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1. 发明授权

US08657648B2 Processing apparatus having four processing units 有权
标题翻译：具有四个处理单元的处理装置
公开(公告)号：US08657648B2
公开(公告)日：2014-02-25
申请号：US13271731
申请日：2011-10-12
申请人： Satoshi Yamanaka , Toshiyasu Rikiishi , Nobuyuki Takada
发明人： Satoshi Yamanaka , Toshiyasu Rikiishi , Nobuyuki Takada
IPC分类号： B24B1/00
CPC分类号： B24B37/30 , B24B7/228 , H01L21/304
摘要： A processing apparatus includes a turn table rotatably provided and having an opening; at least five chuck tables provided on the turn table, each chuck table having a holding surface for holding a workpiece; a support bed inserted through the opening of the turn table; four processing unit supporting mechanisms each including a first support column provided on the outside of the turn table, a second support column provided on the support bed, and a support member mounted to the first and second support columns; four processing units respectively supported by the four processing unit supporting mechanisms, the four processing units respectively corresponding to four of the at least five chuck tables; and four feeding units for respectively moving the four processing units in a direction perpendicular to the holding surfaces of the chuck tables.
摘要翻译：一种加工设备，包括：可旋转地设置并具有开口的转台; 设置在转台上的至少五个卡盘台，每个卡盘台具有用于保持工件的保持表面; 通过转台的开口插入的支撑床; 四个处理单元支撑机构，每个包括设置在转台的外侧上的第一支撑柱，设置在支撑床上的第二支撑柱和安装到第一和第二支撑柱的支撑构件; 分别由四个处理单元支撑机构支撑的四个处理单元，四个处理单元分别对应于至少五个卡盘表中的四个; 以及四个进给单元，用于分别沿着与卡盘台的保持表面垂直的方向移动四个处理单元。

2. 发明申请

US20120088441A1 PROCESSING APPARATUS HAVING FOUR PROCESSING UNITS 有权
标题翻译：具有四个加工单元的加工设备
公开(公告)号：US20120088441A1
公开(公告)日：2012-04-12
申请号：US13271731
申请日：2011-10-12
申请人： Satoshi Yamanaka , Toshiyasu Rikiishi , Nobuyuki Takada
发明人： Satoshi Yamanaka , Toshiyasu Rikiishi , Nobuyuki Takada
IPC分类号： B24B41/06
CPC分类号： B24B37/30 , B24B7/228 , H01L21/304
摘要： A processing apparatus including a turn table rotatably provided and having an opening; at least five chuck tables provided on the turn table, each chuck table having a holding surface for holding a workpiece; a support bed inserted through the opening of the turn table; four processing unit supporting mechanisms each including a first support column provided on the outside of the turn table, a second support column provided on the support bed, and a support member mounted to the first and second support columns; four processing units respectively supported to the four processing unit supporting mechanisms, the four processing units respectively corresponding to four ones of the at least five chuck tables; and four feeding units for respectively moving the four processing units in a direction perpendicular to the holding surfaces of the chuck tables.
摘要翻译：一种加工设备，包括可旋转地设置并具有开口的转台; 设置在转台上的至少五个卡盘台，每个卡盘台具有用于保持工件的保持表面; 通过转台的开口插入的支撑床; 四个处理单元支撑机构，每个包括设置在转台的外侧上的第一支撑柱，设置在支撑床上的第二支撑柱和安装到第一和第二支撑柱的支撑构件; 四个处理单元分别支撑在四个处理单元支撑机构上，四个处理单元分别对应于至少五个卡盘表中的四个; 以及四个进给单元，用于分别沿着与卡盘台的保持表面垂直的方向移动四个处理单元。

3. 发明授权

US07850509B2 Substrate holding apparatus 有权
标题翻译：基板保持装置
公开(公告)号：US07850509B2
公开(公告)日：2010-12-14
申请号：US12285936
申请日：2008-10-16
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B7/22
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.
摘要翻译：本发明涉及一种用于将基板保持并压靠在抛光表面上的基板保持装置。基板保持装置包括用于保持基板的顶环体，用于接触基板的弹性垫和用于支撑弹性垫的支撑构件。基板保持装置还包括安装在支撑构件的下表面上并设置在由弹性垫和支撑构件形成的空间中的接触构件。接触构件具有用于接触弹性垫的弹性膜。第一压力室限定在接触构件中，并且第二压力室限定在接触构件的外部。基板保持装置还包括用于独立地向第一压力室和第二压力室供应流体或产生真空的流体源。

