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1. 发明授权

US07610950B2 Heat dissipation device with heat pipes 失效
标题翻译：带热管的散热装置
公开(公告)号：US07610950B2
公开(公告)日：2009-11-03
申请号：US11557917
申请日：2006-11-08
申请人： Jun Cao , Zhan Wu , Shi-Wen Zhou
发明人： Jun Cao , Zhan Wu , Shi-Wen Zhou
IPC分类号： H01L23/427 , F28D15/02
CPC分类号： H01L23/467 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.
摘要翻译：一种散热装置，包括第一基板（10），布置在第一基板上的翅片组（30），安装在第一基板和翅片组上的第一热管（50）和第二热管）连接在第一基板上并延伸穿过翅片组。第一和第二热管中的每一个包括吸收部分和消散部分。第一和第二热管的吸收部分为L形并且在相反方向上定向，并且第一和第二热管的散热部分彼此垂直取向，由此附接有电子部件的第一基板的热量可以从第一基板到散热片组的更多不同的散热路径。

2. 发明申请

US20080105411A1 HEAT DISSIPATION DEVICE WITH HEAT PIPES 失效
标题翻译：带热管的散热装置
公开(公告)号：US20080105411A1
公开(公告)日：2008-05-08
申请号：US11557917
申请日：2006-11-08
申请人： Jun Cao , Zhan Wu , Shi-Wen Zhou
发明人： Jun Cao , Zhan Wu , Shi-Wen Zhou
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.
摘要翻译：一种散热装置，包括第一基板（10），布置在第一基板上的翅片组（30），安装在第一基板和翅片组上的第一热管（50）和第二热管）连接在第一基板上并延伸穿过翅片组。第一和第二热管中的每一个包括吸收部分和消散部分。第一和第二热管的吸收部分为L形并且在相反方向上定向，并且第一和第二热管的散热部分彼此垂直取向，由此附接有电子部件的第一基板的热量可以从第一基板到散热片组的更多不同的散热路径。

3. 发明授权

US07382047B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US07382047B2
公开(公告)日：2008-06-03
申请号：US11306412
申请日：2005-12-27
申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H01L23/10 , B23P6/00 , F28F27/00 , H01B7/42
CPC分类号： F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/4006 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/49353 , H01L2924/00
摘要： A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.
摘要翻译：散热装置（1）包括散热器（10），风扇（20）和冷却构件（30）。散热器包括基座，从基座延伸的多个翅片和至少一个热连接底座和翅片的热管。冷却件在其上设置有翅片组件，并且包括附接到翅片的一侧的冷表面和至少一个热管的冷凝部分，以使翅片的一侧和冷凝部分具有较低的温度。

4. 发明授权

US07269013B2 Heat dissipation device having phase-changeable medium therein 失效
标题翻译：其中具有相变介质的散热装置
公开(公告)号：US07269013B2
公开(公告)日：2007-09-11
申请号：US11306700
申请日：2006-01-09
申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28F2215/10 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a periphery of the central portion. Each of the fins branches a plurality of portions at an end thereof. The heat conducting body includes a column thermally fitted in the through hole of the central portion of the heat dissipation body. A cavity is defined between the column and the central portion of the heat dissipation body. The cavity contains a phase-changeable medium therein, which becomes vapor once the column absorbs heat from a heat-generating electronic device.
摘要翻译：散热装置包括散热体和与散热装置热结合的导热体。散热体包括在其中限定通孔的中心部分和从中心部分的周边延伸的多个翅片。每个翅片在其一端分支多个部分。导热体包括热嵌合在散热体的中心部分的通孔中的柱。在该散热体的中心部分之间限定空腔。空腔中含有相变介质，一旦该塔从发热电子设备中吸收热量，该腔就变成蒸汽。

5. 发明申请

US20070097637A1 HEAT DISSIPATION DEVICE 失效
标题翻译：散热装置
公开(公告)号：US20070097637A1
公开(公告)日：2007-05-03
申请号：US11163820
申请日：2005-11-01
申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.
摘要翻译：散热装置（1）包括散热器（10），风扇（20）和空气冷却部件（30）。通过风扇产生的气流在通过空气冷却部件之后被引导到散热器。空气冷却部件可以将气流的温度降低到散热装置周围的气氛的平均温度以下。

