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1. 发明授权

US06717814B2 Heat dissipation assembly 失效
标题翻译：散热组件
公开(公告)号：US06717814B2
公开(公告)日：2004-04-06
申请号：US10290124
申请日：2002-11-06
申请人： Yue-Jun Li
发明人： Yue-Jun Li
IPC分类号： H05H720
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , Y10T24/308 , Y10T24/44017 , H01L2924/00
摘要： A heat dissipation assembly includes a fan (10), a mounting bracket (20), a clip (30), a heat sink (40), and a mounting frame (50). The fan is mounted to the mounting bracket. The clip is bent from an elongated thread or rod of wire or suitable wirelike material. The clip includes a central horizontal part (302), and a pair of resilient arms (304) extending perpendicularly from opposite ends of the horizontal part. A groove (402) is laterally defined through parallel fins (403) of the heat sink, and receives the horizontal part of the clip therein. The combined fan and mounting bracket is attached to the combined heat sink and clip to form a subassembly. Thus, the clip is secured in the heat sink in advance. The subassembly is received in the mounting frame. Two apertures (504) of the mounting frame respectively engagingly receive two hooks (306) of the resilient arms.
摘要翻译：散热组件包括风扇（10），安装支架（20），夹子（30），散热器（40）和安装框架（50）。风扇安装在安装支架上。夹子由细长的线或棒或线或类似的线状材料弯曲。夹具包括中心水平部分（302）和从水平部分的相对端垂直延伸的一对弹性臂（304）。槽（402）通过散热器的平行翅片（403）横向地限定，并且将夹子的水平部分接收在其中。组合的风扇和安装支架连接到组合的散热器和夹子以形成子组件。因此，夹子预先固定在散热器中。子组件被容纳在安装框架中。安装框架的两个孔（504）分别接合地容纳弹性臂的两个钩（306）。

2. 发明授权

US06587338B2 Electronic controller modules and methods for making and using same 失效
标题翻译：电子控制器模块及其制造和使用方法
公开(公告)号：US06587338B2
公开(公告)日：2003-07-01
申请号：US10017231
申请日：2001-12-13
申请人： Michael Charles LaCroix , Marcus Beaumont
发明人： Michael Charles LaCroix , Marcus Beaumont
IPC分类号： H05H720
CPC分类号： B60R16/0239 , H02H7/0822
摘要： An electronic controller module including a heat-resistant material to substantially surround and physically protect the controller, at least one electrically-conductive member to provide input or output of at least one electrical signal through the material to the controller, and a heat-resistant lid including a heat sink configured and dimensioned to dissipate a sufficient amount of heat to inhibit or avoid damage to the electronic controller, wherein the material and the lid are operatively associated to completely surround the controller. These modules are particularly suitable for use in automotive applications.
摘要翻译：一种电子控制器模块，包括基本上围绕和物理保护控制器的耐热材料，至少一个导电构件，以通过材料向控制器提供至少一个电信号的输入或输出;以及耐热盖包括散热器，其配置和尺寸设计成消散足够量的热量以抑制或避免对电子控制器的损坏，其中材料和盖可操作地相关联以完全围绕控制器。这些模块特别适用于汽车应用。

3. 发明授权

US06480386B1 Heat sink assembly with pressing wedges 失效
标题翻译：带楔楔的散热器总成
公开(公告)号：US06480386B1
公开(公告)日：2002-11-12
申请号：US10086616
申请日：2002-02-28
申请人： Hung-Chi Yu
发明人： Hung-Chi Yu
IPC分类号： H05H720
CPC分类号： H01L23/4093 , H01L2924/0002 , Y10T24/44026 , H01L2924/00
摘要： A heat sink assembly includes a mother board (70), a CPU (50), a pair of retention modules (40), a heat sink (30), and a fastener (20). The retention modules are secured to the mother board at opposite sides of the CPU. The heat sink is attached to the CPU. The fastener includes a spring (26), and a pair of wedges (22) engaged at opposite ends of the spring. The fastener engagingly spans across the heat sink. The spring provides the fastener with resiliency, and presses the wedges against the retention modules. The wedges are pressed by the retention modules toward the CPU, thereby pressing the heat sink against the CPU.
摘要翻译：散热器组件包括母板（70），CPU（50），一对保持模块（40），散热器（30）和紧固件（20）。保持模块在CPU的相对侧固定到母板上。散热器连接到CPU。紧固件包括弹簧（26）和在弹簧的相对端处接合的一对楔形物（22）。紧固件啮合跨越散热器。弹簧为紧固件提供弹性，并将楔子按压在保持模块上。楔块被保持模块按压到CPU，从而将散热片压在CPU上。

