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1. 发明授权

US06609962B1 Dressing apparatus and polishing apparatus 有权
标题翻译：敷料装置和抛光装置
公开(公告)号：US06609962B1
公开(公告)日：2003-08-26
申请号：US09572629
申请日：2000-05-17
申请人： Satoshi Wakabayashi , Kuniaki Yamaguchi , Tetsuji Togawa , Nobuyuki Takada , Osamu Nabeya
发明人： Satoshi Wakabayashi , Kuniaki Yamaguchi , Tetsuji Togawa , Nobuyuki Takada , Osamu Nabeya
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B1/04 , B24B53/12
摘要： A dressing apparatus is used for dressing a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer. The dressing apparatus for dressing apparatus comprises a dresser having a dressing surface for dressing the polishing surface, and the dressing surface has an area which covers an entire area of the polishing surface.
摘要翻译：修整装置用于修整用于抛光诸如半导体晶片的工件的抛光台的抛光表面。修整装置的敷料装置包括具有用于修整抛光表面的修整表面的修整器，并且修整表面具有覆盖抛光表面的整个区域的区域。

2. 发明授权

US06379229B1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US06379229B1
公开(公告)日：2002-04-30
申请号：US09572278
申请日：2000-05-17
申请人： Satoshi Wakabayashi , Tetsuji Togawa , Nobuyuki Takada , Kuniaki Yamaguchi
发明人： Satoshi Wakabayashi , Tetsuji Togawa , Nobuyuki Takada , Kuniaki Yamaguchi
IPC分类号： B24B704
CPC分类号： B24B53/017
摘要： A polishing apparatus has a polishing table having a polishing surface, a carrier for carrying a plate-like member and bringing the plate-like member into contact with the polishing surface, and a dresser including a dressing tool adapted to be brought into contact with the polishing surface to dress or normalize the polishing surface. The carrier is movable along a first path between a work position for bringing into contact the plate-like member with the polishing surface and a rest position. The dresser is movable along a second path between a work position for bringing the dressing tool into contact with the polishing surface and a rest position. The first and second paths have a common overlapping area. A contact prevention device is provided to prevent the carrier and the dresser from coming into contact with each other. An actuator is provided to bring the plate-like member into a condition that a predetermined area of the surface of the plate-like member extends beyond a peripheral edge of the polishing surface.
摘要翻译：抛光装置具有：具有研磨面的研磨台，承载板状构件的载体，使该板状构件与研磨面接触;以及修整器，其包括修整工具，其适于与抛光表面以使抛光表面穿着或标准化。托架可沿着用于使板状构件与抛光表面接触的工作位置与静止位置之间的第一路径移动。修整器可沿用于使修整工具与抛光表面接触的工作位置和静止位置之间的第二路径移动。第一和第二路径具有共同的重叠区域。提供接触防止装置以防止载体和修整器彼此接触。提供致动器以使板状构件成为板状构件的表面的预定区域延伸超过抛光表面的周边边缘的状态。

3. 发明授权

US6042455A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US6042455A
公开(公告)日：2000-03-28
申请号：US208987
申请日：1998-12-11
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Nobuyuki Takada
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Nobuyuki Takada
IPC分类号： B24B37/34 , B24B53/007 , B24B53/017 , B24B55/06 , B24B55/12 , H01L21/00 , B24B49/00
CPC分类号： H01L21/67219 , B24B37/345 , B24B53/017 , B24B55/06 , B24B55/12
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes an enclosing structure having an outer wall and at least one door, a polishing section enclosed by the enclosing structure for polishing a surface of a workpiece by holding the workpiece and pressing the workpiece against a polishing surface of a turntable, a sensor for detecting an opening or closing of the door, and an exhaust system for exhausting ambient air from an interior of the enclosing structure. The polishing apparatus further includes an adjusting mechanism for adjusting an amount of air which is exhausted from the interior of the enclosing structure. The amount of air exhausted from the interior of the enclosing structure is reduced by the adjusting mechanism when the door is closed, and the amount of air exhausted from the interior of the enclosing structure is increased by the adjusting mechanism when the door is opened.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括具有外壁和至少一个门的封闭结构，由封闭结构封闭的抛光部分，用于通过保持工件并将工件压靠在转台的抛光表面上来抛光工件的表面，传感器用于检测门的打开或关闭;以及用于从封闭结构的内部排出环境空气的排气系统。抛光装置还包括调节机构，用于调节从封闭结构内部排出的空气量。当门关闭时，通过调节机构减少从封闭结构内部排出的空气量，并且当门打开时通过调节机构从封闭结构的内部排出的空气量增加。

