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1. 发明申请

US20120153453A1 METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS 有权
标题翻译：金属热接头用于高功率密度表
公开(公告)号：US20120153453A1
公开(公告)日：2012-06-21
申请号：US12971737
申请日：2010-12-17
申请人： Seshasayee Ankireddi , Vadim Gektin , James A. Jones , Margaret B. Stern
发明人： Seshasayee Ankireddi , Vadim Gektin , James A. Jones , Margaret B. Stern
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L23/3675 , H01L21/50 , H01L23/42 , H01L24/27 , H01L24/83 , H01L2224/0345 , H01L2224/0401 , H01L2224/04026 , H01L2224/0508 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05644 , H01L2224/16225 , H01L2224/16227 , H01L2224/27334 , H01L2224/27849 , H01L2224/29109 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75755 , H01L2224/75756 , H01L2224/83011 , H01L2224/83013 , H01L2224/83014 , H01L2224/83101 , H01L2224/83191 , H01L2224/83211 , H01L2224/83815 , H01L2924/01029 , H01L2924/01327 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16171 , H01L2924/16251 , H01L2924/16747 , H01L2924/19041 , H01L2924/19105 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/01023 , H01L2924/00012 , H01L2924/01032
摘要： A method for the assembly of a semiconductor package that includes cleaning a surface of a chip and a surface of a heat removal device by reverse sputtering is given. The method includes sequentially coating the surface of the chip and the surface of the heat removal device with an adhesive layer, a barrier layer, and a protective layer over a target joining area. The chip and the heat removal device are placed into carrier fixtures and preheated to a target temperature. Then a metallic thermal interface material (TIM) preform is mechanically rolled onto the surface of the chip and the first and the second carrier fixtures are attached together such that the metallic TIM layer on the surface of the chip is joined to the coated surface of the heat removal device through a fluxless process. The method includes heating the joined carrier fixtures in a reflow oven.
摘要翻译：给出了一种用于组装半导体封装的方法，其包括通过反溅射清洗芯片的表面和散热装置的表面。该方法包括在目标接合区域上用粘合剂层，阻挡层和保护层依次涂覆芯片的表面和除热装置的表面。将芯片和散热装置放置在载体夹具中并预热至目标温度。然后将金属热界面材料（TIM）预成型件机械地轧制到芯片的表面上，并且将第一和第二载体固定装置附接在一起，使得芯片表面上的金属TIM层结合到散热装置通过无助焊剂工艺。该方法包括在回流炉中加热接合的载体夹具。

2. 发明授权

US08368205B2 Metallic thermal joint for high power density chips 有权
标题翻译：用于高功率密度芯片的金属热接头
公开(公告)号：US08368205B2
公开(公告)日：2013-02-05
申请号：US12971737
申请日：2010-12-17
申请人： Seshasayee Ankireddi , Vadim Gektin , James A. Jones , Margaret B. Stern
发明人： Seshasayee Ankireddi , Vadim Gektin , James A. Jones , Margaret B. Stern
IPC分类号： H01L23/34
CPC分类号： H01L23/3675 , H01L21/50 , H01L23/42 , H01L24/27 , H01L24/83 , H01L2224/0345 , H01L2224/0401 , H01L2224/04026 , H01L2224/0508 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05644 , H01L2224/16225 , H01L2224/16227 , H01L2224/27334 , H01L2224/27849 , H01L2224/29109 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75755 , H01L2224/75756 , H01L2224/83011 , H01L2224/83013 , H01L2224/83014 , H01L2224/83101 , H01L2224/83191 , H01L2224/83211 , H01L2224/83815 , H01L2924/01029 , H01L2924/01327 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16171 , H01L2924/16251 , H01L2924/16747 , H01L2924/19041 , H01L2924/19105 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/01023 , H01L2924/00012 , H01L2924/01032
摘要： A method for the assembly of a semiconductor package that includes cleaning a surface of a chip and a surface of a heat removal device by reverse sputtering is given. The method includes sequentially coating the surface of the chip and the surface of the heat removal device with an adhesive layer, a barrier layer, and a protective layer over a target joining area. The chip and the heat removal device are placed into carrier fixtures and preheated to a target temperature. Then a metallic thermal interface material (TIM) preform is mechanically rolled onto the surface of the chip and the first and the second carrier fixtures are attached together such that the metallic TIM layer on the surface of the chip is joined to the coated surface of the heat removal device through a fluxless process. The method includes heating the joined carrier fixtures in a reflow oven.
摘要翻译：给出了一种用于组装半导体封装的方法，其包括通过反溅射清洗芯片的表面和散热装置的表面。该方法包括在目标接合区域上用粘合剂层，阻挡层和保护层依次涂覆芯片的表面和除热装置的表面。将芯片和散热装置放置在载体夹具中并预热至目标温度。然后将金属热界面材料（TIM）预成型件机械地轧制到芯片的表面上，并且将第一和第二载体固定装置附接在一起，使得芯片表面上的金属TIM层连接到芯片的涂覆表面散热装置通过无助焊剂工艺。该方法包括在回流炉中加热接合的载体夹具。

