专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5496619A Assembly formed from conductive paste and insulating paste 失效
标题翻译：组装由导电膏和绝缘膏组成
公开(公告)号：US5496619A
公开(公告)日：1996-03-05
申请号：US254414
申请日：1994-06-06
申请人： Minehiro Itagaki , Kazuyuki Okano , Suzushi Kimura , Seiichi Nakatani , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura
发明人： Minehiro Itagaki , Kazuyuki Okano , Suzushi Kimura , Seiichi Nakatani , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura
IPC分类号： H01L23/498 , B32B15/04 , B32B17/06 , H01B1/16 , H01L21/4763
CPC分类号： H01L23/49883 , H01L2924/0002 , H01L2924/09701 , Y10S428/901 , Y10T428/24917
摘要： Conductive paste for via connection of a multilayer ceramic substrate, comprising: an inorganic component which consists of 30.0 to 70.0% by weight of powder of conductive material and the remainder being one of glass powder having a softening point higher than a starting point of sintering of insulating material and crystalline glass ceramic powder having a glass transition point higher than the starting point of sintering of the insulating material; and an organics vehicle component which consists of at least organic binder and solvent.
摘要翻译：用于多层陶瓷基板的通孔连接的导电浆料，其包含：无机成分，其由导电材料粉末的30.0〜70.0重量％组成，其余为软化点高于烧结起始点的玻璃粉末之一绝缘材料和晶体玻璃陶瓷粉末，其玻璃化转变点高于绝缘材料的烧结起点; 以及由至少有机粘合剂和溶剂组成的有机物载体组分。

2. 发明授权

US5688441A Thixotropic conductive paste 失效
标题翻译：触变导电胶
公开(公告)号：US5688441A
公开(公告)日：1997-11-18
申请号：US581352
申请日：1995-12-26
申请人： Minehiro Itagaki , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura , Kazuyuki Okano
发明人： Minehiro Itagaki , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura , Kazuyuki Okano
IPC分类号： C04B41/88 , H01B1/16 , H01L21/48 , H01L23/498 , H05K1/09 , H05K3/46 , H01B1/22
CPC分类号： H01L23/49883 , H01L21/486 , H01L2924/0002 , H01L2924/09701 , H05K1/092
摘要： A conductive paste includes inorganic material powders containing conductive powders and glass powders, an organic vehicle containing an organic binder and an organic solvent, and a metal organic compound.
摘要翻译：导电浆料包括含有导电粉末和玻璃粉末的无机材料粉末，含有机粘合剂和有机溶剂的有机载体和金属有机化合物。

3. 发明授权

US5503777A Thixotropic conductive paste 失效
标题翻译：触变导电胶
公开(公告)号：US5503777A
公开(公告)日：1996-04-02
申请号：US240376
申请日：1994-05-10
申请人： Minehiro Itagaki , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura , Kazuyuki Okano
发明人： Minehiro Itagaki , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Kazuhiro Miura , Kazuyuki Okano
IPC分类号： C04B41/88 , H01B1/16 , H01L21/48 , H01L23/498 , H05K1/09 , H05K3/46 , C09D5/00 , C08K3/08
CPC分类号： H01L23/49883 , H01L21/486 , H01L2924/0002 , H01L2924/09701 , H05K1/092
摘要： A conductive paste includes inorganic material powders containing conductive powders and glass powders, an organic vehicle containing an organic binder and an organic solvent, and a metal organic compound.
摘要翻译：导电浆料包括含有导电粉末和玻璃粉末的无机材料粉末，含有机粘合剂和有机溶剂的有机载体和金属有机化合物。