4. 发明授权

US06602119B1 Dressing apparatus 失效
标题翻译：敷料机
公开(公告)号：US06602119B1
公开(公告)日：2003-08-05
申请号：US09588537
申请日：2000-06-07
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Nobuyuki Takada , Satoshi Wakabayashi
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Nobuyuki Takada , Satoshi Wakabayashi
IPC分类号： B24B700
CPC分类号： B24B53/017
摘要： Disclosed is a dressing apparatus wherein a polishing surface can be regenerated stably over a long period without any danger of an object to be polished being scratched. A dressing surface 50a of a dresser 48 is caused to slide on a polishing surface 30a of a polishing table 22 while the dressing surface is urged against the polishing surface. The dressing surface is formed from a grindstone 50.
摘要翻译：公开了一种修整装置，其中可以长时间稳定地再生抛光表面，而不会有被抛光的物体被划伤的危险。使修整器48的修整面50a在研磨台22的研磨面30a上滑动，同时使修整面抵靠着研磨面。修整表面由磨石50形成。

5. 发明授权

US06409582B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06409582B1
公开(公告)日：2002-06-25
申请号：US09531589
申请日：2000-03-20
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Shunichiro Kojima , Toyomi Nishi
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Shunichiro Kojima , Toyomi Nishi
IPC分类号： B24B722
CPC分类号： B24B37/345 , B08B3/02 , B24B41/005 , H01L21/67051
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus, includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括其上具有抛光表面的转台和用于保持要抛光的工件的顶环，并将工件压靠在转盘上的抛光表面上。推动器设置在用于将工件传递到顶环的位置并且具有可以被提升到靠近顶环的位置的工件支撑件，用于将工件传送到顶环和从顶环移出。当工件支撑件接收到抛光的工件并且被降低时，基本上同时从设置在三个位置的清洁喷嘴单元喷射清洁液体，以清洁工件的上表面和下表面以及顶环的下表面。

6. 发明授权

US06338669B1 Polishing device 有权
标题翻译：抛光装置
公开(公告)号：US06338669B1
公开(公告)日：2002-01-15
申请号：US09509997
申请日：2000-06-15
申请人： Tetsuji Togawa , Kuniaki Yamaguchi
发明人： Tetsuji Togawa , Kuniaki Yamaguchi
IPC分类号： B24B100
CPC分类号： B24B57/02 , B24B37/04
摘要： This invention relates to a polishing machine for polishing an article such as a semiconductor wafer. A movable arm is located at a liquid supply position for supplying a liquid such as a polishing liquid onto a polishing surface of a turntable. The arm is also adapted to be moved to and held at a retracted position radially outside the polishing surface. At the liquid supply position, liquid supply nozzles supported on the arm are brought into a condition such that the nozzles are close to a position on the polishing surface where the liquid is to be supplied, whereby the liquid is accurately supplied onto the position. Holding the arm at the retracted position makes it easy to conduct a maintenance work for the polishing surface and so on.
摘要翻译：本发明涉及一种用于抛光诸如半导体晶片的物品的抛光机。可移动臂位于用于将诸如抛光液体的液体供应到转台的抛光表面上的液体供应位置。臂也适于被移动并保持在抛光表面的径向外侧的缩回位置。在液体供给位置，支撑在臂上的液体供给喷嘴处于这样的状态，使得喷嘴靠近要供应液体的抛光表面上的位置，从而将液体精确地供应到该位置。将臂保持在缩回位置使得易于进行抛光表面的维护工作等。

7. 发明授权

US06428400B1 Drainage structure in polishing plant 有权
标题翻译：抛光厂排水结构
公开(公告)号：US06428400B1
公开(公告)日：2002-08-06
申请号：US09612939
申请日：2000-07-10
申请人： Tetsuji Togawa , Kuniaki Yamaguchi
发明人： Tetsuji Togawa , Kuniaki Yamaguchi
IPC分类号： B24B900
CPC分类号： H01L21/67057 , B24B37/04 , B24B57/02
摘要： A polishing plant including a polishing apparatus having a top ring for holding a workpiece and a turn table for polishing a surface of the workpiece held by the top ring. A cleaning apparatus has cleaning machines for cleaning the workpiece polished by the polishing apparatus. At least one drainage pipe connected to the polishing apparatus discharges a waste liquid from the polishing apparatus, and at least one drainage pipe connected to the cleaning apparatus discharges a waste liquid from the cleaning apparatus are provided as separate plural drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, treatment of waste liquids can be efficiently conducted.
摘要翻译：一种抛光装置，包括具有用于保持工件的顶环的抛光装置和用于抛光由顶环保持的工件的表面的转台。清洁装置具有清洁由抛光装置抛光的工件的清洁机。连接到抛光装置的至少一个排水管从抛光装置排出废液，并且连接到清洁装置的至少一个排水管将来自清洁装置的废液排出，作为单独的多个排水管线设置，这取决于废液类型。通过使用本发明的研磨装置，可以有效地进行废液的处理。

