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1. 发明授权

US5252519A Multilayered ceramic substrate and method of manufacturing the same 失效
标题翻译：多层陶瓷基板及其制造方法
公开(公告)号：US5252519A
公开(公告)日：1993-10-12
申请号：US785750
申请日：1991-10-31
申请人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Yasuhiko Hakotani
发明人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Yasuhiko Hakotani
IPC分类号： H01B1/22 , H01L23/498 , H05K1/09 , H05K3/46 , H01L21/60
CPC分类号： H05K1/092 , H01L23/49822 , H01L23/49883 , H01L2224/16225 , H01L2224/45144 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , Y10T29/4913
摘要： A multilayered glass-ceramic substrate using copper as wiring material is fabricated by a step of forming wiring patterns with Au paste for connection of semiconductor chip prepared by adding at least one of Ni powder, Pt powder and Pd powder to Au powder, and copper oxide paste mainly composed of CuO powder, on a green sheet, and burning out the organic pattern by heat treatment in air, a step of reducing the copper oxide electrode by heat treatment in a reducing atmosphere containing hydrogen, and a step of sintering the substrate material, copper oxide electrode and gold electrode by heat treatment in nitrogen. Since the Au wiring pattern is formed on the top layer of the multilayered substrate in this constitution, wire bonding of high reliability is realized. Besides, by making use of the excellent solderability of Au, it may be also applied in flip-chip mounting of semiconductor. In addition, in this Au paste composition, the melting point of Au may be raised, and alloying or fusing is avoided if sintered at 900.degree. C. together with Cu electrode.
摘要翻译：使用铜作为布线材料的多层玻璃陶瓷基板通过以下步骤制造：用Au糊形成用于连接通过将Ni粉末，Pt粉末和Pd粉末中的至少一种添加到Au粉末中而制备的半导体芯片的布线图案和氧化铜主要由CuO粉末组成的糊料，在生片上通过在空气中热处理而烧制有机图案，通过在含氢还原气氛中进行热处理来还原氧化铜电极的工序，以及烧结基板材料的工序，氧化铜电极和金电极通过在氮气中热处理。在这种结构中，由于在多层基板的顶层上形成Au布线图形，所以实现了高可靠性的引线接合。此外，通过利用Au的优异的可焊性，也可以应用于半导体的倒装芯片安装。此外，在该Au糊剂组合物中，Au的熔点可以提高，如果在900℃下与Cu电极一起烧结，则避免合金化或熔融。

2. 发明授权

US5014158A Laminated ceramic capacitor 失效
标题翻译：层压陶瓷电容器
公开(公告)号：US5014158A
公开(公告)日：1991-05-07
申请号：US507568
申请日：1990-04-11
申请人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Yasuhiko Hakotani , Tatsuro Kikuchi
发明人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Yasuhiko Hakotani , Tatsuro Kikuchi
IPC分类号： C04B35/49 , H01G4/12
CPC分类号： C04B35/49 , H01G4/1245 , Y10T29/435
摘要： A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electrode layers are made of Ni. The dielectric layers are made of a dielectric ceramic composition having a structural formula of:{Bam(Til-xZrx)O2+m}1-.alpha.-.beta.-{MnO2}.alpha.-{X}.beta.where X is at least one of Yb2O3, Dy2O3, and ThO2 and m, x, .alpha., and .beta. are expressed as:0.98.ltoreq.m.ltoreq.1.020.ltoreq.x.ltoreq.0.20.005.ltoreq..alpha..ltoreq.0.050.001.ltoreq..beta..ltoreq.0.02so that the laminated ceramic capacitor can be minimized in the size, increased in the capacitance, and reduced in the cost of production.
摘要翻译：层叠陶瓷电容器包括用于显影电容的多个内部电极层，夹在内部电极层的电介质层和耦合到其相关联的内部电极层的一对外部电极，用于输出电容。内部电极层由Ni制成。电介质层由结构式为：{Bam（Til-xZrx）O 2 + m} 1-α-β - {MnO 2}α - {X}β的电介质陶瓷组合物制成，其中X是Yb 2 O 3中的至少一种，Dy 2 O 3和ThO 2，m，x，α和β表示为：0.98