4. 发明授权

US5407473A Conductive ink 失效
标题翻译：导电油墨
公开(公告)号：US5407473A
公开(公告)日：1995-04-18
申请号：US174807
申请日：1993-12-29
申请人： Kazuhiro Miura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Yoshifumi Nakamura , Akihiko Miyoshi
发明人： Kazuhiro Miura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Yoshifumi Nakamura , Akihiko Miyoshi
IPC分类号： H01B1/14 , H01L23/498 , H05K1/09 , C09D11/02
CPC分类号： H01B1/14 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/092
摘要： Conductive ink has an inorganic compound comprising 70.0-95.0 wt. % of CuO which is conductive and 5.0-30.0 wt. % of inorganic binder mixed with each other, and solvent and organic binder in which the inorganic compound is dispersed. The inorganic binder consists of lead borosilicate crystalline glass or aluminum borosilicate crystalline glass soften and crystallizes at 850.degree.-950.degree. C. The diameter of CuO powder of the inorganic compound is 100-7.0 .mu.m. The diameter of the lead borosilicate crystalline glass powder or the aluminum borosilicate crystalline glass powder of the inorganic compound is 1.0-5.0 .mu.m. The organic binder consists of ethyl cellulose or copolymer of polyisobytylmethacrylate and poly.alpha.-methylstyrene. The conductive ink contains the organic binder at 0.5-2.0 wt. %.
摘要翻译：导电油墨具有70.0-95.0重量％的无机化合物。导电的CuO％和5.0-30.0wt。相互混合的无机粘合剂的％，以及其中分散无机化合物的溶剂和有机粘合剂。无机粘合剂由硼硅酸铅晶体玻璃或硼硅酸铝晶体玻璃软化并在850-950℃下结晶。无机化合物的CuO粉末的直径为100-7.0μm。硼硅酸铅晶体玻璃粉末或无机化合物的硼硅酸铝结晶玻璃粉末的直径为1.0-5.0μm。有机粘合剂由乙基纤维素或聚甲基丙烯酸异丁酯和聚α-甲基苯乙烯的共聚物组成。导电油墨含有0.5-2.0重量％的有机粘合剂。％。

5. 发明授权

US5547530A Method of manufacturing a ceramic substrate 失效
标题翻译：制造陶瓷基板的方法
公开(公告)号：US5547530A
公开(公告)日：1996-08-20
申请号：US189482
申请日：1994-01-31
申请人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
发明人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
IPC分类号： H01L21/48 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/46 , B32B31/04 , B32B31/12 , B32B31/24 , C04B41/81
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/4867 , H01L2224/48091 , H01L2224/48227 , H01L2924/01087 , H01L2924/09701 , H01L2924/19105 , H05K1/0306 , H05K1/092 , H05K2201/035 , H05K2201/0367 , H05K3/4611 , H05K3/4629 , Y10T29/49163 , Y10T428/24273 , Y10T428/24917 , Y10T428/24926
摘要： The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
摘要翻译：本发明的具有多个凸块的陶瓷基板的制造方法包括以下步骤：在生片层叠体的上表面和下表面的至少一个上形成具有多个孔的凸块形成层; 用凸块形成膏填充凸块形成层中的孔; 烧结生片和凸起形成膏的层压体; 以及通过去除所述凸起形成层来形成由所述烧结凸块形成用糊料形成的凸块。

6. 发明授权

US5525402A Ceramic substrate and manufacturing method thereof 失效
标题翻译：陶瓷基板及其制造方法
公开(公告)号：US5525402A
公开(公告)日：1996-06-11
申请号：US393732
申请日：1995-02-24
申请人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
发明人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
IPC分类号： H01L21/48 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H05K3/4007 , H01L21/4853 , H01L21/4867 , H01L2224/48091 , H01L2224/48227 , H01L2924/01087 , H01L2924/09701 , H01L2924/19105 , H05K1/0306 , H05K1/092 , H05K2201/035 , H05K2201/0367 , H05K3/4611 , H05K3/4629 , Y10T29/49163 , Y10T428/24273 , Y10T428/24917 , Y10T428/24926
摘要： The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming layer; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
摘要翻译：本发明的具有多个凸块的陶瓷基板的制造方法包括以下步骤：在生片层叠体的上表面和下表面的至少一个上形成具有多个孔的凸块形成层; 用凸块形成膏填充凸块形成层中的孔; 烧结生片和凸起形成层的层叠体; 以及通过去除所述凸起形成层来形成由所述烧结凸块形成用糊料形成的凸块。

