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1. 发明申请

US20120068306A1 SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR 审中-公开
标题翻译：半导体封装，包括解耦半导体电容器
公开(公告)号：US20120068306A1
公开(公告)日：2012-03-22
申请号：US13230875
申请日：2011-09-13
申请人： Sang-Sub SONG , Sung-Hoon Chun , Sang-Ho An , Joon-Young Oh , Dong-Ok Kwak
发明人： Sang-Sub SONG , Sung-Hoon Chun , Sang-Ho An , Joon-Young Oh , Dong-Ok Kwak
IPC分类号： H01L27/08
CPC分类号： H01L23/50 , H01L24/06 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/16 , H01L28/60 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/05609 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05669 , H01L2224/06139 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48145 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06562 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10161 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor package includes a packaging substrate including a first bond finger and a second bond finger, a first semiconductor chip mounted on the packaging substrate, and including a first chip pad and a second chip pad, the first bond finger being electrically connected to the first chip pad by a first bonding wire, and the second bond finger being electrically connected to the second chip pad by a second bonding wire, and a first decoupling semiconductor capacitor mounted on the first semiconductor chip, and including a first capacitor pad, the first capacitor pad being electrically connected to the second chip pad.
摘要翻译：半导体封装包括包括第一键合指状物和第二键合指状物的封装衬底，安装在封装衬底上的第一半导体芯片，并且包括第一芯片焊盘和第二芯片焊盘，第一键合指状电连接到第一键并且所述第二接合指状物通过第二接合线电连接到所述第二芯片焊盘，以及安装在所述第一半导体芯片上的第一解耦半导体电容器，并且包括第一电容器焊盘，所述第一电容器焊盘电连接到第二芯片焊盘。

2. 发明授权

US08791554B2 Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substrates 有权
标题翻译：用于包括内部屏蔽结构的半导体器件的衬底和包括衬底的半导体器件
公开(公告)号：US08791554B2
公开(公告)日：2014-07-29
申请号：US13530881
申请日：2012-06-22
申请人： Dong-Ok Kwak , Sang-Sub Song , Sang-Ho An , Joon-Young Oh
发明人： Dong-Ok Kwak , Sang-Sub Song , Sang-Ho An , Joon-Young Oh
IPC分类号： H01L23/552 , H01L23/498 , H01L25/065
CPC分类号： H01L23/552 , H01L23/49827 , H01L24/73 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2924/15311 , H01L2924/1815 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device includes a substrate comprising a stack of alternating wiring layers and insulating layers. The wiring layers include conductive wiring patterns. Primary conductive vias extend through respective ones of the insulating layers and electrically connect first ones of the wiring patterns on different ones of the wiring layers to provide electrical connections between opposing first and second surfaces of the substrate. Dummy conductive vias extend through respective ones of the insulating layers and electrically connect second ones of the wiring patterns on different ones of the wiring layers. The dummy conductive vias are arranged in the substrate around a perimeter of a region including the first ones of the wiring patterns, and the dummy conductive vias and the second ones of the wiring patterns electrically connected thereto have a same electric potential to define an electromagnetic shielding structure within the substrate.
摘要翻译：半导体器件包括包括交替布线层和绝缘层的叠层的衬底。布线层包括导电布线图案。主导电通孔延伸通过绝缘层中的相应绝缘层，并且电连接在不同布线层上的布线图案中的第一布线图案，以提供基板相对的第一和第二表面之间的电连接。虚拟导电通孔延伸通过相应的绝缘层，并且电连接不同布线层上的布线图案中的第二布线图案。虚设导电通孔在包括第一布线图案的区域的周边周围布置在基板中，并且虚拟导电通孔和与其电连接的第二布线图案具有相同的电位以限定电磁屏蔽衬底内的结构。

