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1. 发明授权

EP1748457B1 Mems switch and manufacturing method thereof 有权
标题翻译： MEMS开关及其制造方法
公开(公告)号：EP1748457B1
公开(公告)日：2010-06-23
申请号：EP06253784.0
申请日：2006-07-19
申请人： Samsung Electronics Co., Ltd.
发明人： Jeong, Hee-moon , Kwon, Sang-wook , Kim, Che-heung , Kim, Jong-seok , Kim, Jun-o, 705-604 Manhyeon-maeul , Hong, Young-tack , Song, In-sang , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H2059/0054

2. 发明公开

EP1653494A3 Micro thin-film structure, MEMS switch employing such a micro thin-film, and method of fabricating them 有权
标题翻译：薄膜的微结构的MEMS开关具有这样的薄膜的微结构和对应Herstellunsverfahren
公开(公告)号：EP1653494A3
公开(公告)日：2007-08-22
申请号：EP05022713.1
申请日：2005-10-18
申请人： Samsung Electronics Co., Ltd.
发明人： Kweon, Soon-cheol , Shin, Hyung-jae , Jeon, Byung-hee , Hong, Seok-kwan , Kim, Che-heung , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H1/0036
摘要： A micro thin-film structure, a micro electro-mechanical system (MEMS) switch, and methods of fabricating them. The micro thin-film structure includes at least two thin-films having different properties and laminated in sequence to form an upper layer and a lower layer, wherein an interface between the upper and lower layers is formed to be oriented to at least two directions. The micro thin film structure, and method of forming, may be applied to a movable electrode of an MEMS switch. The thin-film structure may be formed by forming through-holes in the lower layer, and depositing the upper layer in the form of being engaged in the through-holes. Alternatively, the thin-film structure may be made by forming prominence and depression parts on the top side of the lower layer and then depositing the upper layer on the top side of the lower layer having the prominence and depression parts.

3. 发明公开

EP1672661A2 MEMS switch and method of fabricating the same 审中-公开
标题翻译： MEMS开关及其制造方法
公开(公告)号：EP1672661A2
公开(公告)日：2006-06-21
申请号：EP05024606.5
申请日：2005-11-10
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Che-heung , Shin, Hyung-jae , Kweon, Soon-cheol , Kim, Kyu-sik , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H2059/0054
摘要： A micro electro mechanical system switch and a method of fabricating the micro electro mechanical system switch. The micro electro mechanical system switch includes a substrate, a plurality of signal lines formed on the substrate and including switching contact points and a plurality of immovable electrodes formed among the signal lines on the substrate. A plurality of anchors protrude from the substrate to predetermined heights and support at least two actuating beams installed on an identical plane so as to move up and down. A connecting unit connects the at least two actuating beams. A support unit provided on the substrate supports the connecting unit and contacting plates are installed on lower surfaces of the at least two actuating beams so as to contact the switching contact points.
摘要翻译：一种微机电系统开关和一种制造微机电系统开关的方法。微机电系统开关包括：基板;多个信号线，形成在基板上，并包括开关接点和在基板上的信号线之间形成的多个不可移动电极。多个锚定件从基板突出到预定高度并且支撑安装在同一平面上的至少两个致动梁以上下移动。连接单元连接至少两个致动梁。设置在基板上的支撑单元支撑连接单元，并且接触板安装在至少两个致动梁的下表面上以接触开关触点。

4. 发明授权

EP1788603B1 RF MEMS switch and method for fabricating the same 有权
标题翻译： RF MEMS开关和相关的生产方法
公开(公告)号：EP1788603B1
公开(公告)日：2010-05-05
申请号：EP06122879.7
申请日：2006-10-24
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Jong-seok , Kwon, Sang-wook , Kim, Dong-kyun , Kim, Che-heung , Lee, Sang-hun , Houng, Young-tack, c/o Samsung Adv. Inst. of Techn , Lee, Chang-seung , Song, In-sang
IPC分类号： H01H57/00 , H01H59/00 , H01P1/12
CPC分类号： H01P1/127 , H01H59/0009 , H01H2057/006 , Y10T29/49002 , Y10T29/49016 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155