3. 发明授权

US08331094B2 Thermal and power bus stacked package architecture 有权
标题翻译：散热和电源总线堆叠封装结构
公开(公告)号：US08331094B2
公开(公告)日：2012-12-11
申请号：US13012078
申请日：2011-01-24
申请人： Seshasayee Ankireddi , Vadim Gektin
发明人： Seshasayee Ankireddi , Vadim Gektin
IPC分类号： H05K7/20 , F28F7/00 , H01L23/48
CPC分类号： H01L23/367 , H01L23/427 , H01L2224/16225 , H01L2224/73253 , H05K1/144 , H05K2201/042 , H05K2201/10515 , H05K2201/2036
摘要： A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.
摘要翻译：堆叠的微处理器封装结构包括一个或多个微处理器封装，微处理器封装包括设置在基板上的一个或多个微处理器管芯，卫星管芯，热耦合到微处理器管芯并热连接到系统冷却的热总线，以及电源总线向微处理器提供电源并连接到系统电源。微处理器封装可以包括为层叠模块提供机械保护和/或热隔离或热冷却路径的模块盖。可变高度支座提供从堆叠的微处理器封装的基板到系统板的信号连接。

4. 发明授权

US06836408B2 Method and apparatus for force transfer via bare die package 有权
标题翻译：通过裸芯片封装力传递的方法和装置
公开(公告)号：US06836408B2
公开(公告)日：2004-12-28
申请号：US10247503
申请日：2002-09-19
申请人： Vadim Gektin , James A. Jones
发明人： Vadim Gektin , James A. Jones
IPC分类号： H05H720
CPC分类号： H01L23/433 , H01L23/3121 , H01L23/4006 , H01L2224/32
摘要： The present application describes a method and an apparatus for facilitating increased uniformity and diffusion of force transfer on a bare die electronic package for example, when such electronic package is attached to a circuit board. Additional force absorbent material is applied around a bare die in the bare die electronic package. The force applied to the bare die electronic package can be distributed to the additional force absorbent material. A curable force absorbent material is dispensed around the bare die in the bare die electronic package. The surface of the curable material is substantially parallel with the surface of bare die thus facilitating a substantially uniform force distribution through the bare die and curable material resulting in a robust bare die electronic package.
摘要翻译：本申请描述了一种方法和装置，用于例如当这种电子封装附接到电路板时，便于在裸片电子封装上增加力传递的均匀性和扩散。在裸模电子封装中的裸裸裸片周围施加附加力吸收材料。施加到裸模电子封装的力可以分配到附加的力吸收材料。在裸模电子封装中的裸芯片周围分配可固化力吸收材料。可固化材料的表面基本上平行于裸露模具的表面，从而有助于通过裸模和可固化材料的基本均匀的力分布，从而形成牢固的裸模电子封装。

5. 发明授权

US08283204B2 Optimized lid attach process for thermal management and multi-surface compliant heat removal 有权
标题翻译：优化的盖子连接过程，用于热管理和多表面兼容的散热
公开(公告)号：US08283204B2
公开(公告)日：2012-10-09
申请号：US13075803
申请日：2011-03-30
申请人： Vadim Gektin , Deviprasad Malladi
发明人： Vadim Gektin , Deviprasad Malladi
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/42 , H01L23/4275 , H01L2224/16 , H01L2224/73253 , H01L2924/16195
摘要： A multi-surface compliant heat removal process that includes identifying components to share a heat rejecting device; applying non-adhesive film to the components; identifying a primary component of the components; and applying phase change material on each of the components, other than the primary component. The phase change material is placed on top of the non-adhesive film. The process also includes placing the heat rejecting device on the corresponding components and removing the heat rejecting device from the corresponding components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device; removing the non-adhesive film from the heat rejecting device; placing a heatsink-attach thermal interface material on the components; and placing the heat rejecting device on the corresponding components.
摘要翻译：一种多表面兼容的散热过程，其包括识别部件以共享散热装置; 将非粘合膜施加到部件上; 识别组件的主要组件; 并且将相变材料施加到除主要部件之外的每个部件上。相变材料放置在非粘合膜的顶部。该方法还包括将散热装置放置在相应的部件上，并从相应的部件移除散热装置。相变材料和非粘合膜保留在散热装置上。该方法还包括在排热装置上回流相变材料; 从散热装置中除去非粘合膜; 将散热片附着的热界面材料放置在部件上; 并将散热装置放置在相应的部件上。

