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1. 发明申请

WO2006079577A3 WAFER TABLE FOR PREPARING ELECTRICAL COMPONENTS AND DEVICE FOR EQUIPPING SUBSTRATES WITH THE COMPONENTS 审中-公开
标题翻译：晶圆台用于提供电器元件及设备与零部件配件SUBSTRATES
公开(公告)号：WO2006079577A3
公开(公告)日：2007-01-18
申请号：PCT/EP2006050058
申请日：2006-01-05
申请人： SIEMENS AG , FRINDT MATTHIAS , MEHDIANPOUR MOHAMMAD , STANZL HARALD
发明人： FRINDT MATTHIAS , MEHDIANPOUR MOHAMMAD , STANZL HARALD
IPC分类号： H05K13/04 , H01L21/60
CPC分类号： H05K13/0434 , H05K13/021 , Y10T29/53091 , Y10T29/53178 , Y10T29/53183 , Y10T29/53261 , Y10T29/53265 , Y10T29/53478
摘要： A wafer table for a wafer with electrical components comprises a horizontal rotary disk for placing the wafer upon and a stationary ejector for detaching the components from a carrier foil of the wafer. The rotary disk is mounted on a carriage, which can be finely displaced linearly parallel to the wafer plane in discrete steps and which can be rotated by a finely actuatable rotary drive. The rotary drive and the linear drive can be positioned in such a manner that each of the components arrives at a pick-up position specified by the position of the ejector. This makes it possible to arrange and operate the wafer table in a space-saving manner.
摘要翻译：用于与电气元件的晶片的晶片台包括用于支撑所述晶片和用于从所述晶片的载体膜分离部件的固定喷射器的水平转台上。转台通过一个精细旋转驱动装置安装在一个可旋转的致动和直线平行于晶片平面以离散的步微动滑动。旋转驱动器和线性驱动可定位成使得各个装置的到达由喷射器拾取位置的位置规定的。这可能是为了节省空间来放置晶片台和操作。

2. 发明申请

WO03061360A2 PICK-AND-PLACE DEVICE, PICK-AND-PLACE SYSTEM AND METHOD FOR PLACING COMPONENTS ON SUBSTRATES 审中-公开
标题翻译：用元件装配基板的装配装置，装配系统和方法
公开(公告)号：WO03061360A2
公开(公告)日：2003-07-24
申请号：PCT/DE0300004
申请日：2003-01-02
申请人： SIEMENS AG
发明人： PRUEFER MARTIN , STANZL HARALD
IPC分类号： H05K13/02 , H05K13/04 , H05K13/00
CPC分类号： H05K13/021 , H05K13/0404 , H05K13/0452 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178
摘要： The invention relates to a pick-and-place device, a pick-and-place system and a method for placing components on substrates, according to which feeders with a plurality of feeding modules (100) and a corresponding plurality of pick-up locations (150) are provided on opposite sides of the feeders with at least one placement zone (210-1, 210-2) each. Said placement zones are associated with pick-up heads (300-1, 300-2) by means of which the components to be positioned on substrates (200-1, 200-2) which are arranged in the placement zones (210-1 or 210-2) can be alternately and/or simultaneously picked up at the pick-up locations of the feeders. The pick-and-place capacity per surface of the pick-and-place device, the pick-and-place system and the method for placing components on substrates according to the invention is substantially higher than that of conventional devices, systems and methods.
摘要翻译：根据本发明的拾取和放置设备，放置系统和用于装载基板的方法与组件被创建，其中，供料装置具有多个供给器模块（100）和相应的多个拾取点上供应的相对侧上分别具有至少一个组件字段（150）（210- 1，210-2），其中所述组件域贴装头（300-1,300-2）被分配，借助于该供给交替和/或同时的在基片上（200-1拾取点用于定位组件，200-2）可以被移除，它们被排列在组装字段（210-1 bzw.210-2）中。根据本发明，放置装置的面积性能，放置系统和用于向基板装配部件的方法大大增加。

