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    • 2. 发明公开
    • Negative photoresist composition
    • Negativ arbeitende Photoresistzusammensetzung。
    • EP0592790A1
    • 1994-04-20
    • EP93113271.6
    • 1993-08-19
    • SUMITOMO CHEMICAL COMPANY, LIMITED
    • Ueda, YujiTakeyama, NaokiUeki, HiromiKusumoto, TakehiroNakano, Yuko
    • G03F7/004G03F7/029G03F7/038
    • G03F7/038G03F7/0045
    • A negative photoresist composition suitable for use in far ultraviolet lithographies and particularly KrF excimer laser lithography, excellent in properties such as resolution, sensitivity, film thickness retention, profile, heat resistance, etc., and small in standing wave, which comprises a resin obtainable through a copolymerization of p-hydroxystyrene and styrene, a crosslinking agent, which is a melamine derivative, represented by the general formula (II):

      wherein Z represents -NRR' and the like and R, R' and R₁ to R₄ each represents -CH₂OR a and the like in which R a is lower alkyl group, and a photo-induced acid precursor represented by the general formula (III):

      wherein Y₃ to Y₅ each represents mono-, di- or tri-halogen-substituted alkyl group or the like.
    • 适用于远紫外光刻,特别是KrF准分子激光光刻的负性光致抗蚀剂组合物,其特性如分辨率,灵敏度,膜厚保持性,轮廓,耐热性等优异,驻波小,包括可获得的树脂 通过对羟基苯乙烯和苯乙烯的共聚合,由通式(II)表示的三聚氰胺衍生物的交联剂:其中Z表示-NRR'等,且R,R'和R 1至R 4表示的 各自表示其中R a为低级烷基的-CH 2 OR a等,和由通式(III)表示的光诱导酸前体:其中Y 3〜Y 5各自表示一,二或三 - 取代的烷基等。
    • 10. 发明公开
    • Photoresist Compositiom
    • Fotoresist-Zusammensetzungen。
    • EP0589451A2
    • 1994-03-30
    • EP93115350.6
    • 1993-09-23
    • SUMITOMO CHEMICAL COMPANY, LIMITED
    • Kusumoto, TakehiroTakeyama, NaokiUeda, YujiUeki, HiromiNakano, Yuko
    • G03F7/004
    • G03F7/0045
    • A negative photoresist composition comprising an alkali-soluble resin, a crosslinking agent and a photo-induced acid precursor, wherein said photo-induced acid precursor comprises at least one sulfonic acid ester represented by the following formula (I); and a positive photoresist composition comprising an alkali-soluble resin, a dissolution inhibitor and a photo-induced acid precursor, wherein said photo-induced acid precursor comprises at least one sulfonic acid ester represented by the following formula (I):
      wherein R 1 represents an optionally substituted arylene, alkylene or alkenylene group; and R 2 represents an optionally substituted alkyl or aryl group, provided that when R 2 is an alkyl or aryl group having a substituent, said substituent cannot be a fluorine atom.
      Said negative and positive photoresist compositions are excellent in properties such as heat resistance, film thickness retention, coating characteristics, profile, etc. and, in addition, exhibit excellent sensitivity and resolution when used in the exposure light region using a far ultraviolet ray, including excimer laser, as a light source.
    • 包含碱溶性树脂,交联剂和光诱导酸前体的负性光致抗蚀剂组合物,其中所述光致酸性前体包含至少一种由下式(I)表示的磺酸酯; 以及包含碱溶性树脂,溶解抑制剂和光诱导酸前体的正性光致抗蚀剂组合物,其中所述光致酸性前体包含至少一种由下式(I)表示的磺酸酯:其中 R 1表示任选取代的亚芳基,亚烷基或亚烯基; 并且R 2表示任选取代的烷基或芳基,条件是当R 2为具有取代基的烷基或芳基时,所述取代基不能为氟原子。 所述负极性和正性光致抗蚀剂组合物的耐热性,膜厚保持性,涂布特性,轮廓等性质优异,另外在使用远紫外线的曝光用光区域使用时,具有优异的灵敏度和分辨率,包括 准分子激光,作为光源。