4. 发明授权

US06480382B2 Cooling device for hard disc 失效
公开(公告)号：US06480382B2
公开(公告)日：2002-11-12
申请号：US10138323
申请日：2002-05-06
申请人： Henry Cheng
发明人： Henry Cheng
IPC分类号： H05H720
CPC分类号： G11B33/142 , G06F1/20
摘要： A cooling device for a hard disc. The cooling device is screwed to the hard disc by way of screw apertures provided on the bottom of the hard disc. The cooling device includes a housing, at least one cooling fan and at least one contact portion. The cooling fan is received in the housing. The contact portion is connected to the housing. The contact portion is in contact with the chip of the hard disc so that heat generated by the chip is absorbed by the contact portion and transmitted to the housing and then ventilated by the cooling fan.

5. 发明授权

US06396692B1 Electronic control unit with integrated cooling module 失效
标题翻译：带集成冷却模块的电子控制单元
公开(公告)号：US06396692B1
公开(公告)日：2002-05-28
申请号：US09627210
申请日：2000-07-27
申请人： Jasmin B. Farshi , Steven E. Larson
发明人： Jasmin B. Farshi , Steven E. Larson
IPC分类号： H05H720
CPC分类号： H05K7/20872 , H05K7/20254
摘要： An electronic control unit (20) comprising a cooling module (36) having at least one fluid channel (32) therein, a substrate (50) configured to define an interior region (52) and having an electronic component (54) mounted thereto, such that the electronic component (54) faces the interior region (52), and a cooling fluid (34) within the fluid channel (32), the cooling fluid (34) having a temperature below an operating temperature of the electronic component (54), wherein the cooling module (36) is positioned within the interior region (52), such that the heat generated by the electronic component (54) is convectively transferred to the cooling module (36). By integrating the cooling module (36) with the substrate (50) and by positioning the cooling module (36) in the interior region (52), the cooling module (36) is able to convectively cool the substrate (50).
摘要翻译：一种电子控制单元（20），包括其中具有至少一个流体通道（32）的冷却模块（36），被配置为限定内部区域（52）并具有安装在其上的电子部件（54）的基板（50）使得电子部件（54）面向内部区域（52）和流体通道（32）内的冷却流体（34），冷却流体（34）的温度低于电子部件（54）的工作温度），其中所述冷却模块（36）定位在所述内部区域（52）内，使得由所述电子部件（54）产生的热量被对流地传递到所述冷却模块（36）。通过将冷却模块（36）与衬底（50）集成并且通过将冷却模块（36）定位在内部区域（52）中，冷却模块（36）能够对流地冷却衬底（50）。

6. 发明授权

US06317324B1 Encapsulated power supply with a high thermal conductivity molded insert 失效
标题翻译：封装电源具有高导热率的模制插件
公开(公告)号：US06317324B1
公开(公告)日：2001-11-13
申请号：US09496121
申请日：2000-02-01
申请人： Shiaw-Jong Steve Chen , Roger J. Hooey
发明人： Shiaw-Jong Steve Chen , Roger J. Hooey
IPC分类号： H05H720
CPC分类号： H05K7/20454 , H01L2924/0002 , H05K7/20463 , H05K7/209 , H01L2924/00
摘要： The present invention provides an encapsulant structure for retaining an electronic circuit having heat-generating components within a case that at least partially surrounds the electronic circuit. In one advantageous embodiment, the encapsulant structure provides for a thermally conductive insert to be located within the case proximate the heat-generating components. The insert increases the heat transfer efficiency from the electronic circuit to the case.
摘要翻译：本发明提供了一种用于在至少部分地围绕电子电路的壳体内保持具有发热部件的电子电路的密封剂结构。在一个有利的实施例中，密封剂结构提供导热插入件位于靠近发热部件的壳体内。插件增加了从电子电路到壳体的传热效率。

7. 发明授权

US06252772B1 Removable heat sink bumpers on a quad flat package 有权
标题翻译：四方扁平包装上的可拆卸散热片缓冲器
公开(公告)号：US06252772B1
公开(公告)日：2001-06-26
申请号：US09247330
申请日：1999-02-10
申请人： Timothy J. Allen
发明人： Timothy J. Allen
IPC分类号： H05H720
CPC分类号： H01L23/367 , H01L23/3672 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for a quad flat package comprises a heat-radiating plate and a plurality of removable bumpers attached to the plate. An area of reduced thickness is disposed at the junction between each bumper and the plate to facilitate removal of the plurality of bumpers from the plate. Preferably, each bumper includes an alignment feature for engaging a complementary feature formed on one of a mounting substrate and a test fixture.
摘要翻译：用于四边形扁平封装的散热器包括散热板和附接到板的多个可拆卸的保险杠。减小厚度的区域设置在每个保险杠和板之间的接合处，以便于从板上移除多个保险杠。优选地，每个保险杠包括用于接合形成在安装基板和测试夹具之一上的互补特征的对准特征。