3. 发明专利

AT388618T 未知
公开(公告)号：AT388618T
公开(公告)日：2008-03-15
申请号：AT05794679
申请日：2005-09-30
申请人： SIEMENS AG
发明人： STANZL HARALD , BESCH KARL-HEINZ , IHLEFELD JOACHIM , VIETZE OLIVER
IPC分类号： H05K13/04 , F21K99/00

4. 发明专利

DE10236004B4 未知
公开(公告)号：DE10236004B4
公开(公告)日：2007-08-23
申请号：DE10236004
申请日：2002-08-06
申请人： SIEMENS AG
发明人： STANZL HARALD
IPC分类号： H05K13/04 , B65G49/05 , H05K13/00

5. 发明专利

DE502006000431D1 未知
公开(公告)号：DE502006000431D1
公开(公告)日：2008-04-17
申请号：DE502006000431
申请日：2006-01-05
申请人： SIEMENS AG
发明人： FRINDT MATTHIAS , MEHDIANPOUR MOHAMMAD , STANZL HARALD
IPC分类号： H01L21/60
摘要： A wafer table for providing electrical components of a wafer includes a rotary disk to receive a wafer. The rotary disk is configured to be displaced parallel to a wafer plane in discrete steps such that the components arrive at a stationary pick-up position. A stationary auxiliary facility is assigned to the pick-up position, and a first rotary drive rotates the rotary disk. A carriage supports the rotary disk and is displaced in a stationary linear guide parallel to the wafer by means of a linear drive. The first rotary drive and the linear drive are positioned such that each of the components arrives at the pick-up position.

6. 发明专利

DE502005003145D1 未知
公开(公告)号：DE502005003145D1
公开(公告)日：2008-04-17
申请号：DE502005003145
申请日：2005-09-30
申请人： SIEMENS AG
发明人： STANZL HARALD , BESCH KARL-HEINZ , IHLEFELD JOACHIM , VIETZE OLIVER
IPC分类号： H05K13/04 , F21K99/00

7. 发明专利

DE10344068A1 未知
公开(公告)号：DE10344068A1
公开(公告)日：2005-05-04
申请号：DE10344068
申请日：2003-09-23
申请人： SIEMENS AG
发明人： FRINDT MATTHIAS , MEHDIANPOUR MOHAMMAD , STANZL HARALD
IPC分类号： H05K13/04 , H05K13/02

8. 发明专利

DE10236626A1 Selective movement device for component holders in circuit board assembly device, uses activation of electromagnet for coupling each holder for movement with stroke element 未知
公开(公告)号：DE10236626A1
公开(公告)日：2004-02-19
申请号：DE10236626
申请日：2002-08-09
申请人： SIEMENS AG
发明人： BURGER STEFAN , CONRAD ROBERT , STANZL HARALD
IPC分类号： H01L21/50 , H05K13/04 , H05K13/02
摘要： The device provides selective movement of at least 2 component holders displaced along a base body (205) in the direction of the z-axis, each held in an initial position by a respective mechanism (240) and having an attached electromagnet (220), activated for providing a magnetic coupling with a stroke element moved along the z-axis. An Independent claim for an assembly head for transporting a number of printed circuit board components between a reception position and a placement position is also included.

9. 发明专利

DE102005046963B4 未知
公开(公告)号：DE102005046963B4
公开(公告)日：2007-10-04
申请号：DE102005046963
申请日：2005-09-30
申请人： SIEMENS AG
发明人： MEHDIANPOUR MOHAMMAD , MUELLER WERNER , STANZL HARALD , TOMAZ BORISLAV
IPC分类号： H05K13/02 , B23Q1/01 , F16M5/00

10. 发明专利

DE102004052884A1 未知
公开(公告)号：DE102004052884A1
公开(公告)日：2006-05-04
申请号：DE102004052884
申请日：2004-11-02
申请人： SIEMENS AG
发明人： BESCH KARL-HEINZ , IHLEFELD JOACHIM , STANZL HARALD , VIETZE OLIVER
IPC分类号： G01B11/00 , F21K99/00 , H05K13/08

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