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1. 发明授权

US06917525B2 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs 失效
标题翻译：具有晶片级弹簧的探针卡组件和封装的结构和制造工艺
公开(公告)号：US06917525B2
公开(公告)日：2005-07-12
申请号：US10178103
申请日：2002-06-24
申请人： Sammy Mok , Fu Chiung Chong , Frank John Swiatowiec , Syamal Kumar Lahiri , Joseph Michael Haemer
发明人： Sammy Mok , Fu Chiung Chong , Frank John Swiatowiec , Syamal Kumar Lahiri , Joseph Michael Haemer
IPC分类号： G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H05K3/40 , H05K7/10 , H05K7/06
CPC分类号： G01R1/07378 , G01R1/06716 , G01R1/06727 , G01R1/07342 , G01R3/00 , G01R31/2889 , H01L2224/16225 , H01L2924/15311 , H05K3/4092 , H05K7/1061 , Y10S439/912
摘要： Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a compliant carrier structure, such as a decal or screen, which is adhesively attached to the probe chip substrate.
摘要翻译：公开了增强的集成电路探针卡和封装组件的几个实施例，其延伸了MEMS和薄膜制造的探针的机械顺应性，使得这些类型的弹簧探针结构可用于测试半导体上的一个或多个集成电路晶圆。公开了在商业晶片探测设备中提供紧密的信号垫间距顺应性和/或实现高水平并行测试的探针卡组件的几个实施例。在一些优选实施例中，探针卡组件结构包括可分离的标准部件，这降低了组装制造成本和制造时间。这些结构和组件能够以晶圆形式进行高速测试。这些探头还内置了集成电路和MEMS或薄膜制造的弹簧尖端和基板上的探针布局结构的机械保护。替代卡组合结构包括柔性载体结构，例如粘贴到探针芯片基底上的贴花或屏幕。

2. 发明授权

US07137830B2 Miniaturized contact spring 失效
公开(公告)号：US07137830B2
公开(公告)日：2006-11-21
申请号：US10390994
申请日：2003-03-17
申请人： Syamal Kumar Lahiri , Frank Swiatowiec , Fu Chiung Chong , Sammy Mok , Erh-Kong Chieh , Roman L. Milter , Joseph M. Haemer , Chang-Ming Lin , Yi-Hsing Chen , David Thanh Doan
发明人： Syamal Kumar Lahiri , Frank Swiatowiec , Fu Chiung Chong , Sammy Mok , Erh-Kong Chieh , Roman L. Milter , Joseph M. Haemer , Chang-Ming Lin , Yi-Hsing Chen , David Thanh Doan
IPC分类号： H01R12/00 , H05K1/00
CPC分类号： G01R3/00 , B81B3/0072 , B81B2201/018 , G01R1/06761 , H01L21/4853 , H01L23/49811 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/09701 , H01L2924/14 , H01R12/57 , H01R12/718 , H01R13/24 , H01R13/2442 , H05K3/4092 , H05K7/1061
摘要： This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

3. 发明授权

US07126220B2 Miniaturized contact spring 有权
公开(公告)号：US07126220B2
公开(公告)日：2006-10-24
申请号：US10390988
申请日：2003-03-17
申请人： Syamal Kumar Lahiri , Frank Swiatowiec , Fu Chiung Chong , Sammy Mok , Erh-Kong Chieh , Roman L. Milter , Joseph M. Haemer , Chang-Ming Lin , Yi-Hsing Chen , David Thanh Doan
发明人： Syamal Kumar Lahiri , Frank Swiatowiec , Fu Chiung Chong , Sammy Mok , Erh-Kong Chieh , Roman L. Milter , Joseph M. Haemer , Chang-Ming Lin , Yi-Hsing Chen , David Thanh Doan
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： G01R3/00 , B81B3/0072 , B81B2201/018 , G01R1/06761 , H01L21/4853 , H01L23/49811 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/09701 , H01L2924/14 , H01R12/57 , H01R12/718 , H01R13/24 , H01R13/2442 , H05K3/4092 , H05K7/1061
摘要： This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

