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1. 发明授权

US5568264A Exterior view inspecting apparatus for circuit board 失效
标题翻译：电路板外观检查装置
公开(公告)号：US5568264A
公开(公告)日：1996-10-22
申请号：US515624
申请日：1995-08-16
申请人： Shigeki Nakatsuka , Iwao Ichikawa , Manabu Morioka , Kenji Kato , Takayuki Fujita , Shigetoshi Negishi , Kazuhiro Shiga
发明人： Shigeki Nakatsuka , Iwao Ichikawa , Manabu Morioka , Kenji Kato , Takayuki Fujita , Shigetoshi Negishi , Kazuhiro Shiga
IPC分类号： B23P21/00 , G06T1/00 , H05K13/08 , G01B11/00
CPC分类号： H05K13/08
摘要： The exterior view inspecting apparatus for circuit board of the invention including a sensor unit for emitting a laser beam to an object to be inspected, and detecting the displacement of the object by focusing the reflected light on a photoelectric transducer by using a receiving lens; an optical path converter unit for refracting the optical path of the laser beam; a sensor head unit incorporating the sensor unit and optical path converter unit; a control unit for moving the sensor head unit along a specified scanning route; a correction unit for correcting the displacement data of the object to be inspected as detected by the sensor unit, and a judging unit for judging the existence and position of an electronic component on a circuit board from the corrected displacement data. The optical path converter unit includes a flat sheet glass inclined relative to the optical path of the laser beam, rotating about the axial center parallel to the optical path. By this optical path converter unit, the optical path of the laser beam is refracted so that the laser beam scans the circuit board drawing a small circular trace. As the trace draws a small circle, the trace detects the end portion of the electronic component on the circuit board multiple times. Consequently, the existence and position of the electronic component on the circuit board can be detected accurately.
摘要翻译：本发明的电路板外观检查装置包括：用于向待检查物体发射激光束的传感器单元，以及通过使用接收透镜将反射光聚焦在光电变换器上来检测物体的位移; 用于折射激光束的光路的光路转换器单元; 包括传感器单元和光路转换器单元的传感器头单元; 控制单元，用于沿着指定的扫描路线移动所述传感器头单元; 校正单元，用于校正由传感器单元检测到的待检查对象的位移数据;以及判断单元，用于根据校正的位移数据判断电路板上的电子部件的存在和位置。光路转换器单元包括相对于激光束的光路倾斜的平板玻璃，围绕平行于光路的轴向中心旋转。通过该光路转换器单元，激光束的光路被折射，使得激光束扫描电路板，绘制小的圆形迹线。轨迹绘制小圆时，轨迹会多次检测电路板上电子元件的端部。因此，可以精确地检测电子部件在电路板上的存在和位置。

2. 发明授权

US5525023A Chip component supply apparatus 失效
标题翻译：芯片组件供应装置
公开(公告)号：US5525023A
公开(公告)日：1996-06-11
申请号：US164713
申请日：1993-12-10
申请人： Tomitatu Soga , Kunio Tanaka , Shigetoshi Negishi , Hidekazu Nakamura , Hiroyuki Fujiwara , Kenji Kato , Takayuki Fujita , Takashi Nakanishi
发明人： Tomitatu Soga , Kunio Tanaka , Shigetoshi Negishi , Hidekazu Nakamura , Hiroyuki Fujiwara , Kenji Kato , Takayuki Fujita , Takashi Nakanishi
IPC分类号： H05K13/02 , B65G47/14
CPC分类号： H05K13/022
摘要： A chip component supply apparatus of the invention includes a container box for storing chip components in pieces, a means for conveying chip components from the container box onto a conveyor belt, which moves intermittently and conveys the transferred chip components toward a take-out port area where a vacuum suction nozzle of an electronic component placement machine takes out the chip components. A stopper is positioned in the vicinity of the take-out port area for stopping the chip components conveyed by the conveyor belt at the take-out port area. The stopper moves and departs from the vicinity of the take-out port area when the conveyor belt finishes intermittent motion and stops, and returns and is positioned at the take-out port area before the next chip component conveyed by next intermittent motion of the conveyor belt reaches the take-out port area. The vacuum suction nozzle of the electronic component placement machine takes out the chip component at the take-out port area when the conveyor belt is stopped and the stopper is apart from the take-out port area.
摘要翻译：本发明的芯片部件供给装置包括用于将芯片部件成块地容纳的容器盒，用于将片状部件从容器盒输送到输送带上的装置，该传送带间歇地移动并将传送的芯片部件传送到取出口区域电子元件贴装机的真空吸嘴取出芯片部件。止动器位于取出口区域附近，用于将由输送带输送的芯片部件停止在取出口区域。当传送带完成间歇运动并停止时，挡块移动并离开取出口区域附近，并在通过传送带的下一次间歇运动传送的下一个芯片部件之前返回并定位在出口端口区域皮带到达取出口区域。当输送带停止时，电子元件贴装机的真空吸嘴在取出口区域取出芯片部件，止动件与取出口区域分开。