3. 发明授权

US5496619A Assembly formed from conductive paste and insulating paste 失效
标题翻译：组装由导电膏和绝缘膏组成
公开(公告)号：US5496619A
公开(公告)日：1996-03-05
申请号：US254414
申请日：1994-06-06
申请人： Minehiro Itagaki , Kazuyuki Okano , Suzushi Kimura , Seiichi Nakatani , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura
发明人： Minehiro Itagaki , Kazuyuki Okano , Suzushi Kimura , Seiichi Nakatani , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura
IPC分类号： H01L23/498 , B32B15/04 , B32B17/06 , H01B1/16 , H01L21/4763
CPC分类号： H01L23/49883 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , Y10T428/24917
摘要： Conductive paste for via connection of a multilayer ceramic substrate, comprising: an inorganic component which consists of 30.0 to 70.0% by weight of powder of conductive material and the remainder being one of glass powder having a softening point higher than a starting point of sintering of insulating material and crystalline glass ceramic powder having a glass transition point higher than the starting point of sintering of the insulating material; and an organics vehicle component which consists of at least organic binder and solvent.
摘要翻译：用于多层陶瓷基板的通孔连接的导电浆料，其包含：无机成分，其由导电材料粉末的30.0〜70.0重量％组成，其余为软化点高于烧结起始点的玻璃粉末之一绝缘材料和晶体玻璃陶瓷粉末，其玻璃化转变点高于绝缘材料的烧结起点; 以及由至少有机粘合剂和溶剂组成的有机物载体组分。

4. 发明授权

US5370759A Method for producing multilayered ceramic substrate 失效
标题翻译：多层陶瓷基板的制造方法
公开(公告)号：US5370759A
公开(公告)日：1994-12-06
申请号：US60981
申请日：1993-05-14
申请人： Yasuhiko Hakotani , Seiichi Nakatani , Tsuneharu Katada , Satoru Yuhaku , Kazuhiro Miura , Yoshifumi Nakamura
发明人： Yasuhiko Hakotani , Seiichi Nakatani , Tsuneharu Katada , Satoru Yuhaku , Kazuhiro Miura , Yoshifumi Nakamura
IPC分类号： H01L21/48 , H01L23/498 , B32B31/16 , B32B18/00
CPC分类号： H01L23/49822 , H01L21/4857 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011
摘要： A method for producing a multilayered ceramic substrate including the steps of:forming at least two green sheets each including a low-temperature firing glass-ceramic substrate material,forming an electrode pattern and a via hole electrode on and through each green sheet with a conductor paste,laminating said green sheets to obtain a laminate,forming a pair of green sheets which include an inorganic material which is not sintered at a firing temperature of the green sheet of the low-temperature firing glass-ceramic substrate material or lower, and then forming a hole through the inorganic material green sheet,laminating the inorganic material green sheet on the outermost green sheet of the laminate to obtain a resultant laminate in which the hole is positioned over a portion of the electrode pattern of an outermost low-temperature firing glass-ceramic green sheets of the laminate,firing said resultant laminate at the firing temperature, andremoving the unsintered inorganic material. The substrate does not shrink in its plane direction and surface smoothness, electrical resistance and solderability of the top layer wiring pattern are improved.
摘要翻译：一种多层陶瓷基板的制造方法，其特征在于，包括以下步骤：在导体上形成至少两个生坯片，每个生片包括低温焙烧玻璃陶瓷基板材料，在每个生片上形成电极图案和通孔电极，糊状，层压所述生片以获得层压体，形成一对生片，其包括在低温焙烧玻璃 - 陶瓷基片材料的生片的烧成温度以下未烧结的无机材料，然后通过无机材料生片形成孔，将无机材料生片层叠在层压体的最外层生片上，得到所得到的层叠体，其中孔位于最外层低温烧成玻璃的电极图案的一部分上 - 陶瓷生片，在烧成温度下焙烧所得到的层压体，除去未烧结的无机物 ial 基板在其平面方向上不收缩，并且提高了顶层布线图案的表面平滑度，电阻和可焊性。

