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    • 3. 发明授权
    • Semiconductor integrated circuit and semiconductor integrated circuit system having serially interconnectable data buses
    • 具有串行可互连数据总线的半导体集成电路和半导体集成电路系统
    • US06297675B1
    • 2001-10-02
    • US09478530
    • 2000-01-06
    • Hironori AkamatsuYutaka TeradaTakashi HirataYukio ArimaSatoshi TakahashiTadahiro YoshidaYoshihide KomatsuHiroyuki Yamauchi
    • Hironori AkamatsuYutaka TeradaTakashi HirataYukio ArimaSatoshi TakahashiTadahiro YoshidaYoshihide KomatsuHiroyuki Yamauchi
    • H03B100
    • H03K19/018514Y10T307/549
    • A data line pair and a strobe line pair are provided between first and second chips to exchange data therebetween. The first chip includes an output circuit and a controller for controlling the output circuit. The second chip includes an input circuit. For example, the output circuit supplies a direct current from a power supply to one of the data lines. Then, the input circuit feeds back the received current to the output circuit through a pair of terminal resistors and the other data line. Subsequently, the output circuit supplies the fed back direct current to one of the strobe lines. In response, the input circuit feeds back the received current again to the output circuit through another pair of terminal resistors and the other strobe line. And then the fed back current is drained to the ground. Thus, compared to driving the data and strobe line pairs separately with the same amount of current supplied, the current dissipation can be halved. In this manner, the present invention is applicable to reduction of current dissipation when data should be transmitted at high speeds through multiple data bus pairs that are driven with a current supplied.
    • 在第一和第二芯片之间提供数据线对和选通线对,以在它们之间交换数据。 第一芯片包括输出电路和用于控制输出电路的控制器。 第二芯片包括输入电路。 例如,输出电路将电流从电源提供给数据线之一。 然后,输入电路通过一对端子电阻和另一条数据线将接收的电流反馈到输出电路。 随后,输出电路将反馈的直流电流提供给选通线之一。 作为响应,输入电路通过另一对端子电阻器和另一个选通线路将接收到的电流再次反馈到输出电路。 然后将反馈电流排到地面。 因此,与以相同的电流量驱动数据和选通线对相比,电流消耗可以减半。 以这种方式,本发明可应用于当通过以所提供的电流驱动的多个数据总线对以高速传输数据时,减少电流消耗。
    • 5. 发明授权
    • Semiconductor integrated circuit and method for testing the same
    • 半导体集成电路及其测试方法
    • US06631486B1
    • 2003-10-07
    • US09405015
    • 1999-09-27
    • Yoshihide KomatsuTadahiro YoshidaYukio Arima
    • Yoshihide KomatsuTadahiro YoshidaYukio Arima
    • G01R3128
    • G01R31/31905G01R31/31926
    • A test enable signal Data_En is output from a data generator 11 in a tester 10 to a device under a test (DUT) 20. In the DUT 20, a first logic circuit 21 converts a signal pattern with an ordinary transfer rate, which has been stored on a register 28, into a high-transfer-rate signal pattern SpeedData_Tx with a high rate. And a transmitter 22 transmits the high-transfer-rate signal. During a test, the high-transfer-rate signal transmitted is received by, a receiver 23 with a switch 24 turned ON. Then, the high-transfer-rate signal received is output to a second logic circuit 26, which converts the high-transfer-rate signal into a low-transfer-rate signal Data_Rx with an ordinary rate. Finally, the low-transfer-rate signal is output to the tester 10 and compared to an expected value thereof by a comparator 12. In this manner, a semiconductor device operating at a high speed can be tested using a tester operating at a lower speed.
    • 测试使能信号Data_En从测试器10中的数据发生器11输出到被测设备(DUT)20。在DUT 20中,第一逻辑电路21以一般传输速率转换信号模式 存储在寄存器28中,以高速率转换成高传输速率信号模式SpeedData_Tx。 并且发射机22发送高传输速率信号。 在测试期间,传输的高传输速率信号由开关24接通的接收机23接收。 然后,所接收的高传输速率信号被输出到第二逻辑电路26,第二逻辑电路26将高传输速率信号以普通速率转换成低传输速率信号Data_Rx。 最后,将低传输速率信号输出到测试器10,并通过比较器12与其期望值进行比较。以这种方式,可以使用以较低速度操作的测试仪来测试以高速工作的半导体器件 。
    • 10. 发明授权
    • Ultrasonic inspection and imaging instrument
    • 超声波检查和成像仪器
    • US5293326A
    • 1994-03-08
    • US719510
    • 1991-06-24
    • Yukio ArimaHiroaki YanagimotoYuichi KunitomoShouya MakiharaTetsuyoshi Tominaga
    • Yukio ArimaHiroaki YanagimotoYuichi KunitomoShouya MakiharaTetsuyoshi Tominaga
    • G01N29/06G01N29/44G01Q10/06G01Q30/04G01Q80/00G01Q90/00G01S7/52G01N29/00G09G5/00
    • G01S7/52074G01N29/0609G01N29/0645B82Y35/00G01N2291/02854
    • An ultrasonic inspection and imaging instrument is characterized by storing reduced image examples (images by means of reduced image display data obtained by scaling down picture display data) of an ultrasonic measurement picture beforehand, together with measurement conditions at the time the measurement picture is obtained prior to a scale-down imaging process. When the measurement is started or the measurement conditions are otherwise changed, the measurement conditions are set as those obtained from the measurement picture prior to the scale-down processing with one of the reduced image examples thus selected as an index while a list of image examples is indicated on a display and read from a memory unit for ultrasonic measuring purposes. When a reduced image example or what is similar to the example desired by an operator is selected, proper measurement conditions are automatically set in the ultrasonic inspection and imaging instrument. When the operator wants to change or switch the measurement picture, moreover, he/she is able to make ultrasonic measurement on confirming what the subsequent image is like or what an image is desired to be selected by means of the reduced image example beforehand.
    • 超声波检查和成像仪器的特征在于预先存储超声波测量图像的缩小图像示例(通过缩小图像显示数据获得的缩小图像显示数据的图像)以及在获得测量图像时的测量条件 到缩小成像过程。 当测量开始或测量条件另外改变时,测量条件被设置为在缩小处理之前从测量图像获得的测量条件,其中一个缩小图像示例被选择为索引,而图像示例列表 在显示器上指示并从用于超声波测量目的的存储器单元读取。 当选择缩小的图像示例或类似于操作者期望的示例时,在超声波检查和成像仪器中自动设置适当的测量条件。 此外,当操作者想要改变或切换测量图像时,他/她能够通过预先通过缩小的图像实例来确认随后的图像是什么样的或希望选择什么图像来进行超声波测量。