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    • 1. 发明申请
    • PICK-AND-PLACE DEVICE, PICK-AND-PLACE SYSTEM AND METHOD FOR PLACING COMPONENTS ON SUBSTRATES
    • 用元件装配基板的装配装置,装配系统和方法
    • WO03061360A2
    • 2003-07-24
    • PCT/DE0300004
    • 2003-01-02
    • SIEMENS AG
    • PRUEFER MARTINSTANZL HARALD
    • H05K13/02H05K13/04H05K13/00
    • H05K13/021H05K13/0404H05K13/0452Y10T29/49133Y10T29/53174Y10T29/53178
    • The invention relates to a pick-and-place device, a pick-and-place system and a method for placing components on substrates, according to which feeders with a plurality of feeding modules (100) and a corresponding plurality of pick-up locations (150) are provided on opposite sides of the feeders with at least one placement zone (210-1, 210-2) each. Said placement zones are associated with pick-up heads (300-1, 300-2) by means of which the components to be positioned on substrates (200-1, 200-2) which are arranged in the placement zones (210-1 or 210-2) can be alternately and/or simultaneously picked up at the pick-up locations of the feeders. The pick-and-place capacity per surface of the pick-and-place device, the pick-and-place system and the method for placing components on substrates according to the invention is substantially higher than that of conventional devices, systems and methods.
    • 根据本发明的拾取和放置设备,放置系统和用于装载基板的方法与组件被创建,其中,供料装置具有多个供给器模块(100)和相应的多个拾取点上供应的相对侧上分别具有至少一个组件字段(150)(210- 1,210-2),其中所述组件域贴装头(300-1,300-2)被分配,借助于该供给交替和/或同时的在基片上(200-1拾取点用于定位组件,200-2) 可以被移除,它们被排列在组装字段(210-1 bzw.210-2)中。 根据本发明,放置装置的面积性能,放置系统和用于向基板装配部件的方法大大增加。
    • 8. 发明专利
    • DE19925217A1
    • 2000-12-21
    • DE19925217
    • 1999-06-01
    • SIEMENS AG
    • PRUEFER MARTIN
    • H05K13/04H05K13/02
    • A method for mounting or equipping components onto substrates that utilizes a number of component mounting process areas. Each of the process areas includes a component mounting head member or equipping head for mounting the components, a number of supply units for supplying the components to the component mounting head member and a transport member for moving the components between the process areas. The method utilizes a single or a multiple stage or a combined single and multiple stage component mounting process for mounting the components, whichever is determined to be optimally utilized. The single stage process is optimally utilized for a small number of components to be mounted. The single stage process includes completely mounting the components at one of the process areas as compared to the multiple stage process which includes mounting or equipping the components at a combination of successive process areas.
    • 9. 发明专利
    • DE50000880D1
    • 2003-01-16
    • DE50000880
    • 2000-05-17
    • SIEMENS AG
    • PRUEFER MARTIN
    • H05K13/04
    • A method for mounting or equipping components onto substrates that utilizes a number of component mounting process areas. Each of the process areas includes a component mounting head member or equipping head for mounting the components, a number of supply units for supplying the components to the component mounting head member and a transport member for moving the components between the process areas. The method utilizes a single or a multiple stage or a combined single and multiple stage component mounting process for mounting the components, whichever is determined to be optimally utilized. The single stage process is optimally utilized for a small number of components to be mounted. The single stage process includes completely mounting the components at one of the process areas as compared to the multiple stage process which includes mounting or equipping the components at a combination of successive process areas.