5. 发明授权

US5004715A Dielectric ceramic composition and a multilayer ceramic capacitor and a method of manufacturing a multilayer ceramic capacitor 失效
标题翻译：介电陶瓷组合物和多层陶瓷电容器以及制造多层陶瓷电容器的方法
公开(公告)号：US5004715A
公开(公告)日：1991-04-02
申请号：US483462
申请日：1990-02-22
申请人： Yasuhiko Hakotani , Seiichi Nakatani , Satoru Yuuhaku , Tsutomu Nishimura , Toru Ishida
发明人： Yasuhiko Hakotani , Seiichi Nakatani , Satoru Yuuhaku , Tsutomu Nishimura , Toru Ishida
IPC分类号： C04B35/00 , C04B35/497 , C04B35/499 , H01B3/12 , H01G4/008 , H01G4/12
CPC分类号： H01G4/0085 , C04B35/497 , C04B35/499 , H01G4/1254
摘要： A low temperature sintering dielectric ceramic composition, which exhibits high dielectric constant, low dielectric loss, high electrical resistivity, high mechanical strength and narrow grain size distribution, is disclosed. The ceramic composition is a binary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3) and copper oxide, or a ternary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3), lead titanate (PbTiO.sub.3) and copper oxide. A multilayer ceramic capacitor comprising internal copper electrodes and ceramic dielectric layers consisting of the dielectric ceramic composition is also disclosed. A method of readily manufacturing the multilayer ceramic capacitor with copper internal electrodes is also disclosed.This fabrication method comprises a stop of forming a multilayer laminate by the green tape multilayer laminating method using dielectric ceramic tapes and a conductor paste containing CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of reducing CuO in the internal electrode layers to copper by heat-treatment in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of sintering the multilayer laminate in a nitrogen atmosphere (sintering process).
摘要翻译：公开了一种具有高介电常数，低介电损耗，高电阻率，高机械强度和窄晶粒尺寸分布的低温烧结介电陶瓷组合物。陶瓷组合物是包含铌酸铅镁（Pb（Mg1 / 3Nb2 / 3）O3）和氧化铜的二元体系，或包含铌酸铅镁（Pb（Mg1 / 3Nb2 / 3）O3），钛酸铅（PbTiO3））和氧化铜。还公开了一种包括内部铜电极和由介电陶瓷组合物组成的陶瓷电介质层的多层陶瓷电容器。还公开了一种容易地制造具有铜内部电极的多层陶瓷电容器的方法。该制造方法包括通过使用电介质陶瓷带和含有CuO作为其主要成分的导体糊的生胶带多层层压法来形成多层层压体; 在空气中分解除去有机粘合剂的热处理步骤（粘合剂除去工艺）; 通过在氮气和氢气的混合气体气氛中通过热处理将内部电极层中的CuO还原成铜的步骤（还原过程）; 以及在氮气氛中烧结多层层叠体的工序（烧结工序）。

6. 发明授权

US5688441A Thixotropic conductive paste 失效
标题翻译：触变导电胶
公开(公告)号：US5688441A
公开(公告)日：1997-11-18
申请号：US581352
申请日：1995-12-26
申请人： Minehiro Itagaki , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura , Kazuyuki Okano
发明人： Minehiro Itagaki , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura , Kazuyuki Okano
IPC分类号： C04B41/88 , H01B1/16 , H01L21/48 , H01L23/498 , H05K1/09 , H05K3/46 , H01B1/22
CPC分类号： H01L23/49883 , H01L21/486 , H01L2924/0002 , H01L2924/09701 , H05K1/092
摘要： A conductive paste includes inorganic material powders containing conductive powders and glass powders, an organic vehicle containing an organic binder and an organic solvent, and a metal organic compound.
摘要翻译：导电浆料包括含有导电粉末和玻璃粉末的无机材料粉末，含有机粘合剂和有机溶剂的有机载体和金属有机化合物。

7. 发明授权

US5407473A Conductive ink 失效
标题翻译：导电油墨
公开(公告)号：US5407473A
公开(公告)日：1995-04-18
申请号：US174807
申请日：1993-12-29
申请人： Kazuhiro Miura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Yoshifumi Nakamura , Akihiko Miyoshi
发明人： Kazuhiro Miura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Yoshifumi Nakamura , Akihiko Miyoshi
IPC分类号： H01B1/14 , H01L23/498 , H05K1/09 , C09D11/02
CPC分类号： H01B1/14 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/092
摘要： Conductive ink has an inorganic compound comprising 70.0-95.0 wt. % of CuO which is conductive and 5.0-30.0 wt. % of inorganic binder mixed with each other, and solvent and organic binder in which the inorganic compound is dispersed. The inorganic binder consists of lead borosilicate crystalline glass or aluminum borosilicate crystalline glass soften and crystallizes at 850.degree.-950.degree. C. The diameter of CuO powder of the inorganic compound is 100-7.0 .mu.m. The diameter of the lead borosilicate crystalline glass powder or the aluminum borosilicate crystalline glass powder of the inorganic compound is 1.0-5.0 .mu.m. The organic binder consists of ethyl cellulose or copolymer of polyisobytylmethacrylate and poly.alpha.-methylstyrene. The conductive ink contains the organic binder at 0.5-2.0 wt. %.
摘要翻译：导电油墨具有70.0-95.0重量％的无机化合物。导电的CuO％和5.0-30.0wt。相互混合的无机粘合剂的％，以及其中分散无机化合物的溶剂和有机粘合剂。无机粘合剂由硼硅酸铅晶体玻璃或硼硅酸铝晶体玻璃软化并在850-950℃下结晶。无机化合物的CuO粉末的直径为100-7.0μm。硼硅酸铅晶体玻璃粉末或无机化合物的硼硅酸铝结晶玻璃粉末的直径为1.0-5.0μm。有机粘合剂由乙基纤维素或聚甲基丙烯酸异丁酯和聚α-甲基苯乙烯的共聚物组成。导电油墨含有0.5-2.0重量％的有机粘合剂。％。

