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    • 2. 发明申请
    • PRESSURE PULSES TO REDUCE BUBBLES AND VOIDS IN PHASE CHANGE INK
    • 压力脉冲以减少相变油墨中的泡沫和气泡
    • US20120200620A1
    • 2012-08-09
    • US13022264
    • 2011-02-07
    • Scott J. Limb
    • Scott J. Limb
    • B41J29/38B41J2/175
    • B41J2/17593
    • A phase change ink printer may be operated so that multiple pressure pulses are applied to the ink in an ink flow path of the printer during a time that the ink is changing phase. During the phase change, a portion of the ink in the ink flow path is in liquid phase and another portion of the ink is in solid phase. The pressure pulses are applied at least to the liquid phase ink in the ink flow path. The phase change may involve a transition from solid to liquid phase, such as during a start-up operation, or may involve a transition from a liquid phase to a solid phase, such as during a power down operation. Application of pressure during either of these operations serves to reduce bubbles and voids in the phase change ink.
    • 可以操作相变油墨打印机,使得在油墨正在改变相位的时间期间,多个压力脉冲被施加到打印机的油墨流动路径中的油墨。 在相变期间,油墨流路中的一部分油墨是液相,另一部分油墨是固相的。 压力脉冲至少施加到油墨流路中的液相油墨。 相变可能涉及从固相到液相的过渡,例如在启动操作期间,或者可能涉及从液相向固相的转变,例如在断电操作期间。 在这些操作期间施加压力用于减少相变油墨中的气泡和空隙。
    • 5. 发明申请
    • REDUCTION OF BUBBLES AND VOIDS IN PHASE CHANGE INK
    • 在相变油墨中减少泡沫和失水
    • US20120200630A1
    • 2012-08-09
    • US13022253
    • 2011-02-07
    • Scott J. LimbDaniel L. Larner
    • Scott J. LimbDaniel L. Larner
    • B41J29/38
    • B41J2/17593
    • Bubble mitigation approaches for phase change ink involve creating a thermal gradient along an ink flow path of an ink jet printer during a time that the ink is undergoing a phase change. The thermal gradient causes one portion of the ink in the ink flow path to be in liquid phase while another portion of the ink is in solid phase. The thermal gradient allows the liquid ink to move along the ink flow path to fill in voids and/or to push out air pockets in the portion of the ink that is still solid. The bubble mitigation process may be implemented during a start-up operation when the ink is transitioning from a solid phase to a liquid phase and/or during a power down operation when the ink is transitioning from a liquid phase to a solid phase.
    • 用于相变油墨的气泡缓解方法涉及在油墨经历相变的时间期间沿着喷墨打印机的油墨流动路径产生热梯度。 热梯度使得油墨流路中的一部分油墨处于液相,而另一部分油墨是固相的。 热梯度允许液体墨水沿墨水流动路线移动以填充空隙和/或推出仍然固体的墨水部分中的气穴。 当油墨从固相转移到液相时和/或在油墨从液相转变为固相的停电操作期间,可以在启动操作期间实施气泡缓解过程。
    • 7. 发明申请
    • Edge Exclusion Zone Patterning For Solar Cells And The Like
    • 太阳能电池边缘排除区域图案化等
    • US20100009472A1
    • 2010-01-14
    • US12169564
    • 2008-07-08
    • Scott J. Limb
    • Scott J. Limb
    • H01L21/306G06F17/50
    • H01L31/1876H01L31/022441H01L31/0682Y02E10/547Y02P70/521
    • The edge profile (and optionally the physical and electrical characteristics) of a wafer is determined. Useful regions of the wafer in an edge exclusion zone may then be identified. A customized grid array layout is created specific to that wafer from an analysis of the edge profile, for example having a grid array with interconnection lines located within the useful portions of the edge exclusion zone. This working file is then used by a system, such as a digital lithography system, to form the grid array on the surface of the wafer. The grid array is specific to that wafer. Various aspects of the grid array may also be controlled in the process. For example, the line width, inter-line spacing, and position of the lines comprising the grid array are configurable on a wafer-by-wafer basis.
    • 确定晶片的边缘轮廓(以及可选的物理和电特性)。 然后可以识别边缘排除区中的晶片的有用区域。 通过分析边缘轮廓,特定于该晶片的定制网格阵列布局,例如具有位于边缘排除区域的有用部分内的互连线的网格阵列。 该工作文件然后被诸如数字光刻系统的系统使用以在晶片的表面上形成网格阵列。 网格阵列特定于该晶片。 网格阵列的各个方面也可以在该过程中被控制。 例如,包括网格阵列的线的线宽,线间距和位置可以在逐个晶片的基础上进行配置。
    • 8. 发明授权
    • Edge exclusion zone patterning for solar cells and the like
    • 用于太阳能电池的边缘排除区域图案化等
    • US07842521B2
    • 2010-11-30
    • US12169564
    • 2008-07-08
    • Scott J. Limb
    • Scott J. Limb
    • H01L21/66
    • H01L31/1876H01L31/022441H01L31/0682Y02E10/547Y02P70/521
    • The edge profile (and optionally the physical and electrical characteristics) of a wafer is determined. Useful regions of the wafer in an edge exclusion zone may then be identified. A customized grid array layout is created specific to that wafer from an analysis of the edge profile, for example having a grid array with interconnection lines located within the useful portions of the edge exclusion zone. This working file is then used by a system, such as a digital lithography system, to form the grid array on the surface of the wafer. The grid array is specific to that wafer. Various aspects of the grid array may also be controlled in the process. For example, the line width, inter-line spacing, and position of the lines comprising the grid array are configurable on a wafer-by-wafer basis.
    • 确定晶片的边缘轮廓(以及可选的物理和电特性)。 然后可以识别边缘排除区中的晶片的有用区域。 通过分析边缘轮廓,特定于该晶片的定制网格阵列布局,例如具有位于边缘排除区域的有用部分内的互连线的网格阵列。 该工作文件然后被诸如数字光刻系统的系统使用以在晶片的表面上形成网格阵列。 网格阵列特定于该晶片。 网格阵列的各个方面也可以在该过程中被控制。 例如,包括网格阵列的线的线宽,线间距和位置可以在逐个晶片的基础上进行配置。