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    • 1. 发明申请
    • GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT EMITTING DEVICE
    • 基于氮化镓的化合物半导体发光器件
    • WO2005117150A1
    • 2005-12-08
    • PCT/JP2005/009587
    • 2005-05-19
    • SHOWA DENKO K.K.KAMEI, KojiWATANABE, MunetakaMURAKI, NoritakaOHNO, Yasushi
    • KAMEI, KojiWATANABE, MunetakaMURAKI, NoritakaOHNO, Yasushi
    • H01L33/00
    • H01L33/42H01L33/32
    • This gallium nitride-base compound semiconductor light emitting device includes an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer that are composed of gallium nitride-based compound semiconductors and are deposited in that order on a substrate, and further includes a negative electrode and a positive electrode that are in contact with the n-type semiconductor layer and the p-type semiconductor layer, respectively, wherein the positive electrode has a translucent electrode composed of a three-layer structure including a contact metal layer that contacts at least the p-type semiconductor layer, a current diffusion layer provided on the contact metal layer and having conductivity greater than that of the contact metal layer, and a bonding pad layer provided on the current diffusion layer, and a mixed positive electrode-metal layer including a metal that forms the contact metal layer is present in a positive electrode side surface of the p-type semiconductor layer.
    • 该氮化镓系化合物半导体发光元件包括由氮化镓系化合物半导体构成的n型半导体层,发光层和p型半导体层,并依次沉积在基板上, 并且还包括分别与n型半导体层和p型半导体层接触的负极和正极,其中所述正极具有由包括接触金属的三层结构构成的透光性电极 至少与p型半导体层接触的层,设置在接触金属层上并具有大于接触金属层的导电性的电流扩散层,以及设置在电流扩散层上的接合焊盘层,以及混合正极 包含形成接触金属层的金属的电极 - 金属层存在于p型半导体的正极侧表面上 导管层。
    • 3. 发明申请
    • GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE
    • 基于氮化镓的化合物半导体发光器件
    • WO2005088740A1
    • 2005-09-22
    • PCT/JP2005/005044
    • 2005-03-15
    • SHOWA DENKO K.K.WATANABE, MunetakaMURAKI, NoritakaOHNO, Yasushi
    • WATANABE, MunetakaMURAKI, NoritakaOHNO, Yasushi
    • H01L33/00
    • H01L33/007H01L33/0095
    • An object of the present invention is to provide a gallium nitride compound semiconductor light-emitting device having excellent heat resistance, which device is resistive to an increase in the forward operation voltage (VF) caused by mild heating performed after formation of the light-emitting device (e.g., heating to about 300°C during mounting of the light-emitting device). The inventive gallium nitride compound semiconductor light-emitting device comprises a substrate; an n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer, the layers being successively provided atop the substrate and being formed of a gallium nitride compound semiconductor; a negative electrode provided on the n-type semiconductor layer at a certain portion thereof, the portion being exposed by partial, depthwise removal of the light-emitting layer and the p-type semiconductor layer altogether through reactive ion etching; and a positive electrode provided on the remaining p-type semiconductor layer, wherein the gallium nitride compound semiconductor light-emitting device is produced through reactive ion etching by use of silicon tetrachloride as the sole etching gas.