8. 发明授权

US5662755A Method of making multi-layered ceramic substrates 失效
标题翻译：制作多层陶瓷基板的方法
公开(公告)号：US5662755A
公开(公告)日：1997-09-02
申请号：US526312
申请日：1995-09-11
申请人： Kazuhiro Miura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Yoshifumi Nakamura , Akihiko Miyoshi
发明人： Kazuhiro Miura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Yoshifumi Nakamura , Akihiko Miyoshi
IPC分类号： H01L21/48 , H01L23/15 , H05K3/24 , B32B31/26 , B32B31/12
CPC分类号： H05K3/248 , H01L21/4857 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K2203/308 , H05K3/4629 , Y10T29/49163
摘要： A method of making a multi-layered ceramic substrate which includes the steps of laminating a desired number of green sheets each being made of glass ceramics containing at least an organic binder and a solvent and each having a pattern of electrodes formed thereon by the use of an electroconductive paste, to thereby provide a green sheet laminate, The electrodes on opposite surfaces or an entire surface layer of the green sheet laminate are subsequently printed with a paste comprising an inorganic component added with at least an organic binder containing a Zn composition. On each surface of the laminate printed with the paste of the Zn composition, a green sheet made of an inorganic composition incapable of being sintered at a temperature of crystallization of the glass ceramics is then laminated thereby providing a laminate plate which is subsequently fired. After the firing, both of the inorganic composition incapable of firing sintered and the Zn composition are removed from the opposite surfaces of the laminate. The paste of the Zn composition may contains a main component selected from the group consisting of Zn, ZnO, Zn(OH).sub.2, ZnAl.sub.2 O.sub.4, and ZnCO.sub.3.
摘要翻译：一种制造多层陶瓷基板的方法，其包括以下步骤：将所需数量的生坯片材层叠，所述生坯片材由至少含有有机粘合剂和溶剂的玻璃陶瓷制成，并且各自具有通过使用导电糊，从而提供生片层压体。随后用包含添加至少含有Zn组合物的有机粘合剂的无机组分的糊料印刷相对表面上的电极或生片层压体的整个表面层。在印有Zn组合物的糊料的层压板的每个表面上，将由玻璃陶瓷的结晶温度下不能烧结的无机组合物制成的生片层叠，从而提供随后烧制的层压板。烧成后，从层叠体的相对面除去无法烧成的无机组合物和Zn组合物。 Zn组合物的糊剂可以含有选自Zn，ZnO，Zn（OH）2，ZnAl 2 O 4和ZnCO 3的主要成分。

9. 发明授权

US5547530A Method of manufacturing a ceramic substrate 失效
标题翻译：制造陶瓷基板的方法
公开(公告)号：US5547530A
公开(公告)日：1996-08-20
申请号：US189482
申请日：1994-01-31
申请人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
发明人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
IPC分类号： H01L21/48 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/46 , B32B31/04 , B32B31/12 , B32B31/24 , C04B41/81
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/4867 , H01L2224/48091 , H01L2224/48227 , H01L2924/01087 , H01L2924/09701 , H01L2924/19105 , H05K1/0306 , H05K1/092 , H05K2201/035 , H05K2201/0367 , H05K3/4611 , H05K3/4629 , Y10T29/49163 , Y10T428/24273 , Y10T428/24917 , Y10T428/24926
摘要： The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
摘要翻译：本发明的具有多个凸块的陶瓷基板的制造方法包括以下步骤：在生片层叠体的上表面和下表面的至少一个上形成具有多个孔的凸块形成层; 用凸块形成膏填充凸块形成层中的孔; 烧结生片和凸起形成膏的层压体; 以及通过去除所述凸起形成层来形成由所述烧结凸块形成用糊料形成的凸块。

10. 发明授权

US5525402A Ceramic substrate and manufacturing method thereof 失效
标题翻译：陶瓷基板及其制造方法
公开(公告)号：US5525402A
公开(公告)日：1996-06-11
申请号：US393732
申请日：1995-02-24
申请人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
发明人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
IPC分类号： H01L21/48 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/4867 , H01L2224/48091 , H01L2224/48227 , H01L2924/01087 , H01L2924/09701 , H01L2924/19105 , H05K1/0306 , H05K1/092 , H05K2201/035 , H05K2201/0367 , H05K3/4611 , H05K3/4629 , Y10T29/49163 , Y10T428/24273 , Y10T428/24917 , Y10T428/24926
摘要： The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming layer; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
摘要翻译：本发明的具有多个凸块的陶瓷基板的制造方法包括以下步骤：在生片层叠体的上表面和下表面的至少一个上形成具有多个孔的凸块形成层; 用凸块形成膏填充凸块形成层中的孔; 烧结生片和凸起形成层的层叠体; 以及通过去除所述凸起形成层来形成由所述烧结凸块形成用糊料形成的凸块。

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