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    • 7. 发明授权
    • Method for forming a tri-gate MOSFET
    • 形成三栅极MOSFET的方法
    • US06998301B1
    • 2006-02-14
    • US10653225
    • 2003-09-03
    • Bin YuShibly S. Ahmed
    • Bin YuShibly S. Ahmed
    • H01L21/00H01L21/84
    • H01L21/02672H01L21/02488H01L21/02502H01L21/02532H01L21/2022H01L29/66545H01L29/66795H01L29/785
    • A method for forming a tri-gate semiconductor device that includes a substrate and a dielectric layer formed on the substrate includes depositing a first dielectric layer on the dielectric layer and etching the first dielectric layer to form a structure. The method further includes depositing a second dielectric layer over the structure, depositing an amorphous silicon layer over the second dielectric layer, etching the amorphous silicon layer to form amorphous silicon spacers, where the amorphous silicon spacers are disposed on opposite sides of the structure, depositing a metal layer on at least an upper surface of each of the amorphous silicon spacers, annealing the metal layer to convert the amorphous silicon spacers to crystalline silicon fin structures, removing a portion of the second dielectric layer, depositing a gate material, and etching the gate material to form three gates.
    • 一种形成三栅极半导体器件的方法,包括在衬底上形成的衬底和电介质层,包括在电介质层上沉积第一介电层并蚀刻第一介电层以形成结构。 该方法还包括在结构上沉积第二介电层,在第二介电层上沉积非晶硅层,蚀刻非晶硅层以形成非晶硅间隔物,其中非晶硅间隔物设置在结构的相对侧上,沉积 在每个非晶硅间隔物的至少上表面上的金属层,退火金属层以将非晶硅间隔物转化为晶体硅鳍结构,去除第二电介质层的一部分,沉积栅极材料,并蚀刻 门材料形成三门。