3. 发明授权

US5752628A Chip-type electronic part storage casing and supply cassette using same 失效
标题翻译：芯片型电子部件储存壳体和使用其的供给盒
公开(公告)号：US5752628A
公开(公告)日：1998-05-19
申请号：US532661
申请日：1995-10-13
申请人： Takeshi Nishiguchi , Kenji Kato , Takayuki Fujita , Shigetoshi Negishi , Kunio Tanaka , Takashi Nakanishi , Takatoshi Mitsushima , Manabu Morita
发明人： Takeshi Nishiguchi , Kenji Kato , Takayuki Fujita , Shigetoshi Negishi , Kunio Tanaka , Takashi Nakanishi , Takatoshi Mitsushima , Manabu Morita
IPC分类号： H05K13/00 , H05K13/02 , B67D5/06
CPC分类号： H05K13/028 , H05K13/0084
摘要： A chip-type electronic part storage casing includes a storage portion for storing chip-type electronic parts in a loose condition; an opening formed in a lower surface of the storage portion for discharging the electronic parts; a shutter for opening and closing the opening; and a scatter prevention member within the storage portion for preventing the electronic parts from being scattered in the storage portion. Additionally, a supply cassette includes a hopper provided at a lower portion thereof and having a storage portion for storing chip-type electronic parts charged therein through an opening in an upper surface thereof, a central portion of the storage portion being recessed to provide an inclined surface for gathering the electronic parts; an interrupting plate mounted within the storage portion in an inclined manner, a gap for allowing the passage of the electronic parts therethrough formed between one end of said interrupting plate and the inclined surface of the storage portion; a discharge pipe for discharging the electronic parts, the discharge pipe extending from the exterior of the hopper through a lower surface of the hopper to the storage portion, and being connected to the storage portion; a slide pipe slidably fitted on an outer periphery of the discharge pipe; and engagement ribs formed on the upper surface of the storage portion. A chip-type electronic part storage casing is further connected to an upper portion of the hopper through the engagement ribs.
摘要翻译： PCT No.PCT / JP95 / 00201 Sec。 371 1995年10月13日第 102（e）日期1995年10月13日PCT 1995年2月14日提交PCT公布。出版物WO95 / 22242 日期：1995年8月17日芯片型电子部件存储壳体包括用于在松散状态下存储芯片型电子部件的存储部分; 在所述收纳部的下表面形成的开口，用于排出所述电子部件; 用于打开和关闭开口的快门; 以及在所述存储部分内的用于防止所述电子部件在所述存储部分中散射的散射防止部件。此外，供给盒包括设置在其下部的料斗，并且具有用于储存通过其上表面中的开口装入其中的芯片型电子部件的存储部分，存储部分的中心部分被凹入以提供倾斜用于收集电子部件的表面; 以倾斜的方式安装在存储部分内的中断板，用于允许电子部件通过的间隙，形成在所述中断板的一端和存储部分的倾斜表面之间; 用于排出电子部件的排出管，排出管从料斗的外部通过料斗的下表面延伸到储存部分，并连接到储存部分; 可滑动地安装在排出管的外周上的滑动管; 以及形成在存储部分的上表面上的接合肋。芯片型电子部件存放壳体还通过接合肋连接到料斗的上部。

4. 发明申请

US20150079505A1 ALKALINE-DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED ARTICLE, AND PRINTED WIRING BOARD 审中-公开
标题翻译：碱性可开发的感光树脂组合物，干膜，固化物和印刷线路板
公开(公告)号：US20150079505A1
公开(公告)日：2015-03-19
申请号：US14394179
申请日：2012-08-15
申请人： Kenji Kato
发明人： Kenji Kato
IPC分类号： G03F7/038
CPC分类号： G03F7/0385 , G03F7/027 , G03F7/032 , G03F7/0388 , G03F7/322 , H05K3/281 , H05K3/287 , H05K3/3452
摘要： Provided is an alkaline developable photosensitive resin composition which does not contain crude particles, has excellent storage stability, can avoid the deterioration of working environments, and contains few substances toxic to human bodies. The alkaline developable photosensitive resin composition is characterized by comprising (A) a resin containing a carboxyl group, (B) a photopolymerization initiator, (C) a compound having at least two ethylenically unsaturated groups per molecule, and (D) a dibasic acid ester.
摘要翻译：本发明提供一种不含粗粒子的碱性显影性感光性树脂组合物，具有优良的储存稳定性，能够避免工作环境恶化，并且含有少量对人体有毒的物质。碱性显影性感光性树脂组合物的特征在于，包含（A）含有羧基的树脂，（B）光聚合引发剂，（C）每分子具有至少2个烯属不饱和基团的化合物，（D）二元酸酯。