6. 发明授权

US06727193B2 Apparatus and methods for enhancing thermal performance of integrated circuit packages 有权
标题翻译：用于提高集成电路封装的热性能的装置和方法
公开(公告)号：US06727193B2
公开(公告)日：2004-04-27
申请号：US10093669
申请日：2002-03-08
申请人： Vadim Gektin , Deviprasad Malladi
发明人： Vadim Gektin , Deviprasad Malladi
IPC分类号： H01L2126
CPC分类号： H01L23/433 , H01L23/3735 , H01L29/51 , H01L2924/0002 , H01L2924/00
摘要： Novel methods and apparatus to enhance thermal performance of IC packages are disclosed. In an embodiment, a method of enhancing thermal uniformity across a semiconductor device is disclosed. The method includes providing the semiconductor device. The semiconductor device has a plurality of thermal regions. A first thermal region of the plurality of thermal regions has a different temperature than a second thermal region of the plurality of thermal regions. The method further provides a thermal enhancement material substantially adjacent to the first and second thermal regions. In another embodiment, a thermal conductivity of the thermal enhancement material is adjusted in relation to a temperature effecting the thermal enhancement material.
摘要翻译：公开了提高IC封装热性能的新方法和装置。在一个实施例中，公开了一种提高半导体器件的热均匀性的方法。该方法包括提供半导体器件。半导体器件具有多个热区域。多个热区域的第一热区域具有与多个热区域中的第二热区域不同的温度。该方法还提供了基本上与第一和第二热区域相邻的热增强材料。在另一个实施例中，相对于影响热增强材料的温度调节热增强材料的热导率。

7. 发明授权

US06637506B2 Multi-material heat spreader 有权
标题翻译：多材料散热器
公开(公告)号：US06637506B2
公开(公告)日：2003-10-28
申请号：US10093643
申请日：2002-03-08
申请人： Vadim Gektin , Deviprasad Malladi
发明人： Vadim Gektin , Deviprasad Malladi
IPC分类号： H05K720
CPC分类号： F28F23/00 , F28F2013/006 , H01L23/433 , H01L24/32 , H01L2924/14 , H01L2924/16152 , H01L2924/00
摘要： In an embodiment, an apparatus for enhancing a thermal match between portions of a semiconductor device is disclosed. The apparatus includes a die and a heat spreader. The heat spreader is in thermal contact with the die. The heat spreader has a center portion and a perimeter portion. The center portion and the perimeter portions are structurally coupled to each other. In another embodiment, the perimeter portion of the heat spreader is selected from material with a lower CTE than the material for the center portion of the heat spreader.
摘要翻译：在一个实施例中，公开了一种用于增强半导体器件的部分之间的热匹配的装置。该装置包括模具和散热器。散热器与模具热接触。散热器具有中心部分和周边部分。中心部分和周边部分在结构上彼此耦合。在另一个实施例中，散热器的周边部分选自具有比散热器的中心部分的材料更低的CTE的材料。

8. 发明授权

US08767391B2 Chassis with adjustable baffle for cooling 有权
标题翻译：底盘带可调节挡板进行冷却
公开(公告)号：US08767391B2
公开(公告)日：2014-07-01
申请号：US13595777
申请日：2012-08-27
申请人： Youlin Jin , Jiye Xu , Vadim Gektin
发明人： Youlin Jin , Jiye Xu , Vadim Gektin
IPC分类号： H05K7/20 , A47B77/08 , H05K5/00
CPC分类号： H05K7/20563
摘要： A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.
摘要翻译：一种底架，其包括：槽，其构造成接收具有挡板位置销和安装在其上的电子部件的印刷电路板;安装在所述槽内的引导机构，以及可移动地安装在所述槽内且由所述引导机构朝向狭槽开口偏压的滑架，所述托架包括适于操纵通过所述槽的空气流的挡板，所述托架被构造成当所述印刷电路被驱动时被所述挡板位置销从所述槽开口驱动并相对于所述印刷电路板上的所述电子部件定向板被加载到槽中，使得挡板将空气流引导到电子部件上。

