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    • 1. 发明授权
    • STT MRAM magnetic tunnel junction architecture and integration
    • STT MRAM磁隧道结结构和集成
    • US08564079B2
    • 2013-10-22
    • US12355941
    • 2009-01-19
    • Seung H. KangXia LiShiqun GuKangho LeeXiaochun Zhu
    • Seung H. KangXia LiShiqun GuKangho LeeXiaochun Zhu
    • H01L21/00H01L29/82
    • H01L27/222H01L43/08H01L43/12
    • A magnetic tunnel junction (MTJ) device for a magnetic random access memory (MRAM) in a semiconductor back-end-of-line (BEOL) process flow includes a first metal interconnect for communicating with at least one control device and a first electrode for coupling to the first metal interconnect through a via formed in a dielectric passivation barrier using a first mask. The device also includes an MTJ stack for storing data coupled to the first electrode, a portion of the MTJ stack having lateral dimensions based upon a second mask. The portion defined by the second mask is over the contact via. A second electrode is coupled to the MTJ stack and also has a same lateral dimension as defined by the second mask. The first electrode and a portion of the MTJ stack are defined by a third mask. A second metal interconnect is coupled to the second electrode and at least one other control device.
    • 半导体后端工艺流程中用于磁性随机存取存储器(MRAM)的磁隧道结(MTJ)装置包括用于与至少一个控制装置通信的第一金属互连和用于与至少一个控制装置通信的第一电极 通过使用第一掩模在介电钝化屏障中形成的通孔耦合到第一金属互连。 该装置还包括用于存储耦合到第一电极的数据的MTJ堆叠,MTJ堆叠的一部分具有基于第二掩模的侧向尺寸。 由第二掩模限定的部分在接触通孔之上。 第二电极耦合到MTJ堆叠并且还具有与第二掩模所限定的相同的横向尺寸。 第一电极和MTJ堆叠的一部分由第三掩模限定。 第二金属互连件耦合到第二电极和至少一个其他控制装置。
    • 2. 发明申请
    • STT MRAM Magnetic Tunnel Junction Architecture and Integration
    • STT MRAM磁隧道结结构与集成
    • US20090261434A1
    • 2009-10-22
    • US12355941
    • 2009-01-19
    • Seung H. KangXia LiShiqun GuKangho LeeXiaochun Zhu
    • Seung H. KangXia LiShiqun GuKangho LeeXiaochun Zhu
    • H01L29/82H01L21/00
    • H01L27/222H01L43/08H01L43/12
    • A magnetic tunnel junction (MTJ) device for a magnetic random access memory (MRAM) in a semiconductor back-end-of-line (BEOL) process flow includes a first metal interconnect for communicating with at least one control device and a first electrode for coupling to the first metal interconnect through a via formed in a dielectric passivation barrier using a first mask. The device also includes an MTJ stack for storing data coupled to the first electrode, a portion of the MTJ stack having lateral dimensions based upon a second mask. The portion defined by the second mask is over the contact via. A second electrode is coupled to the MTJ stack and also has a same lateral dimension as defined by the second mask. The first electrode and a portion of the MTJ stack are defined by a third mask. A second metal interconnect is coupled to the second electrode and at least one other control device.
    • 半导体后端工艺流程中用于磁性随机存取存储器(MRAM)的磁隧道结(MTJ)装置包括用于与至少一个控制装置通信的第一金属互连和用于与至少一个控制装置通信的第一电极 通过使用第一掩模在介电钝化屏障中形成的通孔耦合到第一金属互连。 该装置还包括用于存储耦合到第一电极的数据的MTJ堆叠,MTJ堆叠的一部分具有基于第二掩模的侧向尺寸。 由第二掩模限定的部分在接触通孔之上。 第二电极耦合到MTJ堆叠并且还具有与第二掩模所限定的相同的横向尺寸。 第一电极和MTJ堆叠的一部分由第三掩模限定。 第二金属互连件耦合到第二电极和至少一个其它控制装置。