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1. 发明授权

US08579017B2 Heat dissipation device with multiple heat sinks 有权
标题翻译：具有多个散热片的散热装置
公开(公告)号：US08579017B2
公开(公告)日：2013-11-12
申请号：US12620500
申请日：2009-11-17
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/427 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.
摘要翻译：示例性散热装置包括连接板，第一散热器，第二散热器和第二平坦化热管。第一散热器包括安装在连接板的底部上的基板和插入连接板中并接触基板的多个圆柱形销。第二散热器包括散热器和从散热器一体延伸的多个矩形固体翅片。散热器接合连接板。热管将第一散热器的基板和第二散热器的第二散热器热连接。

2. 发明授权

US08579016B2 Heat dissipation device with heat pipe 失效
标题翻译：散热装置带热管
公开(公告)号：US08579016B2
公开(公告)日：2013-11-12
申请号：US12688794
申请日：2010-01-15
申请人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
发明人： Guo Chen , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0266 , F28D15/0275 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
摘要翻译：散发由安装在印刷电路板上的电子元件产生的热的示例性散热装置包括支撑件，导热基座，第一翅片组件和热管。导热基座牢固地附接到支撑件的底侧并与电子元件热接触。第一翅片组件牢固地附接到支撑件的顶侧。热管包括夹在支撑件和导热基座之间的蒸发器，以及延伸穿过支撑件并在第一翅片组件中延伸的冷凝器。

3. 发明授权

US08251132B2 Heat sink assembly and method for manufacturing the same 有权
标题翻译：散热器组件及其制造方法
公开(公告)号：US08251132B2
公开(公告)日：2012-08-28
申请号：US12056298
申请日：2008-03-27
申请人： Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
发明人： Jun Cao , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： F28F1/32 , F28D15/02
CPC分类号： F28F1/32 , F28D15/0266 , F28D15/0275 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
摘要翻译：散热器组件包括基座，翅片组和与基座和翅片组连接的热管。翅片组包括多个翅片。每个翅片在其下部限定凹部。热管包括延伸穿过基座的蒸发部分和延伸穿过翅片组的冷凝部分。基座沿圆周方向嵌合在翅片的凹槽中。基座，翅片组和热管直接相互紧密连接。凹槽和底座具有相应的T形轮廓。每个翅片形成限定凹部的弯曲凸缘。弯曲的法兰与基座和热管的蒸发部分紧密接触。

4. 发明授权

US08004843B2 Heat dissipation device 有权
标题翻译：散热装置
公开(公告)号：US08004843B2
公开(公告)日：2011-08-23
申请号：US12565712
申请日：2009-09-23
申请人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
发明人： Chun-Chi Chen , Shi-Wen Zhou , Guo Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.
摘要翻译：散热装置用于散发由安装在印刷电路板上并具有不同高度的多个电子部件产生的热量。散热装置包括连接构件和安装在连接构件上并位于上述一个电子部件上的第一基座。多个连接构件延伸穿过印刷电路板并与第一基座接合以在印刷电路板上的电子部件之一上组装第一基座。第一基座和电子部件之间的距离可通过调节连接部件来调节，以使第一基座与电子部件之一紧密接触。

5. 发明授权

US07898809B2 Heat sink and method of manufacturing the same 有权
标题翻译：散热器及其制造方法
公开(公告)号：US07898809B2
公开(公告)日：2011-03-01
申请号：US12252373
申请日：2008-10-16
申请人： Yi-Jiun Li , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
发明人： Yi-Jiun Li , Peng Liu , Shi-Wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20
CPC分类号： H01L23/3677 , H01L21/4882 , H01L2924/0002 , H01L2924/3011 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.
摘要翻译：散热器包括基板和从基板向上延伸的多个圆柱形销。圆柱销每个包括上消散部分，下安装部分和消散部分和安装部分之间的接合部分。安装部分周向地装配在基板的相应孔的下部中。接合部的直径小于安装部的直径。接合部分被基板的内壁夹住，通过在对应的孔的边缘处向下冲压基板的上表面来限定基板的相应孔的上部。

6. 发明申请

US20100243229A1 HEAT SINK AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：散热器及其制造方法
公开(公告)号：US20100243229A1
公开(公告)日：2010-09-30
申请号：US12506213
申请日：2009-07-20
申请人： PENG LIU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： PENG LIU , GUO CHEN , SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/00 , B21D53/02
CPC分类号： B21D53/085 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.
摘要翻译：散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。还公开了一种制造散热器的方法。