6. 发明授权

US07447025B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US07447025B2
公开(公告)日：2008-11-04
申请号：US11163820
申请日：2005-11-01
申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/427 , F28D15/0266 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.
摘要翻译：散热装置（1）包括散热器（10），风扇（20）和空气冷却部件（30）。通过风扇产生的气流在通过空气冷却部件之后被引导到散热器。空气冷却部件可以将气流的温度降低到散热装置周围的气氛的平均温度以下。

7. 发明申请

US20070159798A1 HEAT DISSIPATION DEVICE HAVING PHASE-CHANGEABLE MEDIUM THEREIN 失效
标题翻译：具有相变介质的热释放装置
公开(公告)号：US20070159798A1
公开(公告)日：2007-07-12
申请号：US11306700
申请日：2006-01-09
申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28F2215/10 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a periphery of the central portion. Each of the fins branches a plurality of portions at an end thereof. The heat conducting body includes a column thermally fitted in the through hole of the central portion of the heat dissipation body. A cavity is defined between the column and the central portion of the heat dissipation body. The cavity contains a phase-changeable medium therein, which becomes vapor once the column absorbs heat from a heat-generating electronic device.
摘要翻译：散热装置包括散热体和与散热装置热结合的导热体。散热体包括在其中限定通孔的中心部分和从中心部分的周边延伸的多个翅片。每个翅片在其一端分支多个部分。导热体包括热嵌合在散热体的中心部分的通孔中的柱。在该散热体的中心部分之间限定空腔。空腔中含有相变介质，一旦该塔从发热电子设备中吸收热量，该腔就变成蒸汽。

8. 发明申请

US20060158850A1 Heat dissipation device with a heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US20060158850A1
公开(公告)日：2006-07-20
申请号：US11244688
申请日：2005-10-06
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0266 , F28F2215/00 , H01L23/4006 , H01L23/467 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
摘要翻译：散热装置包括导热基座，底座上的散热器和与散热器和基座热接触的两个热管。散热器由金属挤压制成，并且在散热器周围包括导热圆柱体，以及从圆筒延伸并被圆筒包围的多个翅片。气缸包括四个互连的侧面。同一侧的翅片彼此平行。两个热管热量围绕散热器的气缸并且完全接触散热器。

9. 发明授权

US07331379B2 Heat dissipation device with heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US07331379B2
公开(公告)日：2008-02-19
申请号：US11164458
申请日：2005-11-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
发明人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/0275 , F28F1/32 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped portion, respectively. The base is for contacting with a heat generating electronic device and transferring heat from the electronic device to the heat pipe and the fin set. The fin set defines a passageway in a middle of thereof. The U-shaped portion of the heat pipe is received in the passageway of the fin set and thermally engages with the fin set.
摘要翻译：散热装置包括翅片组，将热量传递到翅片组的不同部分的弯曲热管和与热管接触的基部。热管在U形部分的两侧分别具有中间的U形部分和两个L形部分。基座用于与发热电子装置接触并将热量从电子装置传递到热管和散热片组。翅片组定义在其中间的通道。热管的U形部分容纳在翅片组的通道中，并与翅片组热接合。

10. 发明授权

US07312994B2 Heat dissipation device with a heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US07312994B2
公开(公告)日：2007-12-25
申请号：US11244688
申请日：2005-10-06
申请人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
发明人： Hsieh-Kun Lee , Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu , Bing-Wen Zhou , Hong-Wei Du
IPC分类号： H05K7/20 , F28D15/00
CPC分类号： H01L23/427 , F28D15/0266 , F28F2215/00 , H01L23/4006 , H01L23/467 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
摘要翻译：散热装置包括导热基座，底座上的散热器和与散热器和基座热接触的两个热管。散热器由金属挤压制成，并且在散热器周围包括导热圆柱体，以及从圆筒延伸并被圆筒包围的多个翅片。气缸包括四个互连的侧面。同一侧的翅片彼此平行。两个热管热量围绕散热器的气缸并且完全接触散热器。

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