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1. 发明授权

US06564451B2 Hole filling method for a printed wiring board 失效
公开(公告)号：US06564451B2
公开(公告)日：2003-05-20
申请号：US09924900
申请日：2001-08-08
申请人： Shigetoshi Abe , Tomoko Kato , Yasuo Sato , Takashi Itagaki , Kenji Matsumoto
发明人： Shigetoshi Abe , Tomoko Kato , Yasuo Sato , Takashi Itagaki , Kenji Matsumoto
IPC分类号： H05K336
CPC分类号： H05K3/0094 , H05K3/0097 , H05K2203/0278 , H05K2203/0557 , H05K2203/085 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/49165
摘要： On carrying out a hole filling method for a printed wiring board having an interlayer connection hole, first and second printed wiring boards (1 and 2) are prepared, each of which has the interlayer connection hole. The first printed wiring board is placed on a bottom plate (7). On the first printed wiring board, a first hole guide plate (8) having a first guide hole formed at a position corresponding to the interlayer connection hole of the first printed wiring board is placed in such a manner that the first guide hole is coincident with the interlayer connection hole of the first printed wiring board. A hole filling resin (9) is superposed on the first hole guide plate. On the hole filling resin, a second hole guide plate (10) having a second guide hole formed at a position corresponding to the interlayer connection hole of the second printed wiring board is placed. On the second hole guide plate, the second printed wiring board is placed in such a manner that the interlayer connection hole of the second printed wiring board is coincident with the second guide hole of the second hole guide plate. A top plate (11) is placed on the second printed wiring board to form a stacked assembly which includes the first printed wiring board, the first hole guide plate, the hole filling resin, the second hole guide plate, and the second printed wiring board between the bottom plate and the top plate. The stacked assembly is vacuum-pressed between the bottom plate and the top plate to simultaneously fill the interlayer connection holes of the first and the second printed wiring boards with a part of the hole filling resin.

2. 发明授权

US06794585B2 Printed circuit board having filled throughole with corner rounded portion and manufacturing method 有权
标题翻译：具有圆角部分的填充通孔的印刷电路板和制造方法
公开(公告)号：US06794585B2
公开(公告)日：2004-09-21
申请号：US10006547
申请日：2001-12-04
申请人： Shigetoshi Abe , Tomoko Kato , Yasuo Sato , Takashi Itagaki , Kenji Matsumoto
发明人： Shigetoshi Abe , Tomoko Kato , Yasuo Sato , Takashi Itagaki , Kenji Matsumoto
IPC分类号： H05K111
CPC分类号： H05K3/421 , H05K1/113 , H05K3/064 , H05K3/386 , H05K3/427 , H05K2201/0355 , H05K2201/0394 , H05K2201/09509 , H05K2201/09527 , H05K2203/063 , H05K2203/1394 , Y10T29/49156 , Y10T29/49213 , Y10T29/49218
摘要： A method includes the steps of forming a first metal foil (82) on a surface of an insulator substrate (1a), drilling, with a thermosetting resin film (84) temporarily fixed to an opposite surface of the substrate, a through hole (86) simultaneously in the first foil, the substrate, and the resin film, simultaneously heating and vacuum-pressing the first foil, the substrate, the resin film, and a second metal foil (87) brought into contact with the resin film to obtain an intermediate board in which a bottom of the through hole is covered with the second foil and has a corner with a corner rounded portion (93) formed by the resin film, and forming a metal plating layer (95) on the first and the second foils, on the bottom and an inner wall of the through hole, and on the corner rounded portion to obtain a final printed wiring board.
摘要翻译：一种方法包括以下步骤：在绝缘体基板（1a）的表面上形成第一金属箔（82），用临时固定到基板的相对表面的热固性树脂膜（84）进行钻孔;通孔（86））同时对第一箔，基板和树脂膜同时进行加热和真空压制第一箔，基板，树脂膜和与树脂膜接触的第二金属箔（87），以获得中间板，其中通孔的底部被第二箔覆盖，并且具有由树脂膜形成的角圆角部分（93）的拐角，并且在第一和第二箔上形成金属镀层（95），在通孔的底部和内壁上，并且在角落圆形部分上，以获得最终的印刷线路板。