4. 发明授权

US07491117B2 Substrate holding apparatus 有权
公开(公告)号：US07491117B2
公开(公告)日：2009-02-17
申请号：US11452218
申请日：2006-06-14
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B7/22
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

5. 发明授权

US06241578B1 Carrier device in polishing apparatus and method for controlling carrier device 有权
标题翻译：抛光装置中的载体装置及载体装置的控制方法
公开(公告)号：US06241578B1
公开(公告)日：2001-06-05
申请号：US09357843
申请日：1999-07-21
申请人： Tetsuji Togawa , Nobuyuki Takada
发明人： Tetsuji Togawa , Nobuyuki Takada
IPC分类号： B24B900
CPC分类号： B24D15/02 , B24B37/013 , B24B41/061 , B24B49/16
摘要： A carrier device is adapted for use in a polishing apparatus with a turntable having a polishing surface. The carrier device includes a carrier for carrying an article to be polished and a control device operatively associated with the carrier. The control device includes an actuator operable to cause the carrier to urge the article against the polishing surace of the turntable to polish the article, a sensor operatively associated with the actuator and operable to sense a pressure as applied to the article when the article is urged against the polishing surface of the turntable and a control unit operatively associated with the actuator and the sensor so as to monitor the pressure during a polishing operation. The control unit is operable to control operation of the actuator in response to the pressure as monitored so as to keep the pressure at a target level and halt the polishing operation when the pressure is deviated from a predetermined range over a predetermined period of time.
摘要翻译：载体装置适用于具有抛光表面的转台的抛光装置。载体装置包括用于承载待抛光制品的载体和与载体可操作地相关联的控制装置。所述控制装置包括致动器，所述致动器可操作以使所述载体将所述物品推向所述转盘的抛光轮廓以抛光所述物品，所述传感器与所述致动器可操作地相关联并且可操作以感测当所述物品被推动时施加到所述物品上的压力抵靠转盘的抛光表面和与致动器和传感器可操作地相关联的控制单元，以便在抛光操作期间监测压力。控制单元可操作以响应于所监视的压力来控制致动器的操作，以便当压力在预定时间段内偏离预定范围时将压力保持在目标水平并停止抛光操作。

6. 发明授权

US6042455A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US6042455A
公开(公告)日：2000-03-28
申请号：US208987
申请日：1998-12-11
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Nobuyuki Takada
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Nobuyuki Takada
IPC分类号： B24B37/34 , B24B53/007 , B24B53/017 , B24B55/06 , B24B55/12 , H01L21/00 , B24B49/00
CPC分类号： H01L21/67219 , B24B37/345 , B24B53/017 , B24B55/06 , B24B55/12
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes an enclosing structure having an outer wall and at least one door, a polishing section enclosed by the enclosing structure for polishing a surface of a workpiece by holding the workpiece and pressing the workpiece against a polishing surface of a turntable, a sensor for detecting an opening or closing of the door, and an exhaust system for exhausting ambient air from an interior of the enclosing structure. The polishing apparatus further includes an adjusting mechanism for adjusting an amount of air which is exhausted from the interior of the enclosing structure. The amount of air exhausted from the interior of the enclosing structure is reduced by the adjusting mechanism when the door is closed, and the amount of air exhausted from the interior of the enclosing structure is increased by the adjusting mechanism when the door is opened.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括具有外壁和至少一个门的封闭结构，由封闭结构封闭的抛光部分，用于通过保持工件并将工件压靠在转台的抛光表面上来抛光工件的表面，传感器用于检测门的打开或关闭;以及用于从封闭结构的内部排出环境空气的排气系统。抛光装置还包括调节机构，用于调节从封闭结构内部排出的空气量。当门关闭时，通过调节机构减少从封闭结构内部排出的空气量，并且当门打开时通过调节机构从封闭结构的内部排出的空气量增加。