3. 发明申请

US20120061816A1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：半导体封装及其制造方法
公开(公告)号：US20120061816A1
公开(公告)日：2012-03-15
申请号：US13227940
申请日：2011-09-08
申请人： Sang-Sub SONG , Sang-Ho An , Joon-Young Oh , Dong-Ok Kwak , Joon-Ki Park
发明人： Sang-Sub SONG , Sang-Ho An , Joon-Young Oh , Dong-Ok Kwak , Joon-Ki Park
IPC分类号： H01L23/50 , H01L23/52
CPC分类号： H01L23/4334 , H01L23/3128 , H01L23/3677 , H01L23/552 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06562 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/3025 , H01L2924/00012 , H01L2924/00011 , H01L2924/00 , H01L2224/45099 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076
摘要： Provided are a semiconductor package and method of fabricating the same. The package includes an interconnection substrate, a semiconductor chip mounted on the interconnection substrate, a lateral wire bonded on the interconnection substrate and configured to enclose a side surface of the semiconductor chip, and a metal layer disposed on the semiconductor chip and electrically connected to the lateral wire.
摘要翻译：提供半导体封装及其制造方法。所述封装包括互连衬底，安装在所述互连衬底上的半导体芯片，接合在所述互连衬底上并被构造成包围所述半导体芯片的侧表面的横向引线，以及设置在所述半导体芯片上并电连接到所述半导体芯片的金属层侧线。

4. 发明申请

US20060154619A1 Semi-automatic swing device for a mobile terminal 审中-公开
标题翻译：用于移动终端的半自动摆动装置
公开(公告)号：US20060154619A1
公开(公告)日：2006-07-13
申请号：US11262860
申请日：2005-10-31
申请人： Eun-Deok Bae , Dong-Ok Kwak , Yong-Jin Lee , Hyun-Gue Park
发明人： Eun-Deok Bae , Dong-Ok Kwak , Yong-Jin Lee , Hyun-Gue Park
IPC分类号： H04B1/38
CPC分类号： H04M1/0237 , H04M1/0225
摘要： A semi-automatic swing device for a swing-type mobile terminal including a body, and a swing housing slidably mounted to an upper surface of the body, in which the swing housing slides in parallel on the upper surface the body. The semi-automatic swing device includes a base plate, a swing plate slidably and rotatably mounted to the base plate while being opposite to the base plate, and a semi-automatic power drive interposed between the base plate. The semi-automatic power drive applies a moment force to be rotated in a counterclockwise direction to the swing plate if the semi-automatic power drive pivots up to a desired angle, and applies a moment force to be rotated in a clockwise direction to the swing plate if the semi-automatic power drive pivots above a desired angle.
摘要翻译：一种用于摆动式移动终端的半自动摆动装置，其包括主体和可滑动地安装到主体的上表面的摆动壳体，其中摆动壳体在主体的上表面上平行滑动。半自动摆动装置包括基板，可滑动地并可旋转地安装在基板上而与基板相对的摆动板，以及插入在基板之间的半自动动力驱动装置。如果半自动动力传动装置枢转到所需的角度，则半自动动力传动装置将以逆时针方向旋转的力矩施加到摆动板，并施加一个力矩以顺时针方向旋转到摆动如果半自动动力驱动器枢转高于期望的角度，则为板。

5. 发明授权

US06975483B2 Disk recording device for manufacturing hard disk drives 失效
标题翻译：用于制造硬盘驱动器的磁盘记录装置
公开(公告)号：US06975483B2
公开(公告)日：2005-12-13
申请号：US10284102
申请日：2002-10-31
申请人： Sang-Jin Choi , Tae-Sang Park , Sang-Chul Ko , Dong-Ok Kwak , Ki-Keon Yeom
发明人： Sang-Jin Choi , Tae-Sang Park , Sang-Chul Ko , Dong-Ok Kwak , Ki-Keon Yeom
IPC分类号： G11B20/10 , G11B5/596 , G11B5/84 , G11B21/10 , G11B25/04 , G11B33/14
CPC分类号： G11B5/59633
摘要： A disk recording device to manufacture hard disk drives. This disk recording device includes a spindle to detachably hold a disk of a hard disk drive. A spindle motor rotates the spindle. A recording unit records data on a surface of the disk while moving over the surface of the disk held on the spindle. A disk protecting unit covers the surfaces of the disk to protect the disk from an external environment when the disk is rotated. In the disc recording device, the disk protecting unit approaches or moves away from the disk through a reciprocating motion within a predetermined range.
摘要翻译：一种用于制造硬盘驱动器的磁盘记录装置。该盘记录装置包括可拆卸地保持硬盘驱动器的盘的主轴。主轴电机旋转主轴。记录单元在保持在主轴上的盘的表面上移动时在盘的表面上记录数据。磁盘保护单元覆盖磁盘的表面，以在磁盘旋转时保护磁盘免受外部环境的影响。在盘记录装置中，盘保护单元通过往复运动在预定范围内靠近或远离盘移动。

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