3. 发明授权

US08912132B2 Thermally conductive silicone grease composition 有权
标题翻译：导热硅油组合物
公开(公告)号：US08912132B2
公开(公告)日：2014-12-16
申请号：US13806195
申请日：2011-06-16
申请人： Tomoko Kato , Kazumi Nakayoshi
发明人： Tomoko Kato , Kazumi Nakayoshi
IPC分类号： C10M169/04 , C10M125/10 , C08K3/18 , C08K3/22 , C08K3/34 , C10M155/02 , C08L83/04 , C09K5/14 , C08G77/50 , C08G77/20
CPC分类号： C10M125/10 , C08G77/20 , C08G77/50 , C08L83/04 , C09K5/14 , C10M155/02 , C10M2201/062 , C10M2229/0415 , C10M2229/0425 , C10M2229/0435 , C10M2229/0475 , C10N2230/02 , C10N2230/06 , C10N2240/20 , C10N2250/10 , C10N2210/03 , C10N2220/082 , C08L83/00
摘要： A thermally conductive silicone grease composition comprising at least the following components: (A) an organopolysiloxane which is liquid at 25° C. and is represented by the following average compositional formula: R1aSiO(4-a)/2, where, R1 is a monovalent hydrocarbon group; and “a” is a number ranging from 1.8 to 2.2; (B) a thermally conductive filler composed of constituents (B1) to (B3) given below, wherein: constituent (B1) is spherical aluminum oxide powder with an average particle diameter ranging from 15 to 55 μm; constituent (B2) is spherical aluminum oxide powder with an average particle diameter ranging from 2 to 10 μm; constituent (B3) is aluminum oxide powder with an average particle size not exceeding 1 μm; and (C) an alkoxysilyl-containing organopolysiloxane. The composition, along with high thermal conductivity, possesses excellent handleability and low coefficient of friction.
摘要翻译：一种导热硅脂组合物，其至少包含以下组分：（A）在25℃下为液体并由以下平均组成式表示的有机聚硅氧烷：R1aSiO（4-a）/ 2，其中R1为一价烃基; “a”是1.8到2.2之间的数字; （B）由以下给出的成分（B1）〜（B3）构成的导热性填料，其中，成分（B1）为平均粒径为15〜55μm的球状氧化铝粉末; 成分（B2）是平均粒径为2〜10μm的球状氧化铝粉末; 成分（B3）是平均粒径不超过1μm的氧化铝粉末; 和（C）含烷氧基甲硅烷基的有机聚硅氧烷。组合物以及高导热性具有优异的可操作性和低摩擦系数。

4. 发明授权

US08633276B2 Thermally conductive silicone composition and electronic device 有权
标题翻译：导热硅胶组合物和电子装置
公开(公告)号：US08633276B2
公开(公告)日：2014-01-21
申请号：US12994475
申请日：2009-05-12
申请人： Narumasa Domae , Tomoko Kato , Kazumi Nakayoshi
发明人： Narumasa Domae , Tomoko Kato , Kazumi Nakayoshi
IPC分类号： C08L83/06
CPC分类号： C08L83/04 , C08G77/14 , C08G77/18 , C08G77/20 , C08K5/56 , C08K2201/001 , C08L83/00 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A thermally conductive silicone composition of the invention comprises: (A) an organopolysiloxane having a viscosity of at least 500 mPa·s at 25° C.; (B) a thermally conductive filler; (C) a fine silica powder; (D) an organopolysiloxane having a hydrolyzable group and having a viscosity of less than 500 mPa·s at 25° C.; and (E) a silane compound containing a hydrolyzable group. The composition possesses excellent handleability and workability at low viscosity and which, after application onto surfaces, is not subject to slipping-off when this surface assumes a vertically position, even under harsh temperature conditions.
摘要翻译：本发明的导热硅氧烷组合物包含：（A）在25℃下粘度至少为500mPa·s的有机聚硅氧烷; （B）导热填料; （C）二氧化硅细粉; （D）在25℃下具有可水解基团且粘度小于500mPa·s的有机聚硅氧烷; 和（E）含有可水解基团的硅烷化合物。该组合物在低粘度下具有优异的可操作性和可加工性，并且在施加到表面上后，即使在苛刻的温度条件下，该表面呈垂直位置也不会滑脱。