8. 发明授权

US06208517B1 Heat sink 有权
标题翻译：散热器
公开(公告)号：US06208517B1
公开(公告)日：2001-03-27
申请号：US09393419
申请日：1999-09-10
申请人： Stephen T. Prince , Toby D. Cole , Kevin C. Brundidge , Larry W. Tucker
发明人： Stephen T. Prince , Toby D. Cole , Kevin C. Brundidge , Larry W. Tucker
IPC分类号： H05H720
CPC分类号： H01L23/3672 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat sink includes mounting feet, a plurality of folds, and a clip. Each of the folds has a base portion, and the clip couples at least two of the folds together to inhibit fanning in at least a contact region defined by adjacent base portions. An apparatus includes a printed circuit board, mounting receptacles on the printed circuit board, a heat sink, and a device package. The heat sink includes feet adapted to interface with the mounting receptacles, a plurality of folds, and a base portion defined between the folds. The device package is coupled to the printed circuit board. The base portion of the heat sink contacts at least a portion of the device package.
摘要翻译：散热器包括安装脚，多个折叠物和夹子。每个折叠具有基部，并且夹子将至少两个折叠部联接在一起，以在至少由相邻基部限定的接触区域中抑制扇形化。一种装置包括印刷电路板，印刷电路板上的安装插座，散热器和装置封装。散热器包括适于与安装插座相接合的脚，多个折叠部以及限定在折叠部之间的基部。器件封装耦合到印刷电路板。散热器的基部接触器件封装的至少一部分。

9. 发明授权

US06768642B2 VME circuit host card with triple mezzanine configuration 失效
标题翻译：具有三重夹层配置的VME电路主机卡
公开(公告)号：US06768642B2
公开(公告)日：2004-07-27
申请号：US10319524
申请日：2002-12-16
申请人： Douglas J. Hines , Eugene J. Urda
发明人： Douglas J. Hines , Eugene J. Urda
IPC分类号： H05H720
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F1/20 , H05K7/1429 , H05K7/1451
摘要： A circuit card assembly includes a host card having connector assemblies and a conduction-cooling path. A first and second mezzanine card each having electronic circuitry defining a component field is mounted to the conduction-cooling path of the host card and connected to the connector assemblies. A third mezzanine card is mounted to the host card and over at least a portion of the component field of the first and second mezzanine cards. A cooling path is provided between the third mezzanine card and the host card and mechanical interference is prevented between the third mezzanine card and the component field due to the profile of the conduction-cooling path. The conduction-cooling path may also be located on the third mezzanine card or on both the host card and the third mezzanine card. The third mezzanine card is connected to the connector assemblies outside of the connector area of the other mezzanine cards.
摘要翻译：电路卡组件包括具有连接器组件和传导冷却路径的主机卡。每个具有限定分量场的电子电路的第一和第二夹层卡被安装到主机卡的传导冷却路径并连接到连接器组件。第三夹层卡被安装到主机卡和第一和第二夹层卡的分量场的至少一部分上。在第三夹层卡和主卡之间提供冷却路径，并且由于传导冷却路径的轮廓，在第三夹层卡和部件场之间可以防止机械干扰。传导冷却路径也可以位于第三夹层卡上或主机卡和第三夹层卡上。第三夹层卡连接到另一个夹层卡的连接器区域外部的连接器组件。

10. 发明授权

US06747871B2 Electronic equipment assembly 失效
标题翻译：电子设备组装
公开(公告)号：US06747871B2
公开(公告)日：2004-06-08
申请号：US10143329
申请日：2002-05-10
申请人： Jean-Marie Jeudi
发明人： Jean-Marie Jeudi
IPC分类号： H05H720
CPC分类号： G06F1/20
摘要： The present invention relates to an electronic assembly and, more particularly, to a computing assembly comprising a computing platform and an external power supply. The computing platform has an internal cooling mechanism which generates an externally directed flow of air. The external power supply is disposed relative to the cooling mechanism such that the outwardly directed flow of air, or at least a portion thereof, passes through the power supply and exerts a cooling influence on the external power supply.
摘要翻译：电子组件技术领域本发明涉及电子组件，更具体地，涉及包括计算平台和外部电源的计算组件。计算平台具有内部冷却机制，其产生外部指向的空气流。外部电源相对于冷却机构设置，使得空气的向外流动或其至少一部分通过电源并对外部电源施加冷却影响。

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