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1. 发明申请

US20100155023A1 HEAT DISSIPATION APPARATUS HAVING HEAT PIPES INSERTED THEREIN 审中-公开
标题翻译：具有其中的热管的散热装置
公开(公告)号：US20100155023A1
公开(公告)日：2010-06-24
申请号：US12423816
申请日：2009-04-15
申请人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
IPC分类号： F28F7/00 , F28D15/00
CPC分类号： F28D15/0233 , F28D15/0266 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus includes a base, a heat sink on the base, two heat pipes thermally connecting the base and the heat sink and a fan mounted in the heat sink. The heat sink comprises a first fin group placed on the base and a second fin group located on the first fin group. Each heat pipe comprises an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section. The condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan.
摘要翻译：散热装置包括底座，基座上的散热器，热连接底座和散热器的两个热管和安装在散热器中的风扇。散热器包括放置在基座上的第一翅片组和位于第一翅片组上的第二翅片组。每个热管包括连接到基座的蒸发部分，冷凝部分和互连蒸发部分和冷凝部分的绝热部分。热管的冷凝部分夹在第一和第二翅片组之间并围绕风扇。

2. 发明授权

US07916469B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07916469B2
公开(公告)日：2011-03-29
申请号：US12436786
申请日：2009-05-07
申请人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
发明人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H01L23/467 , F28D15/0266 , F28D15/0275 , F28F2215/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.
摘要翻译：适于冷却安装在印刷线路板上的电子装置的散热装置包括热接触电子装置的散热器，包括多个散热片的散热片组件，将翅片组件和散热器互连的第一热管和多个插入翅片组件中的支撑柱。

3. 发明授权

US07779895B2 Protective device for protecting thermal interface material and fasteners of heat dissipation device 有权
标题翻译：用于保护散热装置的热界面材料和紧固件的保护装置
公开(公告)号：US07779895B2
公开(公告)日：2010-08-24
申请号：US12102016
申请日：2008-04-14
申请人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu
发明人： Shi-Wen Zhou , Jun Cao , Qing-Song Xu
IPC分类号： F28F7/00
CPC分类号： F28D15/0275 , F28F2265/02 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.
摘要翻译：散热装置组件包括用于从电子元件散发热量的散热装置和保护装置组件。所述散热装置包括具有贯穿其中的紧固件的基座，布置在所述基座的顶部上的多个翅片以及附接在所述基座的底部上的导热板。热界面材料散布在导热板的底表面上。保护装置组件包括附接到导热板的底部的第一盖和与第一盖分离并连接到基部的侧面的第二盖。当散热装置运输时，第一盖保护热界面材料免受污染，并且第二盖保护紧固件免于从基座掉落。

4. 发明授权

US08251132B2 Heat sink assembly and method for manufacturing the same 有权
标题翻译：散热器组件及其制造方法
公开(公告)号：US08251132B2
公开(公告)日：2012-08-28
申请号：US12056298
申请日：2008-03-27
申请人： Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
发明人： Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F1/32 , F28D15/02
CPC分类号： F28F1/32 , F28D15/0266 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
摘要翻译：散热器组件包括基座，翅片组和与基座和翅片组连接的热管。翅片组包括多个翅片。每个翅片在其下部限定凹部。热管包括延伸穿过基座的蒸发部分和延伸穿过翅片组的冷凝部分。基座沿圆周方向嵌合在翅片的凹槽中。基座，翅片组和热管直接相互紧密连接。凹槽和底座具有相应的T形轮廓。每个翅片形成限定凹部的弯曲凸缘。弯曲的法兰与基座和热管的蒸发部分紧密接触。

5. 发明授权

US07609522B2 Heat sink assembly 失效
标题翻译：散热器组件
公开(公告)号：US07609522B2
公开(公告)日：2009-10-27
申请号：US11566020
申请日：2006-12-01
申请人： Zhao Jin , Jun Cao , Shi-wen Zhou , Chun-Chi Chen
发明人： Zhao Jin , Jun Cao , Shi-wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/4006 , F28F3/02 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slot (1220) therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.
摘要翻译：与ATX母板（20）和BTX母板（30）兼容的散热器组件（10）包括散热器和延伸穿过散热器的多个紧固件（15）。散热器包括在其中限定狭槽（1220）的基部（12）。紧固件能够在第一位置与第二位置之间沿狭槽滑动，以使得根据本发明的优选实施例的散热器组件适于与ATX主板或BTX主板一起使用。