5. 发明申请

US20140302341A1 HOT PRESS MOLDING METHOD, ARTICLE MOLDED BY HOT PRESS MOLDING, AND MOLD FOR HOT PRESSING 审中-公开
标题翻译：热压成型方法，通过热压成型制成的模具和热压模具
公开(公告)号：US20140302341A1
公开(公告)日：2014-10-09
申请号：US14353624
申请日：2011-12-26
申请人： Tetsuji Egawa , Takanobu Suzuki , Hidetoshi Kimura , Hideaki Ikezawa , Kenji Kato , Masaki Furuhashi
发明人： Tetsuji Egawa , Takanobu Suzuki , Hidetoshi Kimura , Hideaki Ikezawa , Kenji Kato , Masaki Furuhashi
IPC分类号： B21J5/02
CPC分类号： B21J5/02 , B21D22/022 , B21D22/208 , B21D37/16 , B21D53/88 , Y10T428/12389
摘要： In a hot press molding method for press-molding a heated material and cooling the material while holding the material in a mold, during press molding of the material, shape changes including a portion that curves with respect to a longitudinal direction of the material are molded at longitudinal opposite end portions of the material and resistance to thermal contraction force of the material in the longitudinal direction during cooling is imparted. In one embodiment of the present invention, the shape changes molded on the material during the press molding are minute protrusions provided on surfaces of the longitudinal opposite end portions of the material. The invention makes it possible to suppress thermal contraction of the material during cooling in hot press molding to thereby prevent defects associated therewith.
摘要翻译：在加热材料的压制成型并将材料保持在模具中的同时冷却材料的热压成型方法中，在材料的压制成型期间，包括相对于材料的纵向方向弯曲的部分的形状变化在材料的纵向相对端部处，并且赋予材料在冷却期间在纵向方向上的热收缩力的能力。在本发明的一个实施例中，在压制成型期间模制在材料上的形状变化是在材料的纵向相对端部的表面上设置的微小突起。本发明可以抑制热压成型时的冷却过程中材料的热收缩，从而防止与其相关的缺陷。

6. 发明申请

US20130081798A1 HEAT SINK, AND METHOD FOR PRODUCING SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20130081798A1
公开(公告)日：2013-04-04
申请号：US13700566
申请日：2011-03-25
申请人： Kenji Kato , Shigetoshi Ipposhi , Toshiki Tanaka , Shinya Motokawa , Toshio Nakayama , Masafumi Ibushi
发明人： Kenji Kato , Shigetoshi Ipposhi , Toshiki Tanaka , Shinya Motokawa , Toshio Nakayama , Masafumi Ibushi
IPC分类号： F28F3/04
CPC分类号： F28F3/04 , F28D2021/0029 , H01L23/467 , H01L2924/0002 , H05K7/20163 , H01L2924/00
摘要： A heat sink including a base section, connection fins, and parallel fins. The base section includes: a first base plate configured to be mounted with a heat generating component on its outer surface; a second base plate disposed to face the first base plate in a parallel manner, configured to be mounted with a heat generating component on its outer surface; and a third base plate disposed perpendicular to the first base plate and the second base plate, which secures the first base plate and the second base plate along a junction line. The base section includes first and second regions arranged in the direction of the junction line. The connection fins are disposed on the first region to connect inner surfaces of the first and second base plates and to be parallel to the third base plate, and the parallel fins are disposed on the second region from an inner surface of the third base plate to be parallel to the first base plate.
摘要翻译：散热器，包括基部，连接翅片和平行翅片。基部包括：构造成在其外表面上安装有发热部件的第一基板; 以平行方式设置为与所述第一基板相对地配置的第二基板，构造成在其外表面上安装有发热部件; 以及垂直于第一基板和第二基板设置的第三基板，其将第一基板和第二基板沿着接合线固定。基部包括在接合线的方向上布置的第一和第二区域。连接翅片设置在第一区域上以连接第一和第二基板的内表面并平行于第三基板，并且平行翅片从第三基板的内表面设置在第二区域上平行于第一基板。