8. 发明授权

US5893794A Polishing apparatus having robotic transport apparatus 失效
标题翻译：具有机器人输送装置的抛光装置
公开(公告)号：US5893794A
公开(公告)日：1999-04-13
申请号：US808690
申请日：1997-02-28
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Kunihiko Sakurai
IPC分类号： B65G49/07 , H01L21/677 , H01L21/687 , B24B7/06
CPC分类号： H01L21/67766 , H01L21/68707 , Y10S451/914
摘要： A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided above the robot body and has an area not smaller than the workpiece holding section.
摘要翻译：机器人运输装置能够在不使用机械密封的情况下提供工作部件的有效防水功能。机器人运输装置包括机器人主体，可伸缩地附接到机器人主体的臂组件和附接到臂组件的工件保持部。机器人主体的防水盘构件设置在机器人主体的上方，具有不小于工件保持部的面积。

9. 发明授权

US6116986A Drainage structure in polishing plant and method of polishing using structure 失效
标题翻译：抛光厂排水结构及抛光方法采用结构
公开(公告)号：US6116986A
公开(公告)日：2000-09-12
申请号：US969738
申请日：1997-11-13
申请人： Tetsuji Togawa , Kuniaki Yamaguchi
发明人： Tetsuji Togawa , Kuniaki Yamaguchi
IPC分类号： B24B37/04 , B24B57/00 , H01L21/00 , B24B1/00
CPC分类号： H01L21/67057 , B24B37/04 , B24B57/02
摘要： A polishing plant includes a polishing apparatus having a top ring for holding a workpiece and a turn table for polishing a surface of the workpiece held by the top ring. A cleaning apparatus has cleaning machines for cleaning the workpiece polished by the polishing apparatus. At least one drainage pipe connected to the polishing apparatus discharges a waste liquid from the polishing apparatus, and at least one drainage pipe connected to the cleaning apparatus to discharges a waste liquid from the cleaning apparatus are provided as separate plural of drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, treatment waste liquids can be efficiently conducted.
摘要翻译：抛光装置包括具有用于保持工件的顶环的抛光装置和用于抛光由顶环保持的工件的表面的转台。清洁装置具有清洁由抛光装置抛光的工件的清洁机。连接到抛光装置的至少一个排水管从抛光装置排出废液，并且连接到清洁装置以从清洁装置排出废液的至少一个排放管被设置为分开的多个排水管道，依赖于关于废液的类型。通过使用本发明的抛光装置，可以有效地进行处理废液。

10. 发明授权

US6050884A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US6050884A
公开(公告)日：2000-04-18
申请号：US807810
申请日：1997-02-26
申请人： Tetsuji Togawa , Kuniaki Yamaguchi , Shunichiro Kojima , Toyomi Nishi
发明人： Tetsuji Togawa , Kuniaki Yamaguchi , Shunichiro Kojima , Toyomi Nishi
IPC分类号： B08B3/02 , B24B37/34 , B24B41/00 , H01L21/00 , B24B7/22
CPC分类号： B24B37/345 , B08B3/02 , B24B41/005 , H01L21/67051
摘要： A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.
摘要翻译：抛光装置用于将诸如半导体晶片的工件抛光到平面镜面。抛光装置包括其上具有抛光表面的转台和用于保持要抛光的工件的顶环，并将工件压靠在转台上的抛光表面上。推动器设置在用于将工件传递到顶环的位置并且具有可以被提升到靠近顶环的位置的工件支撑件，用于将工件传送到顶环和从顶环移出。当工件支撑件接收到抛光的工件并且被降低时，基本上同时从设置在三个位置的清洁喷嘴单元喷射清洁液体，以清洁工件的上表面和下表面以及顶环的下表面。

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