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    • 8. 发明授权
    • Cord-type mowing tool
    • 线式割草工具
    • US4043037A
    • 1977-08-23
    • US732588
    • 1976-10-14
    • Tatsuo OkamotoMasat NogawaNobuyoshi Okabe
    • Tatsuo OkamotoMasat NogawaNobuyoshi Okabe
    • A01D34/73A01D34/416A01D55/18B27B27/00
    • A01D34/416
    • A cord-type mowing tool having a cutter body formed with at least one radially extending bore for receiving a cord serving as a grass cutting blade, and a clamping member fitted in the central bottom opening of the cutter body for forcing against the central portion of the cutter body an end portion of the cord inserted in the radially extending bore to hold the cord in place. The clamping member is threadably connected to the cutter body, so that by loosening and tightening the threadable connection it is possible to readily replace the old cord by a new cord of a predetermined length. The grass cutting tool is simple in construction, light in weight and reliable in performance.
    • 一种绳型割草工具,其具有形成有至少一个径向延伸的孔的刀体,用于接收用作草切刀的绳索,以及夹紧构件,其装配在刀体的中心底部开口中,用于迫使其抵抗 切割器主体将插入径向延伸的孔中的绳索的端部保持在适当的位置。 夹紧构件螺纹连接到切割器主体,从而通过松开和拧紧可螺纹连接,可以用预定长度的新的线容易地更换旧的绳索。 草切工具施工简单,重量轻,性能可靠。
    • 9. 发明授权
    • Semiconductor device
    • 半导体器件
    • US4959329A
    • 1990-09-25
    • US425926
    • 1989-10-24
    • Tatsuo OkamotoAkihiko Ohsaki
    • Tatsuo OkamotoAkihiko Ohsaki
    • H01L21/60H01L23/485
    • H01L21/76897H01L23/485H01L2924/0002Y10S438/927
    • The present invention relates to a semiconductor device having a contact electrode structure and a method of manufacturing the same. An insulating layer is provided in a second semiconductor layer or in a junction part between the second semiconductor layer and a first semiconductor layer correspondence to a contact hole. Therefore, even if a pit generated at a junction part between the second semiconductor layer and a conductive layer in the contact hole grows, the growth of the pit is inhibited by the insulating layer, whereby leakage current caused between the first and second semiconductor layers can be reduced, a reliability of the device being thus enhanced.
    • 本发明涉及一种具有接触电极结构的半导体器件及其制造方法。 绝缘层设置在第二半导体层中或第二半导体层与对应于接触孔的第一半导体层之间的接合部分中。 因此,即使在接触孔中的第二半导体层和导电层之间的接合部处产生的凹坑生长,由于绝缘层抑制了凹坑的生长,从而在第一和第二半导体层之间产生的漏电流也可以 可以降低设备的可靠性。
    • 10. 发明授权
    • Semiconductor device
    • 半导体器件
    • US4887143A
    • 1989-12-12
    • US174498
    • 1988-03-28
    • Tatsuo OkamotoAkihiko Ohsaki
    • Tatsuo OkamotoAkihiko Ohsaki
    • H01L21/60H01L23/485
    • H01L21/76897H01L23/485H01L2924/0002
    • The present invention relates to a semiconductor device having a contact electrode structure and a method of manufacturing the same. An insulating layer is provided in a second semiconductor layer or in a junction part between the second semiconductor layer and a first semiconductor layer correspondence to a contact hole. Therefore, even if a pit generated at a junction part between the second semiconductor layer and a conductive layer in the contact hole grows, the growth of the pit is inhibited by the insulating layer, whereby leakage current caused between the first and second semiconductor layers can be reduced, a reliability of the device being thus enhanced.
    • 本发明涉及具有接触电极结构的半导体器件及其制造方法。 绝缘层设置在第二半导体层中或第二半导体层与对应于接触孔的第一半导体层之间的接合部分中。 因此,即使在接触孔中的第二半导体层和导电层之间的接合部处产生的凹坑生长,由于绝缘层抑制了凹坑的生长,从而在第一和第二半导体层之间产生的漏电流也可以 可以降低设备的可靠性。