    • 本发明的目的是提供一种耐热性优异的氮化镓系化合物半导体发光元件,其特征在于,能够抑制由形成发光后的温和加热引起的正向工作电压(VF)的上升 装置(例如,在安装发光装置期间加热到约300℃)。 本发明的氮化镓化合物半导体发光器件包括衬底; n型半导体层,发光层,p型半导体层,这些层被连续地设置在衬底上并由氮化镓化合物半导体形成; 设置在n型半导体层的某一部分的负极,该部分通过反应离子蚀刻部分地深度地去除发光层和p型半导体层而被曝光; 以及设置在剩余p型半导体层上的正极,其中通过使用四氯化硅作为唯一蚀刻气体通过反应离子蚀刻制造氮化镓系化合物半导体发光器件。
    • 4. 发明申请
    • GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE
    • 基于氮化镓的化合物半导体发光器件
    • WO2005074046A1
    • 2005-08-11
    • PCT/JP2005/001645
    • 2005-01-28
    • SHOWA DENKO K.KMURAKI, NoritakaWATANABE, MunetakaMIKI, HisayukiOHNO, Yasushi
    • MURAKI, NoritakaWATANABE, MunetakaMIKI, HisayukiOHNO, Yasushi
    • H01L33/00
    • H01L33/38H01L33/32H01L33/42
    • A gallium nitride compound semiconductor light-emitting device includes a crystalline substrate (10), a light-emitting layer (15) of a quantum well structure which is formed of a gallium nitride compound semiconductor barrier layer and a gallium nitride compound semiconductor well layer, which light-emitting layer is provided on a second side of the crystalline substrate, a contact layer (17) formed of a Group III-V compound semiconductor for providing an Ohmic electrode for supplying device operation current to the light-emitting layer, and an Ohmic electrode (18) which is provided on the contact layer and has an aperture through which a portion of the contact layer is exposed. The Ohmic electrode exhibits light permeability with respect to light emitted from the light-emitting layer. The well layer contains a thick portion having a large thickness and a thin portion having a small thickness.
    • 氮化镓系化合物半导体发光元件包括晶体基板(10),由氮化镓系化合物半导体势垒层和氮化镓系化合物半导体阱层形成的量子阱结构的发光层(15) 所述发光层设置在所述结晶基板的第二面上,由用于提供用于向所述发光层提供器件工作电流的欧姆电极的III-V族化合物半导体形成的接触层(17) 欧姆电极(18),其设置在接触层上并且具有孔,接触层的一部分穿过该孔露出。 欧姆电极相对于从发光层发射的光呈现透光性。 阱层包含厚度较大的厚壁部分和厚度较小的薄壁部分。
    • 9. 发明申请
    • GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DEVICE, POSITIVE ELECTRODE FOR THE DEVICE, LIGHT-EMITTING DIODE AND LAMP USING THE DEVICE
    • 基于氮化镓的化合物半导体发光器件,用于器件的正极,使用器件的发光二极管和灯
    • WO2005036657A1
    • 2005-04-21
    • PCT/JP2004/015449
    • 2004-10-13
    • SHOWA DENKO K.K.WATANABE, Munetaka
    • WATANABE, Munetaka
    • H01L33/00
    • H01L33/40H01L33/32H01L33/62H01L2924/0002H01L2924/00
    • An object of the present invention is to provide a flip-chip-type gallium nitride compound semiconductor light-emitting device exhibiting excellent ohmic characteristics, excellent bonding characteristics, and high emission output. The inventive flip-chip-type gallium nitride compound semiconductor light-emitting device comprises a substrate, an n-type semiconductor layer, a light-emitting layer, a p-type semiconductor layer, a negative electrode provided on the n-type semiconductor layer, and a positive electrode provided on the p-type semiconductor layer, the layers being successively provided atop the substrate in this order and being composed of a gallium nitride compound semiconductor, wherein the positive electrode has a three-layer structure comprising an ohmic electrode layer which is in contact with the p-type semiconductor layer, an adhesion layer which is provided on the ohmic electrode layer, and a bonding pad layer provided on the adhesion layer, each melting point of these layers being lowered in this order.
    • 本发明的目的是提供一种显示出优异的欧姆特性,优异的接合特性和高发射输出的倒装芯片型氮化镓化合物半导体发光器件。 本发明的倒装芯片型氮化镓系化合物半导体发光元件包括基板,n型半导体层,发光层,p型半导体层,设置在n型半导体层上的负极 以及设置在p型半导体层上的正极,这些层依次依次设置在衬底上并且由氮化镓化合物半导体构成,其中正极具有包括欧姆电极层的三层结构 其与p型半导体层接触,设置在欧姆电极层上的粘合层和设置在粘合层上的接合焊盘层,这些层的每个熔点依次降低。