5. 发明申请

US20130137613A1 Thermally Conductive Silicone Grease Composition 有权
标题翻译：导热硅油组合物
公开(公告)号：US20130137613A1
公开(公告)日：2013-05-30
申请号：US13806195
申请日：2011-06-16
申请人： Tomoko Kato , Kazumi Nakayoshi
发明人： Tomoko Kato , Kazumi Nakayoshi
IPC分类号： C10M125/10
CPC分类号： C10M125/10 , C08G77/20 , C08G77/50 , C08L83/04 , C09K5/14 , C10M155/02 , C10M2201/062 , C10M2229/0415 , C10M2229/0425 , C10M2229/0435 , C10M2229/0475 , C10N2230/02 , C10N2230/06 , C10N2240/20 , C10N2250/10 , C10N2210/03 , C10N2220/082 , C08L83/00
摘要： A thermally conductive silicone grease composition comprising at least the following components: (A) an organopolysiloxane which is liquid at 25° C. and is represented by the following average compositional formula: R1aSiO(4-a)/2, where, R1 is a monovalent hydrocarbon group; and “a” is a number ranging from 1.8 to 2.2; (B) a thermally conductive filler composed of constituents (B1) to (B3) given below, wherein: constituent (B1) is spherical aluminum oxide powder with an average particle diameter ranging from 15 to 55 μm; constituent (B2) is spherical aluminum oxide powder with an average particle diameter ranging from 2 to 10 μm; constituent (B3) is aluminum oxide powder with an average particle size not exceeding 1 μm; and (C) an alkoxysilyl-containing organopolysiloxane. The composition, along with high thermal conductivity, possesses excellent handleability and low coefficient of friction.
摘要翻译：一种导热硅脂组合物，其至少包含以下组分：（A）在25℃下为液体并由以下平均组成式表示的有机聚硅氧烷：R1aSiO（4-a）/ 2，其中R1为一价烃基; “a”是1.8到2.2之间的数字; （B）由以下给出的成分（B1）〜（B3）构成的导热性填料，其中，成分（B1）为平均粒径为15〜55μm的球状氧化铝粉末; 组分（B2）是平均粒径为2至10μm的球形氧化铝粉末; 成分（B3）是平均粒径不超过1μm的氧化铝粉末; 和（C）含烷氧基甲硅烷基的有机聚硅氧烷。组合物以及高导热性具有优异的可操作性和低摩擦系数。

6. 发明授权

US07994246B2 Curable silicone composition and electronic component 有权
标题翻译：可固化有机硅组合物和电子元件
公开(公告)号：US07994246B2
公开(公告)日：2011-08-09
申请号：US12520899
申请日：2007-12-14
申请人： Yoshitsugu Morita , Tomoko Kato
发明人： Yoshitsugu Morita , Tomoko Kato
IPC分类号： C08K5/1515 , C08K5/16
CPC分类号： H01L23/296 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/70 , C08L83/04 , C08L83/06 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/09701 , H01L2924/16152 , C08L83/00 , H01L2924/00 , H01L2224/0401
摘要： A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for epoxy resin; and (C) an epoxy compound represented by the specific general formula; is characterized by excellent handleability and reduced oil-bleeding, and, when cured, forms a cured body of excellent flexibility and adhesion.
摘要翻译：至少包含以下组分的可固化有机硅组合物：（A）含环氧基的有机聚硅氧烷; （B）环氧树脂固化剂; 和（C）由具体通式表示的环氧化合物; 其特征在于优异的可操作性和减少的渗油，并且当固化时形成具有优异的柔性和粘合性的固化体。

7. 发明申请

US20100301377A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE 有权
标题翻译：可固化的有机聚硅氧烷组合物和半导体器件
公开(公告)号：US20100301377A1
公开(公告)日：2010-12-02
申请号：US12438658
申请日：2007-07-24
申请人： Tomoko Kato , Yoshitsugu Morita , Shinichi Yamamoto , Toshio Saruyama
发明人： Tomoko Kato , Yoshitsugu Morita , Shinichi Yamamoto , Toshio Saruyama
IPC分类号： C09D183/04 , H01L33/52
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , C08L83/00 , H01L2924/00014
摘要： A curable organopolysiloxane composition comprising at least the following components: (A) a linear diorganopolysiloxane with a mass average molecular weight of at least 3,000, (B) a branched organopolysiloxane, (C) an organopolysiloxane having, on average, at least two silicon-bonded aryl groups and, on average, at least two silicon-bonded hydrogen atoms in one molecule, and (D) a hydrosilylation reaction catalyst; has excellent curability and, when cured, forms a flexible cured product of high refractive index, optical transmissivity, excellent adherence to various substrates, high hardness and slight surface tack.
摘要翻译：一种可固化的有机聚硅氧烷组合物，其至少包含以下组分：（A）质均分子量至少为3,000的直链二有机聚硅氧烷，（B）支链有机聚硅氧烷，（C）平均具有至少两个硅 - 在一个分子中平均具有至少两个与硅键合的氢原子，和（D）氢化硅烷化反应催化剂; 具有优异的固化性，并且当固化时形成高折射率，光透射性，对各种基材的优异粘附性，高硬度和轻微的表面粘性的柔性固化产物。

