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    • 3. 发明授权
    • Dielectric ceramic composition and a multilayer ceramic capacitor and a
method of manufacturing a multilayer ceramic capacitor
    • 介电陶瓷组合物和多层陶瓷电容器以及制造多层陶瓷电容器的方法
    • US5004715A
    • 1991-04-02
    • US483462
    • 1990-02-22
    • Yasuhiko HakotaniSeiichi NakataniSatoru YuuhakuTsutomu NishimuraToru Ishida
    • Yasuhiko HakotaniSeiichi NakataniSatoru YuuhakuTsutomu NishimuraToru Ishida
    • C04B35/00C04B35/497C04B35/499H01B3/12H01G4/008H01G4/12
    • H01G4/0085C04B35/497C04B35/499H01G4/1254
    • A low temperature sintering dielectric ceramic composition, which exhibits high dielectric constant, low dielectric loss, high electrical resistivity, high mechanical strength and narrow grain size distribution, is disclosed. The ceramic composition is a binary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3) and copper oxide, or a ternary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3), lead titanate (PbTiO.sub.3) and copper oxide. A multilayer ceramic capacitor comprising internal copper electrodes and ceramic dielectric layers consisting of the dielectric ceramic composition is also disclosed. A method of readily manufacturing the multilayer ceramic capacitor with copper internal electrodes is also disclosed.This fabrication method comprises a stop of forming a multilayer laminate by the green tape multilayer laminating method using dielectric ceramic tapes and a conductor paste containing CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of reducing CuO in the internal electrode layers to copper by heat-treatment in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of sintering the multilayer laminate in a nitrogen atmosphere (sintering process).
    • 公开了一种具有高介电常数,低介电损耗,高电阻率,高机械强度和窄晶粒尺寸分布的低温烧结介电陶瓷组合物。 陶瓷组合物是包含铌酸铅镁(Pb(Mg1 / 3Nb2 / 3)O3)和氧化铜的二元体系,或包含铌酸铅镁(Pb(Mg1 / 3Nb2 / 3)O3),钛酸铅(PbTiO3) )和氧化铜。 还公开了一种包括内部铜电极和由介电陶瓷组合物组成的陶瓷电介质层的多层陶瓷电容器。 还公开了一种容易地制造具有铜内部电极的多层陶瓷电容器的方法。 该制造方法包括通过使用电介质陶瓷带和含有CuO作为其主要成分的导体糊的生胶带多层层压法来形成多层层压体; 在空气中分解除去有机粘合剂的热处理步骤(粘合剂除去工艺); 通过在氮气和氢气的混合气体气氛中通过热处理将内部电极层中的CuO还原成铜的步骤(还原过程); 以及在氮气氛中烧结多层层叠体的工序(烧结工序)。
    • 8. 发明授权
    • Method of manufacturing a multilayer ceramic body
    • 制造多层陶瓷体的方法
    • US4795512A
    • 1989-01-03
    • US18579
    • 1987-02-25
    • Seiichi NakataniTsutomu NishimuraSatoru YuhakuToru Ishida
    • Seiichi NakataniTsutomu NishimuraSatoru YuhakuToru Ishida
    • B32B18/00C04B35/622C04B35/64H05K1/03H05K1/09H05K3/46H01B1/06
    • H05K3/4629B32B18/00C04B35/622C04B35/64H05K3/4611C04B2235/6567C04B2235/658C04B2237/343C04B2237/525C04B2237/62C04B2237/68C04B2237/704C04B2237/76H05K1/0306H05K1/092
    • A method of manufacturing a multilayer ceramic using Cu as the conductor material is disclosed. This method comprises a step of forming a multilayer laminate by the green tape multilayer laminating method or by the thick film printing method on ceramic substrate with an insulating material with a mixture of ceramic and glass containing lead oxide as its main component and a conductor paste with CuO as its main component; a step of heat-treatment for decomposing and removing organic binder in air (binder removing process); a step of causing reduction at temperatures where copper oxide is reduced, but lead oxide is not, in a mixed gas atmosphere of nitrogen and hydrogen (reduction process); and a step of firing in a nitrogen atmosphere, thereby effecting sintering of the insulating material composed of ceramic and glass containing lead oxide and metallization of copper electrodes (firing process). For the uppermost layer electrodes, metal copper paste is employed, and a pattern printing process is conducted subsequent to the aforementioned reduction process, so that the sintering of the insulating material and the metallization of the uppermost layer are simultaneously performed; in this way, highly reliable uppermost layer Cu electrodes are obtainable.
    • 公开了使用Cu作为导体材料的多层陶瓷的制造方法。 该方法包括通过生胶带多层层压法或通过厚膜印刷方法在陶瓷基板上形成多层层压体的步骤,其中绝缘材料与陶瓷和玻璃的混合物以含氧化铅为主要成分的混合物和具有 CuO为主要成分; 在空气中分解除去有机粘合剂的热处理步骤(粘合剂除去工艺); 在氮和氢的混合气体气氛中还原氧化铜还原的氧化还原反应的步骤(还原过程); 以及在氮气气氛中烧成的步骤,从而实现由含有氧化铅的陶瓷和玻璃构成的绝缘材料和铜电极的金属化(烧成工序)的烧结。 对于最上层电极,使用金属铜膏,并且在上述还原处理之后进行图案印刷工艺,使得绝缘材料的烧结和最上层的金属化同时进行; 以这种方式,可以获得高可靠性的最上层Cu电极。