6. 发明申请

US20080130233A1 HEAT SINK ASSEMBLY 失效
标题翻译：散热装置
公开(公告)号：US20080130233A1
公开(公告)日：2008-06-05
申请号：US11566020
申请日：2006-12-01
申请人： Zhao Jin , Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
发明人： Zhao Jin , Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , F28F3/02 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slot (1220) therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.
摘要翻译：与ATX母板（20）和BTX母板（30）兼容的散热器组件（10）包括散热器和延伸穿过散热器的多个紧固件（15）。散热器包括在其中限定狭槽（1220）的基部（12）。紧固件能够在第一位置与第二位置之间沿狭槽滑动，以使得根据本发明的优选实施例的散热器组件适于与ATX主板或BTX主板一起使用。

7. 发明授权

US07633755B2 Heat dissipation device assembly with a fan duct having guiding members for guiding a screwdriver to assemble the heat dissipation device assembly to a printed circuit board 失效
标题翻译：具有风扇导管的散热装置组件，其具有用于引导螺丝刀的引导构件以将散热装置组件组装到印刷电路板
公开(公告)号：US07633755B2
公开(公告)日：2009-12-15
申请号：US11940937
申请日：2007-11-15
申请人： Shi-Wen Zhou , Jun Cao , Jie-Cheng Deng
发明人： Shi-Wen Zhou , Jun Cao , Jie-Cheng Deng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink (10) contacting one of the electronic components, a pair of fans (20) attached on a lateral side of the heat sink, and a fan duct (30) fixed on the fans. A plurality of guiding members (322, 346) are formed inwardly from the fan duct to be located in an interior of the fan duct. The guiding members are used for guiding a screwdriver (40) to accurately fit with screws (50) preassembled to the heat sink. Thus, the screws can be quickly and easily fastened by the screwdriver to mount the heat dissipation device assembly on the printed circuit board.
摘要翻译：一种用于从安装在印刷电路板上的多个电子部件散热的散热装置组件，包括接触电子部件之一的散热片（10），一对安装在热源外侧的风扇（20）水槽和固定在风扇上的风扇导管（30）。多个引导构件（322,346）从风扇通道向内形成以位于风扇通道的内部。引导构件用于引导螺丝刀（40）以精确地配合预先组装到散热器的螺钉（50）。因此，可以通过螺丝刀快速方便地固定螺钉，以将散热装置组件安装在印刷电路板上。

8. 发明授权

US07610950B2 Heat dissipation device with heat pipes 失效
标题翻译：带热管的散热装置
公开(公告)号：US07610950B2
公开(公告)日：2009-11-03
申请号：US11557917
申请日：2006-11-08
申请人： Jun Cao , Zhan Wu , Shi-Wen Zhou
发明人： Jun Cao , Zhan Wu , Shi-Wen Zhou
IPC分类号： H01L23/427 , F28D15/02
CPC分类号： H01L23/467 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.
摘要翻译：一种散热装置，包括第一基板（10），布置在第一基板上的翅片组（30），安装在第一基板和翅片组上的第一热管（50）和第二热管）连接在第一基板上并延伸穿过翅片组。第一和第二热管中的每一个包括吸收部分和消散部分。第一和第二热管的吸收部分为L形并且在相反方向上定向，并且第一和第二热管的散热部分彼此垂直取向，由此附接有电子部件的第一基板的热量可以从第一基板到散热片组的更多不同的散热路径。

9. 发明申请

US20080105411A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 失效
标题翻译：带热管的散热装置
公开(公告)号：US20080105411A1
公开(公告)日：2008-05-08
申请号：US11557917
申请日：2006-11-08
申请人： Jun Cao , Zhan Wu , Shi-Wen Zhou
发明人： Jun Cao , Zhan Wu , Shi-Wen Zhou
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.
摘要翻译：一种散热装置，包括第一基板（10），布置在第一基板上的翅片组（30），安装在第一基板和翅片组上的第一热管（50）和第二热管）连接在第一基板上并延伸穿过翅片组。第一和第二热管中的每一个包括吸收部分和消散部分。第一和第二热管的吸收部分为L形并且在相反方向上定向，并且第一和第二热管的散热部分彼此垂直取向，由此附接有电子部件的第一基板的热量可以从第一基板到散热片组的更多不同的散热路径。

10. 发明授权

US08047266B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08047266B2
公开(公告)日：2011-11-01
申请号：US12138439
申请日：2008-06-13
申请人： Shi-Wen Zhou , Jun Cao , Wei-Ping Gong
发明人： Shi-Wen Zhou , Jun Cao , Wei-Ping Gong
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink.
摘要翻译：一种散热装置，包括第一散热器，位于第一散热器上的第二散热器，位于第二散热器上的第三散热器，以及通过弯曲平板状部件而形成的导热部件，第一，第二和第三散热片。导热构件包括与第一散热器接触的吸热部分，以及分别从吸热部分的两端向上延伸的第一和第二连接部分的上端向内延伸的第一和第二散热部分。第一散热部分夹在第一和第二散热片之间，第二散热部分夹在第二和第三散热片之间。第一和第二散热部分的宽度与第二散热器的宽度相同。

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