7. 发明授权

US4581228A Toothpaste composition and plastic containers containing the same 失效
标题翻译：牙膏组合物和含有相同的塑料容器
公开(公告)号：US4581228A
公开(公告)日：1986-04-08
申请号：US316400
申请日：1981-10-29
申请人： Nobuo Suganuma , Kensuke Tanaka , Nobuyuki Takada , Hiromichi Ichikawa
发明人： Nobuo Suganuma , Kensuke Tanaka , Nobuyuki Takada , Hiromichi Ichikawa
IPC分类号： A61K8/00 , A61K8/21 , A61K8/26 , A61K8/34 , A61K8/73 , A61Q11/00 , B65D35/02 , A61K7/16 , A61K7/18
CPC分类号： A61K8/345 , A61K8/26 , A61K8/73 , A61K8/731 , A61Q11/00 , B65D35/02 , A61K2800/87
摘要： A plastic container is filled with an antiseptic toothpaste composition comprising an aluminum oxide compound such as aluminum oxide trihydrate as a main abrasive and a polyhydric alcohol such as propylene glycol, sorbitol, etc. in an amount of 5 to 100 moles in fluoride-free systems or 4.0 to 100 moles in fluoride-containing systems per liter of water in the toothpaste composition.
摘要翻译：塑料容器中填充有防腐牙膏组合物，其包含氧化铝化合物如氧化铝三水合物作为主要研磨剂，多元醇如丙二醇，山梨糖醇等，在无氟体系中为5-100摩尔或在牙膏组合物中每升水中含氟化物体系中为4.0至100摩尔。

8. 发明申请

US20060234609A1 Substrate holding apparatus 有权
公开(公告)号：US20060234609A1
公开(公告)日：2006-10-19
申请号：US11452218
申请日：2006-06-14
申请人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
发明人： Tetsuji Togawa , Ikutaro Noji , Keisuke Namiki , Hozumi Yasuda , Shunichiro Kojima , Kunihiko Sakurai , Nobuyuki Takada , Osamu Nabeya , Makoto Fukushima , Hideki Takayanagi
IPC分类号： B24B29/00 , B24B47/02
CPC分类号： B24B37/30 , B24B41/061
摘要： The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

9. 发明授权

US06447385B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06447385B1
公开(公告)日：2002-09-10
申请号：US09605989
申请日：2000-06-29
申请人： Tetsuji Togawa , Nobuyuki Takada
发明人： Tetsuji Togawa , Nobuyuki Takada
IPC分类号： B24B500
CPC分类号： B24B37/345
摘要： A polishing apparatus applicable to a dry-in/dry-out polishing system is capable of increasing the capacity of processing substrates to be polished, e.g. semiconductor wafers, per unit of time and per unit area of installation. A polishing unit includes a turntable having a polishing surface, and at least two wafer carriers each adapted to hold a wafer and to press the wafer against the polishing surface. Each wafer carrier is supported by a pivot shaft and movable between a polishing position where the wafer is polished on the turntable and a transfer position for transferring the wafer. The at least two wafer carriers can be situated at the polishing position simultaneously and also alternately.
摘要翻译：适用于干式/干式抛光系统的抛光装置能够增加处理待抛光衬底的能力，例如，半导体晶片，每单位时间和每单位安装面积。抛光单元包括具有抛光表面的转盘和至少两个晶片载体，每个晶片载体适于保持晶片并将晶片压靠在抛光表面上。每个晶片载体由枢转轴支撑，并且可在转盘上抛光晶片的抛光位置和用于转移晶片的转移位置之间移动。至少两个晶片载体可以同时并且交替地位于抛光位置。

10. 发明授权

US06319105B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06319105B1
公开(公告)日：2001-11-20
申请号：US09327650
申请日：1999-06-08
申请人： Tetsuji Togawa , Takeshi Sakurai , Nobuyuki Takada
发明人： Tetsuji Togawa , Takeshi Sakurai , Nobuyuki Takada
IPC分类号： B24B2900
CPC分类号： B24B53/017 , H01L21/67051
摘要： A polishing apparatus includes a cleaning device for critical cleaning of a top ring or a dressing tool to obtain high quality polishing by minimizing surface damage caused by contaminants originating from the top ring and/or dressing tool. The polishing apparatus includes a polishing table; a workpiece holding member for pressing a workpiece onto the polishing table; a dressing tool for conditioning a work surface provided on the polishing table. A cleaning device is provided for cleaning the dressing tool and/or the workpiece holding member. The cleaning device is provided with a spray nozzle for directing a cleaning solution toward at least an upper surface of the workpiece holding member or the dressing tool.
摘要翻译：抛光装置包括清洁装置，用于通过最小化由顶环和/或修整工具产生的污染物引起的表面损伤来对顶环或修整工具进行临界清洁以获得高质量的抛光。抛光装置包括：抛光台; 工件保持构件，用于将工件压在抛光台上; 用于调节设置在抛光台上的工作表面的修整工具。提供了用于清洁修整工具和/或工件保持构件的清洁装置。清洁装置设置有用于将清洁溶液引导至至少工件保持构件或修整工具的上表面的喷嘴。

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