7. 发明授权

US08377274B2 Gas sensor and method for manufacturing the same 有权
标题翻译：气体传感器及其制造方法
公开(公告)号：US08377274B2
公开(公告)日：2013-02-19
申请号：US12463625
申请日：2009-05-11
申请人： Seiji Ohya , Tomohiro Wakazono , Kenji Kato , Koji Shiotani
发明人： Seiji Ohya , Tomohiro Wakazono , Kenji Kato , Koji Shiotani
IPC分类号： G01N27/407
CPC分类号： G01N27/4075
摘要： A gas sensor including a gas sensor element having a first measurement chamber (16); a first pumping cell (11); a second measurement chamber (18) into which a gas to be measured having a controlled oxygen partial pressure is introduced; and a second pumping cell (13) having a second inner pump electrode (13b) and a second counterpart electrode (13c) pump electrode configured to detect a specific gas component. The second inner pump electrode is made of a material that contains, as a principal ingredient, two kinds of Pt particles having different particle sizes and whose particle size ratio measured by a sedimentation particle-size distribution ranges from 1.75 to 14.2. A mixing ratio between large Pt particles and small Pt particles has a mass ratio of 10/90 to 50/50. A 10 kHz-1 Hz resistance value across the second pumping cell at 600° C. is 150Ω or less.
摘要翻译：一种气体传感器，包括具有第一测量室（16）的气体传感器元件; 第一泵送单元（11）; 引入具有受控氧分压的待测气体的第二测量室（18）; 以及具有第二内泵电极（13b）和配置成检测特定气体成分的第二配对电极（13c）泵浦电极的第二泵浦电池（13）。第二内泵电极由含有不同粒径的两种Pt颗粒作为主要成分的材料制成，其沉降粒度分布测定的粒径比为1.75〜14.2。大Pt颗粒和小Pt颗粒之间的混合比的质量比为10/90至50/50。在600℃下跨越第二抽滤单元的10kHz-1Hz电阻值为150＆OHgr; 或更少。

8. 发明授权

US07988835B2 Silicon dot forming method and silicon dot forming apparatus 失效
标题翻译：硅点形成方法和硅点形成装置
公开(公告)号：US07988835B2
公开(公告)日：2011-08-02
申请号：US11519154
申请日：2006-09-12
申请人： Eiji Takahashi , Takashi Mikami , Shigeaki Kishida , Kenji Kato , Atsushi Tomyo , Tsukasa Hayashi , Kiyoshi Ogata , Yuichi Setsuhara
发明人： Eiji Takahashi , Takashi Mikami , Shigeaki Kishida , Kenji Kato , Atsushi Tomyo , Tsukasa Hayashi , Kiyoshi Ogata , Yuichi Setsuhara
IPC分类号： C23C14/00 , C23C14/32 , C23C16/00 , C23C16/50
CPC分类号： C23C16/24 , H01L21/02381 , H01L21/02488 , H01L21/02532 , H01L21/02601 , H01L21/02631
摘要： There are provided a method and an apparatus which form silicon dots having substantially uniform particle diameters and exhibiting a substantially uniform density distribution directly on a substrate at a low temperature. A hydrogen gas (or a hydrogen gas and a silane-containing gas) is supplied into a vacuum chamber (1) provided with a silicon sputter target (e.g., target 30), or the hydrogen gas and the silane-containing gas are supplied into the chamber (1) without arranging the silicon sputter target therein, a high-frequency power is applied to the gas(es) so that plasma is generated such that a ratio (Si(288 nm)/Hβ) between an emission intensity Si(288 nm) of silicon atoms at a wavelength of 288 nm and an emission intensity Hβ of hydrogen atoms at a wavelength of 484 nm in plasma emission is 10.0 or lower, and preferably 3.0 or lower, or 0.5 or lower, and silicon dots (SiD) having particle diameters of 20 nm or lower, or 10 nm or lower are formed directly on the substrate (S) at a low temperature of 500 deg. C. or lower in the plasma (and with chemical sputtering if a silicon sputter target is present).
摘要翻译：提供了形成具有基本上均匀的粒径并且在低温下直接在基底上表现出基本均匀的密度分布的硅点的方法和装置。将氢气（或氢气和含硅烷气体）供给到设置有硅溅射靶（例如，靶30）的真空室（1）中，或者将氢气和含硅烷的气体供应到在不将硅溅射靶设置在其中的腔室（1）中，向气体施加高频功率，从而产生等离子体，使得发射强度Si（288nm）的比率（Si（288nm）/ H＆bgr））（288nm）的波长288nm的硅原子和发光强度H＆bgr; 的等离子体发射波长为484nm的氢原子为10.0以下，优选为3.0以下，或0.5以下，形成粒径为20nm以下或10nm以下的硅点（SiD）在500度的低温下直接在基板（S）上。在等离子体中（如果存在硅溅射靶，则具有化学溅射）。