9. 发明授权

US08097813B2 Carbon nanotube based interposer 有权
标题翻译：碳纳米管中介层
公开(公告)号：US08097813B2
公开(公告)日：2012-01-17
申请号：US12414122
申请日：2009-03-30
申请人： Vadim Gektin , David W. Copeland
发明人： Vadim Gektin , David W. Copeland
IPC分类号： H05K1/03
CPC分类号： H05K3/325 , B82Y10/00 , H01R12/7082 , H05K2201/026 , H05K2201/10378
摘要： In at least one embodiment, an interposer for a board interconnect system is provided. The interposer comprises a frame and at least one interconnect. The frame receives a substrate. The substrate includes a top side, a bottom side, and a conductive interface. The conductive interface extends through the top side and the bottom side for delivering an electrical signal from an electrical device positioned on the top side therethrough. The at least one interconnect includes a plurality of carbon nanotubes (CNTs) positioned within the frame for contacting the conductive interface of the substrate to deliver the electrical signal to a conductive arrangement of a circuit board.
摘要翻译：在至少一个实施例中，提供了用于板互连系统的插入器。插入器包括框架和至少一个互连件。框架接收基板。基板包括顶侧，底侧和导电界面。导电接口延伸穿过顶侧和底侧，用于从位于顶侧的电气装置传送电信号。所述至少一个互连件包括位于所述框架内的多个碳纳米管（CNT），用于接触所述基板的所述导电接口以将所述电信号传送到电路板的导电布置。

10. 发明授权

US07791194B2 Composite interconnect 有权
标题翻译：复合互连
公开(公告)号：US07791194B2
公开(公告)日：2010-09-07
申请号：US12101077
申请日：2008-04-10
申请人： Vadim Gektin , David W. Copeland
发明人： Vadim Gektin , David W. Copeland
IPC分类号： H01L23/488
CPC分类号： H05K3/325 , B82Y10/00 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L2224/0401 , H01L2224/06515 , H01L2224/10135 , H01L2224/13193 , H01L2224/1403 , H01L2224/14051 , H01L2224/14505 , H01L2224/14515 , H01L2224/16225 , H01L2224/29101 , H01L2224/32225 , H01L2224/731 , H01L2224/73103 , H01L2224/73104 , H01L2224/73204 , H01L2224/81139 , H01L2224/81815 , H01L2224/81906 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H05K3/3436 , H05K2201/026 , H05K2201/0323 , H05K2201/10659 , H05K2201/10719 , H05K2201/2036 , H01L2924/00 , H01L2924/00012
摘要： A composite interconnect system includes a plurality of carbon nanotubes, a plurality of solder balls and standoff balls disposed on a first device to provide a connection to a second device. A die-attached substrate includes a substrate and one or more die disposed on the substrate by a die-attach composite interconnect. The die-attach composite interconnect includes a plurality of carbon nanotubes, solder bumps, and standoff balls disposed on the die to provide one or more connections to the substrate. A PCB-attached substrate package includes a substrate package and one or more die disposed on the substrate package. The substrate package is disposed on a PCB by a PCB-attach composite interconnect. The PCB-attach composite interconnect includes a plurality of carbon nanotubes, solder balls, and standoff balls disposed on the substrate package to provide one or more connections to the PCB.
摘要翻译：复合互连系统包括多个碳纳米管，多个焊球和支撑球，其设置在第一装置上以提供到第二装置的连接。芯片连接的基板包括基板和通过管芯附着复合互连件设置在基板上的一个或多个管芯。管芯附着复合互连件包括多个碳纳米管，焊料凸块和设置在管芯上的间隙球，以提供与衬底的一个或多个连接。附着有PCB的衬底封装包括衬底封装和设置在衬底封装上的一个或多个管芯。衬底封装通过PCB连接复合互连布置在PCB上。 PCB附着复合互连件包括多个碳纳米管，焊球和设置在衬底封装上的间隙球，以提供与PCB的一个或多个连接。

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