4. 发明申请

US20090153165A1 High Density Interconnect System Having Rapid Fabrication Cycle 失效
标题翻译：高密度互连系统具有快速制造周期
公开(公告)号：US20090153165A1
公开(公告)日：2009-06-18
申请号：US12354520
申请日：2009-01-15
申请人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
发明人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
IPC分类号： G01R31/02
CPC分类号： G01R31/02 , G01R1/073 , G01R1/07378 , G01R31/2889 , Y10T29/49117 , Y10T29/49222
摘要： An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.
摘要翻译：描述了改进的互连系统和方法，例如用于连接器，插座组件和/或探针卡系统。示例性系统包括用于建立到安装在探测器中的半导体晶片的电连接的探针卡接口组件（PCIA）。 PCIA包括平行于具有上表面和相对的下平面安装表面的半导体晶片的母板，由位于母板的下表面和晶片之间的至少三个点限定的参考平面，至少一个位于主板安装表面和用于调整参考平面相对于晶片的平面度的机构。具有从其延伸的多个弹簧探针的探针芯片可从PCIA安装和拆卸，而不需要进一步的平面度调节。互连结构和方法优选地提供改进的制造周期。

5. 发明授权

US07872482B2 High density interconnect system having rapid fabrication cycle 失效
标题翻译：具有快速制造周期的高密度互连系统
公开(公告)号：US07872482B2
公开(公告)日：2011-01-18
申请号：US11858064
申请日：2007-09-19
申请人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
发明人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
IPC分类号： G01R31/02
CPC分类号： G01R31/02 , G01R1/073 , G01R1/07378 , G01R31/2889 , Y10T29/49117 , Y10T29/49222
摘要： An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.
摘要翻译：描述了改进的互连系统和方法，例如用于连接器，插座组件和/或探针卡系统。示例性系统包括用于建立到安装在探测器中的半导体晶片的电连接的探针卡接口组件（PCIA）。 PCIA包括平行于具有上表面和相对的下平面安装表面的半导体晶片的母板，由位于母板的下表面和晶片之间的至少三个点限定的参考平面，至少一个位于主板安装表面和用于调整参考平面相对于晶片的平面度的机构。具有从其延伸的多个弹簧探针的探针芯片可从PCIA安装和拆卸，而不需要进一步的平面度调节。互连结构和方法优选地提供改进的制造周期。

6. 发明授权

US07382142B2 High density interconnect system having rapid fabrication cycle 失效
标题翻译：具有快速制造周期的高密度互连系统
公开(公告)号：US07382142B2
公开(公告)日：2008-06-03
申请号：US11133021
申请日：2005-05-18
申请人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
发明人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
IPC分类号： G01R31/02
CPC分类号： G01R31/02 , G01R1/073 , G01R1/07378 , G01R31/2889 , Y10T29/49117 , Y10T29/49222
摘要： An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.
摘要翻译：描述了改进的互连系统和方法，例如用于连接器，插座组件和/或探针卡系统。示例性系统包括用于建立到安装在探测器中的半导体晶片的电连接的探针卡接口组件（PCIA）。 PCIA包括平行于具有上表面和相对的下平面安装表面的半导体晶片的母板，由位于母板的下表面和晶片之间的至少三个点限定的参考平面，至少一个位于主板安装表面和用于调整参考平面相对于晶片的平面度的机构。具有从其延伸的多个弹簧探针的探针芯片可从PCIA安装和拆卸，而不需要进一步的平面度调节。互连结构和方法优选地提供改进的制造周期。

7. 发明申请

US20050068054A1 Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies 审中-公开
标题翻译：集成电路晶圆探针卡组件的标准布局图案和布线结构
公开(公告)号：US20050068054A1
公开(公告)日：2005-03-31
申请号：US10888761
申请日：2004-07-09
申请人： Sammy Mok , Fu Chiung Chong , Frank John Swiatowiec
发明人： Sammy Mok , Fu Chiung Chong , Frank John Swiatowiec
IPC分类号： G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H05K3/40 , H05K7/10 , G01R31/02
CPC分类号： H05K7/1061 , G01R1/07378 , G01R3/00 , G01R31/2889 , H05K3/4092
摘要： Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Interleaved spring probe tip designs are defined which allow multiple probe contacts on very small integrated circuit pads. The shapes of probe tips are preferably defined to control the depth of probe tip penetration between a probe spring and a pad or trace on an integrated circuit device. Improved protective coating techniques for spring probes are also disclosed, offering increased reliability and extended useful service lives for probe card assemblies.
摘要翻译：公开了集成电路探针卡组件的几个实施例，其延伸了MEMS和薄膜制造的探针的机械顺应性，使得这些类型的弹簧探针结构可用于测试半导体晶片上的一个或多个集成电路。公开了在商业晶片探测设备中提供紧密的信号垫间距顺应性和/或实现高水平并行测试的探针卡组件的几个实施例。在一些优选实施例中，探针卡组件结构包括可分离的标准部件，这降低了组装制造成本和制造时间。这些结构和组件能够以晶圆形式进行高速测试。这些探头还内置了集成电路和MEMS或薄膜制造的弹簧尖端和基板上的探针布局结构的机械保护。定义了交错的弹簧探针尖端设计，允许在非常小的集成电路板上进行多个探针接触。探针尖端的形状优选地限定为控制探针尖端在探针弹簧和集成电路器件上的焊盘或迹线之间的深度。还公开了用于弹簧探针的改进的保护涂层技术，为探针卡组件提供增加的可靠性和延长的有用的使用寿命。