9. 发明授权

US07880392B2 Plasma producing method and apparatus as well as plasma processing apparatus 有权
标题翻译：等离子体制造方法和装置以及等离子体处理装置
公开(公告)号：US07880392B2
公开(公告)日：2011-02-01
申请号：US11586583
申请日：2006-10-26
申请人： Kenji Kato , Hiroshige Deguchi , Hitoshi Yoneda , Kiyoshi Kubota , Akinori Ebe , Yuichi Setsuhara
发明人： Kenji Kato , Hiroshige Deguchi , Hitoshi Yoneda , Kiyoshi Kubota , Akinori Ebe , Yuichi Setsuhara
IPC分类号： C23C16/00
CPC分类号： H01J37/32954 , H01J37/321 , H01J37/32174
摘要： Plasma producing method and apparatus wherein a plurality of high-frequency antennas are arranged in a plasma producing chamber, and a high-frequency power supplied from a high-frequency power supply device (including a power source, a phase controller and the like) is applied to a gas in the chamber from the antennas to produce inductively coupled plasma. At least some of the plurality of high-frequency antennas are arranged in a fashion of such parallel arrangement that the antennas successively neighbor to each other and each of the antennas is opposed to the neighboring antenna. The high-frequency power supply device controls a phase of a high-frequency voltage applied to each antenna, and thereby controls an electron temperature of the inductively coupled plasma.
摘要翻译：等离子体制造方法和装置，其中多个高频天线布置在等离子体产生室中，并且从高频电源装置（包括电源，相位控制器等）提供的高频电力是从天线施加到腔室中的气体以产生电感耦合等离子体。多个高频天线中的至少一些以这样的并行布置的方式布置，使得天线彼此相邻并且每个天线与相邻天线相对。高频电源装置控制施加到每个天线的高频电压的相位，从而控制感应耦合等离子体的电子温度。

10. 发明申请

US20110012068A1 Process for producing fine silver particle colloidal dispersion, fine silver particle colloidal dispersion, and conductive silver film 失效
标题翻译：用于生产细银颗粒胶体分散体，细银颗粒胶体分散体和导电银膜的方法
公开(公告)号：US20110012068A1
公开(公告)日：2011-01-20
申请号：US12805162
申请日：2010-07-15
申请人： Kenji Kato , Masaya Yukinobu
发明人： Kenji Kato , Masaya Yukinobu
IPC分类号： H01B1/02 , C09D5/16
CPC分类号： B22F1/0022 , B22F9/24 , B22F2998/00 , B82Y30/00 , H01B1/22 , Y10S977/773 , Y10S977/777
摘要： A process for producing a fine silver particle colloidal dispersion which can simply form conductive silver layers and antimicrobial coatings by screen printing or the like. The process is characterized by having a reaction step of allowing an aqueous silver nitrate solution to react with a mixed solution of an aqueous iron(II) sulfate solution and an aqueous sodium citrate solution to form an agglomerate of fine silver particles, a filtration step of filtering the resultant agglomerate of fine silver particles to obtain a cake of the agglomerate of fine silver particles, a dispersion step of adding pure water to the cake to obtain a first fine silver particle colloidal dispersion of a water system in which dispersion the fine silver particles have been dispersed in the pure water, and a concentration and washing step of concentrating and washing the first fine silver particle colloidal dispersion of a water system.
摘要翻译：一种能够通过丝网印刷等简单地形成导电性银层和抗菌涂层的细银粒子胶体分散体的制造方法。该方法的特征在于具有使硝酸银水溶液与硫酸铁水溶液和柠檬酸钠水溶液的混合溶液反应以形成细银颗粒的附聚物的反应步骤，过滤步骤过滤所得到的细银粒子附聚物，得到细银粒子附聚物的饼状物;分散步骤，向滤饼中加入纯水，得到水系的第一微细银粒子胶体分散液，其中分散有细银粒子已经分散在纯水中，以及浓缩和洗涤水系的第一细银粒子胶体分散体的浓缩和洗涤步骤。

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