7. 发明授权

US5662755A Method of making multi-layered ceramic substrates 失效
标题翻译：制作多层陶瓷基板的方法
公开(公告)号：US5662755A
公开(公告)日：1997-09-02
申请号：US526312
申请日：1995-09-11
申请人： Kazuhiro Miura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Yoshifumi Nakamura , Akihiko Miyoshi
发明人： Kazuhiro Miura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Yoshifumi Nakamura , Akihiko Miyoshi
IPC分类号： H01L21/48 , H01L23/15 , H05K3/24 , B32B31/26 , B32B31/12
CPC分类号： H05K3/248 , H01L21/4857 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K2203/308 , H05K3/4629 , Y10T29/49163
摘要： A method of making a multi-layered ceramic substrate which includes the steps of laminating a desired number of green sheets each being made of glass ceramics containing at least an organic binder and a solvent and each having a pattern of electrodes formed thereon by the use of an electroconductive paste, to thereby provide a green sheet laminate, The electrodes on opposite surfaces or an entire surface layer of the green sheet laminate are subsequently printed with a paste comprising an inorganic component added with at least an organic binder containing a Zn composition. On each surface of the laminate printed with the paste of the Zn composition, a green sheet made of an inorganic composition incapable of being sintered at a temperature of crystallization of the glass ceramics is then laminated thereby providing a laminate plate which is subsequently fired. After the firing, both of the inorganic composition incapable of firing sintered and the Zn composition are removed from the opposite surfaces of the laminate. The paste of the Zn composition may contains a main component selected from the group consisting of Zn, ZnO, Zn(OH).sub.2, ZnAl.sub.2 O.sub.4, and ZnCO.sub.3.
摘要翻译：一种制造多层陶瓷基板的方法，其包括以下步骤：将所需数量的生坯片材层叠，所述生坯片材由至少含有有机粘合剂和溶剂的玻璃陶瓷制成，并且各自具有通过使用导电糊，从而提供生片层压体。随后用包含添加至少含有Zn组合物的有机粘合剂的无机组分的糊料印刷相对表面上的电极或生片层压体的整个表面层。在印有Zn组合物的糊料的层压板的每个表面上，将由玻璃陶瓷的结晶温度下不能烧结的无机组合物制成的生片层叠，从而提供随后烧制的层压板。烧成后，从层叠体的相对面除去无法烧成的无机组合物和Zn组合物。 Zn组合物的糊剂可以含有选自Zn，ZnO，Zn（OH）2，ZnAl 2 O 4和ZnCO 3的主要成分。

8. 发明授权

US5370759A Method for producing multilayered ceramic substrate 失效
标题翻译：多层陶瓷基板的制造方法
公开(公告)号：US5370759A
公开(公告)日：1994-12-06
申请号：US60981
申请日：1993-05-14
申请人： Yasuhiko Hakotani , Seiichi Nakatani , Tsuneharu Katada , Satoru Yuhaku , Kazuhiro Miura , Yoshifumi Nakamura
发明人： Yasuhiko Hakotani , Seiichi Nakatani , Tsuneharu Katada , Satoru Yuhaku , Kazuhiro Miura , Yoshifumi Nakamura
IPC分类号： H01L21/48 , H01L23/498 , B32B31/16 , B32B18/00
CPC分类号： H01L23/49822 , H01L21/4857 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011
摘要： A method for producing a multilayered ceramic substrate including the steps of:forming at least two green sheets each including a low-temperature firing glass-ceramic substrate material,forming an electrode pattern and a via hole electrode on and through each green sheet with a conductor paste,laminating said green sheets to obtain a laminate,forming a pair of green sheets which include an inorganic material which is not sintered at a firing temperature of the green sheet of the low-temperature firing glass-ceramic substrate material or lower, and then forming a hole through the inorganic material green sheet,laminating the inorganic material green sheet on the outermost green sheet of the laminate to obtain a resultant laminate in which the hole is positioned over a portion of the electrode pattern of an outermost low-temperature firing glass-ceramic green sheets of the laminate,firing said resultant laminate at the firing temperature, andremoving the unsintered inorganic material. The substrate does not shrink in its plane direction and surface smoothness, electrical resistance and solderability of the top layer wiring pattern are improved.
摘要翻译：一种多层陶瓷基板的制造方法，其特征在于，包括以下步骤：在导体上形成至少两个生坯片，每个生片包括低温焙烧玻璃陶瓷基板材料，在每个生片上形成电极图案和通孔电极，糊状，层压所述生片以获得层压体，形成一对生片，其包括在低温焙烧玻璃 - 陶瓷基片材料的生片的烧成温度以下未烧结的无机材料，然后通过无机材料生片形成孔，将无机材料生片层叠在层压体的最外层生片上，得到所得到的层叠体，其中孔位于最外层低温烧成玻璃的电极图案的一部分上 - 陶瓷生片，在烧成温度下焙烧所得到的层压体，除去未烧结的无机物 ial 基板在其平面方向上不收缩，并且提高了顶层布线图案的表面平滑度，电阻和可焊性。