7. 发明授权

US07633755B2 Heat dissipation device assembly with a fan duct having guiding members for guiding a screwdriver to assemble the heat dissipation device assembly to a printed circuit board 失效
标题翻译：具有风扇导管的散热装置组件，其具有用于引导螺丝刀的引导构件以将散热装置组件组装到印刷电路板
公开(公告)号：US07633755B2
公开(公告)日：2009-12-15
申请号：US11940937
申请日：2007-11-15
申请人： Shi-Wen Zhou , Jun Cao , Jie-Cheng Deng
发明人： Shi-Wen Zhou , Jun Cao , Jie-Cheng Deng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink (10) contacting one of the electronic components, a pair of fans (20) attached on a lateral side of the heat sink, and a fan duct (30) fixed on the fans. A plurality of guiding members (322, 346) are formed inwardly from the fan duct to be located in an interior of the fan duct. The guiding members are used for guiding a screwdriver (40) to accurately fit with screws (50) preassembled to the heat sink. Thus, the screws can be quickly and easily fastened by the screwdriver to mount the heat dissipation device assembly on the printed circuit board.
摘要翻译：一种用于从安装在印刷电路板上的多个电子部件散热的散热装置组件，包括接触电子部件之一的散热片（10），一对安装在热源外侧的风扇（20）水槽和固定在风扇上的风扇导管（30）。多个引导构件（322,346）从风扇通道向内形成以位于风扇通道的内部。引导构件用于引导螺丝刀（40）以精确地配合预先组装到散热器的螺钉（50）。因此，可以通过螺丝刀快速方便地固定螺钉，以将散热装置组件安装在印刷电路板上。

8. 发明授权

US07610950B2 Heat dissipation device with heat pipes 失效
标题翻译：带热管的散热装置
公开(公告)号：US07610950B2
公开(公告)日：2009-11-03
申请号：US11557917
申请日：2006-11-08
申请人： Jun Cao , Zhan Wu , Shi-Wen Zhou
发明人： Jun Cao , Zhan Wu , Shi-Wen Zhou
IPC分类号： H01L23/427 , F28D15/02
CPC分类号： H01L23/467 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.
摘要翻译：一种散热装置，包括第一基板（10），布置在第一基板上的翅片组（30），安装在第一基板和翅片组上的第一热管（50）和第二热管）连接在第一基板上并延伸穿过翅片组。第一和第二热管中的每一个包括吸收部分和消散部分。第一和第二热管的吸收部分为L形并且在相反方向上定向，并且第一和第二热管的散热部分彼此垂直取向，由此附接有电子部件的第一基板的热量可以从第一基板到散热片组的更多不同的散热路径。

9. 发明授权

US07609522B2 Heat sink assembly 失效
标题翻译：散热器组件
公开(公告)号：US07609522B2
公开(公告)日：2009-10-27
申请号：US11566020
申请日：2006-12-01
申请人： Zhao Jin , Jun Cao , Shi-wen Zhou , Chun-Chi Chen
发明人： Zhao Jin , Jun Cao , Shi-wen Zhou , Chun-Chi Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/4006 , F28F3/02 , H01L2023/4081 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slot (1220) therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.
摘要翻译：与ATX母板（20）和BTX母板（30）兼容的散热器组件（10）包括散热器和延伸穿过散热器的多个紧固件（15）。散热器包括在其中限定狭槽（1220）的基部（12）。紧固件能够在第一位置与第二位置之间沿狭槽滑动，以使得根据本发明的优选实施例的散热器组件适于与ATX主板或BTX主板一起使用。

10. 发明申请

US20090260779A1 HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE 审中-公开
标题翻译：具有改进的熔体结构的散热装置
公开(公告)号：US20090260779A1
公开(公告)日：2009-10-22
申请号：US12107004
申请日：2008-04-21
申请人： SHI-WEN ZHOU , CHUN-CHI CHEN
发明人： SHI-WEN ZHOU , CHUN-CHI CHEN
IPC分类号： F28F7/02
CPC分类号： H01L23/427 , F28D15/0275 , F28F1/32 , F28F2215/10 , H01L23/3672 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device for dissipating heat from an electronic element, includes a base plate for absorbing heat from the heat-generating component, a fin unit located above the base plate and having a plurality of fins stacked together, and at least a heat pipe having an evaporating section thermally engaging with the base plate and a pair of condensing sections extending through the fins. Each of the fins has a plurality of parallel and protruding flanges on a top face thereof. The protruding flanges of the fins are of equal height and parallel to short sides of the fins. Each protruding flange has a length equal to that of the short sides of the fins. A distance between two neighboring ones of the protruding flanges located between the condensing sections is the same. The protruding flanges are provided for increasing a heat dissipation area of the fin.
摘要翻译：一种用于从电子元件散热的散热装置，包括用于从发热部件吸收热量的基板，位于基板上方并具有堆叠在一起的多个翅片的翅片单元，以及至少具有与基板热接合的蒸发部分和延伸穿过翅片的一对冷凝部分。每个翅片在其顶面上具有多个平行和突出的凸缘。翅片的突出凸缘具有相同的高度并且平行于翅片的短边。每个突出的凸缘的长度等于翅片短边的长度。位于冷凝段之间的两个相邻突出凸缘之间的距离相同。突出的凸缘被设置用于增加翅片的散热面积。

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