8. 发明授权

US07651887B2 Optical semiconductor device and method of manufacturing thereof 有权
标题翻译：光半导体装置及其制造方法
公开(公告)号：US07651887B2
公开(公告)日：2010-01-26
申请号：US11575835
申请日：2005-09-15
申请人： Yoshitsugu Morita , Tomoko Kato
发明人： Yoshitsugu Morita , Tomoko Kato
IPC分类号： H01L21/20
CPC分类号： C08L83/04 , B29C33/68 , B29C43/18 , B29C43/50 , C08G77/12 , C08G77/20 , C08G77/70 , H01L21/565 , H01L21/566 , H01L24/97 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01059 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： A method of manufacturing an optical semiconductor device (16) sealed in a transparent or semitransparent cured silicone body (50) by placing an unsealed optical semiconductor device (16) into a mold (23, 34) and subjecting a transparent or semitransparent curable silicone composition (50) that fills the spaces between the mold and the unsealed device (70) to compression molding; provides the sealed optical semiconductor device that is free of voids, allows control of the coating layer thickness, protects the bonding wires from breakage and accidental contact, reduces concentration of stress on an optical semiconductor element, has long service life with reducing discoloration and disconnection of the sealing resin from the optical semiconductor element (16), and has excellent reliability.
摘要翻译：一种通过将未密封的光学半导体器件（16）放置在模具（23,34）中并且对透明或半透明的固化的硅氧烷组合物（12）进行透明或半透明的固化的硅氧烷组合物（50），其填充所述模具和所述未密封装置（70）之间的空间以进行压缩成型; 提供无空隙的密封光学半导体器件，允许控制涂层厚度，保护接合线不会断裂和意外接触，降低光学半导体元件上的应力集中，具有较长的使用寿命，减少了变色和断开来自光学半导体元件（16）的密封树脂，并且具有优异的可靠性。

9. 发明申请

US20090118441A1 Curable Silicone Composition 有权
标题翻译：可固化硅酮组合物
公开(公告)号：US20090118441A1
公开(公告)日：2009-05-07
申请号：US12093053
申请日：2006-11-08
申请人： Shinichi Yamamoto , Tomoko Kato , Hiroji Enami , Yoshitsugu Morita
发明人： Shinichi Yamamoto , Tomoko Kato , Hiroji Enami , Yoshitsugu Morita
IPC分类号： C08L83/05
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L83/00 , C08K5/56
摘要： A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.
摘要翻译：至少包含以下组分的可固化的硅氧烷组合物：（A）在一个分子中具有至少两个烯基的二有机聚硅氧烷; （B）将至少两种具有不同质均分子量的树脂状有机聚硅氧烷降低成标准聚苯乙烯测量的凝胶渗透色谱法，并由SiO 4/2单元，R 12 R 2 SiO 1/2单元和R 13 SiO 1/2单元组成，其中R 1 是不含脂族不饱和键的任意取代的一价烃基，R 2是烯基; （C）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 具有优异的流动性和填充能力，并且即使组合物含有形成具有适当强度和硬度的固化的硅氧烷体所需的树脂状有机聚硅氧烷，也可以制备而不具有极高的粘度。

10. 发明授权

US5757649A CAD/CAM apparatus 失效
标题翻译： CAD / CAM设备
公开(公告)号：US5757649A
公开(公告)日：1998-05-26
申请号：US398647
申请日：1995-03-03
申请人： Tomoko Kato
发明人： Tomoko Kato
IPC分类号： G05B19/4097 , G05B19/18
CPC分类号： G05B19/4097 , G05B2219/35167 , G05B2219/35169 , G05B2219/35171 , G05B2219/35216 , G05B2219/35533 , G05B2219/45161 , G05B2219/45212 , G05B2219/45221 , Y02P90/265
摘要： A method to automatically operate a CAD/CAM apparatus corresponding to a plurality of machines. Machining definition data corresponding to machines is generated and stored as multiple machine inter-reference type machining definition data. Pre-defined data is referenced from the multiple machine inter-reference type machining definition data so as to automatically generate machining definition data corresponding to other machines. Specifically, by at least combining product graphic data and machining conditions, and utilizing two dimension and three dimension machining definition tables as required, shapes and machining conditions can be formed.
摘要翻译：一种自动操作对应于多台机器的CAD / CAM装置的方法。生成与机器对应的加工定义数据，并存储为多机器参考型加工定义数据。预定义的数据是从多机器参考型加工定义数据中引用的，以便自动生成对应于其他机器的加工定义数据。具体来说，通过至少组合产品图形数据和加工条件，并根据需要使用二维和三维加工定义表，可以形成形状和加工条件。

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