8. 发明授权

US07884634B2 High density interconnect system having rapid fabrication cycle 失效
公开(公告)号：US07884634B2
公开(公告)日：2011-02-08
申请号：US12354520
申请日：2009-01-15
申请人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
发明人： Fu Chiung Chong , Andrew Kao , Douglas McKay , Anna Litza , Douglas Modlin , Sammy Mok , Nitin Parekh , Frank John Swiatowiec , Zhaohui Shan
IPC分类号： G01R31/26
CPC分类号： G01R31/02 , G01R1/073 , G01R1/07378 , G01R31/2889 , Y10T29/49117 , Y10T29/49222
摘要： An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

9. 发明授权

US07349223B2 Enhanced compliant probe card systems having improved planarity 失效
标题翻译：增强的兼容性探针卡系统具有改进的平面性
公开(公告)号：US07349223B2
公开(公告)日：2008-03-25
申请号：US10870095
申请日：2004-06-16
申请人： Joseph Michael Haemer , Fu Chiung Chong , Douglas N. Modlin
发明人： Joseph Michael Haemer , Fu Chiung Chong , Douglas N. Modlin
IPC分类号： H05K7/06
CPC分类号： H05K7/1061 , G01R1/06711 , G01R1/06727 , G01R1/07314 , G01R3/00 , H05K3/4092 , Y10S439/912 , Y10T29/49004
摘要： Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates. Alternate card assembly structures comprise a stiffening structure and a compliant carrier structure, such as a decal or screen, which is fixedly attached to the probe chip substrate.
摘要翻译：公开了增强的集成电路探针卡和封装组件的几个实施例，其延伸了MEMS和薄膜制造的探针的机械顺应性，使得这些类型的弹簧探针结构可用于测试半导体上的一个或多个集成电路晶圆。公开了在商业晶片探测设备中提供紧密的信号垫间距顺应性和/或实现高水平并行测试的探针卡组件的几个实施例。在一些优选实施例中，探针卡组件结构包括可分离的标准部件，这降低了组装制造成本和制造时间。这些结构和组件能够以晶圆形式进行高速测试。这些探头还内置了集成电路和MEMS或薄膜制造的弹簧尖端和基板上的探针布局结构的机械保护。替代卡组件结构包括固定结合到探针芯片基板上的加强结构和柔性载体结构，例如贴花或屏蔽。

10. 发明授权

US07138818B2 Massively parallel interface for electronic circuit 失效
公开(公告)号：US07138818B2
公开(公告)日：2006-11-21
申请号：US11327728
申请日：2006-01-05
申请人： Fu Chiung Chong , Sammy Mok
发明人： Fu Chiung Chong , Sammy Mok
IPC分类号： G01R31/02
CPC分类号： G01R31/2863 , G01R1/06722 , G01R1/07342 , G01R3/00 , G01R31/2874 , G01R31/2889
摘要： Several embodiments of massively parallel interface structures are disclosed, which may be used in a wide variety of permanent or temporary applications, such as for interconnecting integrated circuits (ICs) to test and burn-in equipment, for interconnecting modules within electronic devices, for interconnecting computers and other peripheral devices within a network, or for interconnecting other electronic circuitry. Preferred embodiments of the massively parallel interface structures provide massively parallel integrated circuit test assemblies. The massively parallel interface structures preferably use one or more substrates to establish connections between one or more integrated circuits on a semiconductor wafer, and one or more test modules. One or more layers on the intermediate substrates preferably include MEMS and/or thin-film fabricated spring probes. The parallel interface assemblies provide tight signal pad pitch and compliance, and preferably enable the parallel testing or burn-in of multiple ICs, using commercial wafer probing equipment. In some preferred embodiments, the parallel interface assembly structures include separable standard electrical connector components, which reduces assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form.

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