9. 发明授权

US4906405A Conductor composition and method of manufacturing a multilayered ceramic body using the composition 失效
标题翻译：导体组合物和使用该组合物制造多层陶瓷体的方法
公开(公告)号：US4906405A
公开(公告)日：1990-03-06
申请号：US194967
申请日：1988-05-17
申请人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Minehiro Itagaki
发明人： Seiichi Nakatani , Tsutomu Nishimura , Satoru Yuhaku , Minehiro Itagaki
IPC分类号： H01B1/08 , H05K1/03 , H05K1/09 , H05K3/46
CPC分类号： H05K3/4611 , C03C3/072 , C03C8/14 , H01B1/08 , H05K1/092 , H05K3/4629 , H05K1/0306
摘要： Disclosed are a CuO conductor paste which is effective for making a multilayered ceramic body, the conductor material of which is made of copper, and a method of manufacturing a multilayered ceramic body using the conductor paste. The conductor paste is made of CuO as the main component with an addition of at least one of PbO-based glass, or any of Bi.sub.2 O.sub.3 -based glass, CuO-based glass and CuAl.sub.2 O.sub.4 as the additive. The multilayered ceramic body is manufactured by a method comprising a forming process for making a multilayered body from the conductor paste and dielectric material, a binder removing process by heat treating the multilayered body, thus obtained, in air, a reduction process for reducing CuO to copper in a mixed gas atmosphere of hydrogen and nitrogen, and a sintering process for sintering the multilayered body thus reduced in a nitrogen gas atmosphere.
摘要翻译：公开了一种CuO导体糊，其制造多层陶瓷体，其导体材料由铜制成，以及使用该导体膏制造多层陶瓷体的方法。导体糊以CuO为主要成分，添加PbO系玻璃，Bi2O3系玻璃，CuO系玻璃，CuAl 2 O 4等中的至少一种作为添加剂。多层陶瓷体通过包括从导体糊和电介质材料制造多层体的成形方法的方法制造，通过在空气中热处理由此获得的多层体的粘合剂去除工艺，将CuO还原为在氢气和氮气的混合气体气氛中的铜，以及在氮气气氛中烧结多层体的烧结方法。

10. 发明授权

US5014158A Laminated ceramic capacitor 失效
标题翻译：层压陶瓷电容器
公开(公告)号：US5014158A
公开(公告)日：1991-05-07
申请号：US507568
申请日：1990-04-11
申请人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Yasuhiko Hakotani , Tatsuro Kikuchi
发明人： Tsutomu Nishimura , Seiichi Nakatani , Satoru Yuhaku , Yasuhiko Hakotani , Tatsuro Kikuchi
IPC分类号： C04B35/49 , H01G4/12
CPC分类号： C04B35/49 , H01G4/1245 , Y10T29/435
摘要： A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electrode layers are made of Ni. The dielectric layers are made of a dielectric ceramic composition having a structural formula of:{Bam(Til-xZrx)O2+m}1-.alpha.-.beta.-{MnO2}.alpha.-{X}.beta.where X is at least one of Yb2O3, Dy2O3, and ThO2 and m, x, .alpha., and .beta. are expressed as:0.98.ltoreq.m.ltoreq.1.020.ltoreq.x.ltoreq.0.20.005.ltoreq..alpha..ltoreq.0.050.001.ltoreq..beta..ltoreq.0.02so that the laminated ceramic capacitor can be minimized in the size, increased in the capacitance, and reduced in the cost of production.
摘要翻译：层叠陶瓷电容器包括用于显影电容的多个内部电极层，夹在内部电极层的电介质层和耦合到其相关联的内部电极层的一对外部电极，用于输出电容。内部电极层由Ni制成。电介质层由结构式为：{Bam（Til-xZrx）O 2 + m} 1-α-β - {MnO 2}α - {X}β的电介质陶瓷组合物制成，其中X是Yb 2 O 3中的至少一种，Dy 2 O 3和ThO 2，m，x，α和β表示为：0.98

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式