线（11）周围的细平坦颗粒形式的无机填料材料均匀混合的高分子化合物形成的涂层（12）。漆包线可以包括导电线（21），由聚酰亚胺树脂溶液形成的涂层（23），该聚酯酰亚胺树脂溶液与细平坦颗粒形式的无机填料混合并设置在导线上，涂层（24）由聚酰胺酰亚胺形成并提供在涂层（23）上。

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