5. 发明公开

EP1672661A3 MEMS switch and method of fabricating the same 审中-公开
标题翻译： MEMS开关及其制造方法
公开(公告)号：EP1672661A3
公开(公告)日：2007-08-29
申请号：EP05024606.5
申请日：2005-11-10
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Che-heung , Shin, Hyung-jae , Kweon, Soon-cheol , Kim, Kyu-sik , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H2059/0054
摘要： A micro electro mechanical system switch and a method of fabricating the micro electro mechanical system switch. The micro electro mechanical system switch includes a substrate, a plurality of signal lines formed on the substrate and including switching contact points and a plurality of immovable electrodes formed among the signal lines on the substrate. A plurality of anchors protrude from the substrate to predetermined heights and support at least two actuating beams installed on an identical plane so as to move up and down. A connecting unit connects the at least two actuating beams. A support unit provided on the substrate supports the connecting unit and contacting plates are installed on lower surfaces of the at least two actuating beams so as to contact the switching contact points.

6. 发明公开

EP1788603A1 RF MEMS switch and method for fabricating the same 有权
标题翻译： HF MEMS Schalter undzugehörigesHerstellungsverfahren
公开(公告)号：EP1788603A1
公开(公告)日：2007-05-23
申请号：EP06122879.7
申请日：2006-10-24
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Jong-seok , Kwon, Sang-wook , Kim, Dong-kyun , Kim, Che-heung , Lee, Sang-hun , Houng, Young-tack, c/o Samsung Adv. Inst. of Techn , Lee, Chang-seung , Song, In-sang
IPC分类号： H01H57/00 , H01H59/00 , H01P1/12
CPC分类号： H01P1/127 , H01H59/0009 , H01H2057/006 , Y10T29/49002 , Y10T29/49016 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155
摘要： An RF MEMS switch (100) and a method for fabricating the same are disclosed, in which the RF MEMS device is down driven at a low voltage using a piezoelectric effect. The RF MEMS switch includes a substrate (101) provided with RF signal lines (102a,102b) and a cavity (103a), a cantilever (110) positioned on the cavity, having one end fixed to the substrate, and a contact pad (111) connecting the RF signal lines with the cantilever in contact with the RF signal lines when the cantilever is down driven.
摘要翻译：公开了一种RF MEMS开关（100）及其制造方法，其中使用压电效应将RF MEMS器件以低电压下驱动。 RF MEMS开关包括设置有RF信号线（102a，102b）和空腔（103a）的基板（101），位于空腔上的悬臂（110），其一端固定到基板，以及接触垫 111）当悬臂向下驱动时，将RF信号线与与RF信号线接触的悬臂连接。

7. 发明公开

EP2562134A3 Capacitive transducer and methods of manufacturing and operating the same 有权
标题翻译：容性换能器和用于制造和它们的操作方法
公开(公告)号：EP2562134A3
公开(公告)日：2014-12-24
申请号：EP12181228.3
申请日：2012-08-21
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Che-heung
IPC分类号： B81B3/00
摘要： Provided are a capacitive transducer, and methods of manufacturing and operating the same. The capacitive transducer includes: a monolithic substrate comprising a first doping region (20), a second doping region (30) that is opposite in conductivity to the first doping region, and a vibrating portion; and an empty space that is disposed between the first doping region and the vibrating portion. The vibrating portion includes a plurality of through-holes, and a material film for sealing the plurality of through-holes is disposed on the vibrating portion.

8. 发明公开

EP1798745A2 Pneumatic MEMS switch and method of fabricating the same 审中-公开
标题翻译： Pneumatischer MEMS Schalter und Herstellungsverfahren
公开(公告)号：EP1798745A2
公开(公告)日：2007-06-20
申请号：EP06121124.9
申请日：2006-09-22
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Che-heung , Choi, Hyung , Song, In-sang , Lee, Sang-hun , Kwon, Sang-wook , Kim, Dong-kyun , Hong, Young-tack , Kim, Jong-seok , Lee, Chang-seung
IPC分类号： H01H59/00 , H01H35/34
CPC分类号： H01H59/0009 , H01H35/346 , H01H2221/02
摘要： A pneumatic micro electro mechanical system switch includes a substrate, a pneumatic actuating unit disposed on the substrate; the pneumatic actuating unit having a plurality of variable air cavities communicating such that when one of the plurality of variable air cavities is compressed, the rest are expanded; a signal line having a plurality of switching lines, each of which passes through a corresponding one of the plurality of variable air cavities and has switching ends disposed in a spaced-apart relation with each other in the corresponding one of the plurality of variable air cavities; a movable switching unit to connect the first and the second switching ends of each of the plurality of switching lines if one of the plurality of variable air cavities is compressed; and a driving unit to drive the pneumatic actuating unit so as to selectively compress the plurality of variable air cavities.
摘要翻译：气动微机电系统开关包括基板，设置在基板上的气动执行单元; 所述气动致动单元具有多个可变空气腔，所述多个可变空气腔连通，使得当所述多个可变气腔中的一个被压缩时，其余部分被膨胀; 信号线具有多个切换线，每个切换线通过多个可变空气腔中的对应的一个可变空气腔，并且具有在多个可变气腔中的相应一个空腔中相互间隔开设置的切换端 ; 如果多个可变空气腔中的一个被压缩，则可移动切换单元连接多个切换线中的每一个的第一和第二切换端; 以及驱动单元来驱动气动致动单元，以选择性地压缩多个可变空气腔。

9. 发明公开

EP1672662A1 MEMS switch and method of fabricating the same 有权
标题翻译： MEMS Schalter und Methode zu dessen Herstellung
公开(公告)号：EP1672662A1
公开(公告)日：2006-06-21
申请号：EP05025063.8
申请日：2005-11-16
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Che-heung , Shin, Hyung-jae , Kweon, Soon-cheol , Kim, Kyu-sik , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H1/5822 , H01H59/0009 , H01H2059/0054 , H01H2059/0063
摘要： A micro electro mechanical system switch and a method of fabricating the same. The micro electro mechanical system switch includes a substrate a plurality of signal lines formed at sides an upper surface of the substrate and including switching contact points and a plurality of immovable electrodes on the upper surface of the substrate and between the plurality of signal lines. An inner actuating member performs a seesaw based on a center of the substrate and together with an outer actuating member. Pushing rods are formed at ends of an upper surface of the inner actuating member with ends protruding from and overlapping with an upper portion of the outer actuating member. Contacting members are formed on a lower surface of the outer actuating member so as to be pushed by the pushing rods and contacting the switching contact points of the signal lines.
摘要翻译：微机电系统开关及其制造方法。微电子机械系统开关包括基板，在基板的上表面的侧面形成多个信号线，并且在基板的上表面和多个信号线之间包括开关接触点和多个不可移动的电极。内部致动构件基于衬底的中心并与外部致动构件一起执行跷跷板。推动杆形成在内致动构件的上表面的端部处，其端部从外致动构件的上部突出并与其重叠。接触构件形成在外部致动构件的下表面上，以被推杆推动并接触信号线的开关接触点。

10. 发明公开

EP1653494A2 Micro thin-film structure, MEMS switch employing such a micro thin-film, and method of fabricating them 有权
标题翻译：薄膜的微结构的MEMS开关具有这样的薄膜的微结构和对应Herstellunsverfahren
公开(公告)号：EP1653494A2
公开(公告)日：2006-05-03
申请号：EP05022713.1
申请日：2005-10-18
申请人： Samsung Electronics Co., Ltd.
发明人： Kweon, Soon-cheol , Shin, Hyung-jae , Jeon, Byung-hee , Hong, Seok-kwan , Kim, Che-heung , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H1/0036
摘要： A micro thin-film structure, a micro electro-mechanical system (MEMS) switch, and methods of fabricating them. The micro thin-film structure includes at least two thin-films having different properties and laminated in sequence to form an upper layer and a lower layer, wherein an interface between the upper and lower layers is formed to be oriented to at least two directions. The micro thin film structure, and method of forming, may be applied to a movable electrode of an MEMS switch. The thin-film structure may be formed by forming through-holes in the lower layer, and depositing the upper layer in the form of being engaged in the through-holes. Alternatively, the thin-film structure may be made by forming prominence and depression parts on the top side of the lower layer and then depositing the upper layer on the top side of the lower layer having the prominence and depression parts.
摘要翻译：一种微薄膜结构，微机电系统（MEMS）开关，以及制造它们的方法。微薄膜结构包括具有不同的性质和顺序层叠以形成在上层和下层，worin上部和下部层之间界面处形成的至少两个薄薄膜以在至少两个方向上取向。微薄膜结构，以及形成的方法，可以被应用到一个MEMS开关的可动电极。薄膜结构可以通过通孔在下层中形成，并且在被接合在通孔的形式沉积的上层形成。可替代地，薄膜结构可以通过对下层的顶侧上形成凸起和凹陷部分，然后沉积在具有凹凸部分的下层的顶侧上的上层进行。

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