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1. 发明授权

EP0787562B1 Double side polishing machine and method of polishing opposite sides of a workpiece using the same 失效
标题翻译：双面研磨机和通过相同的方法抛光工件的相对侧的方法
公开(公告)号：EP0787562B1
公开(公告)日：1999-12-08
申请号：EP97300659.6
申请日：1997-01-31
申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED
发明人： Kato, Tadahiro , Masumura, Hisashi, A-301 355-3 Ohaza , Kudo, Hideo
IPC分类号： B24B37/04
CPC分类号： B24B37/08 , B24B37/28

2. 发明公开

EP0791953A2 Method of manufacturing semiconductor wafers 失效
标题翻译：一种用于生产半导体片的过程
公开(公告)号：EP0791953A2
公开(公告)日：1997-08-27
申请号：EP97101468.3
申请日：1997-01-30
申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED
发明人： Kato, Tadahiro , Masumura, Hisashi , Kudo, Hideo
IPC分类号： H01L21/302
CPC分类号： H01L21/02008
摘要： A method of manufacturing semiconductor wafers includes double side primary polishing step, back side etching step and single side mirror polishing step. The method is capable of easy sensor detection of the front and back sides of the wafer and higher flatness level wafer processing by forming etched rough surface at the back side of the double side polished wafer and wafer manufacturing process including a double side polishing step.

3. 发明公开

EP0788146A1 Method of polishing semiconductor wafers 失效
标题翻译： Verfahren zum Polieren von Halbleiterscheiben
公开(公告)号：EP0788146A1
公开(公告)日：1997-08-06
申请号：EP97101488.1
申请日：1997-01-30
申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED
发明人： Kato, Tadahiro , Masumura, Hisashi , Nakano, Masami , Kudo, Hideo
IPC分类号： H01L21/304 , B24B37/04 , H01L21/306
CPC分类号： H01L21/02024 , B24B37/30
摘要： A method of polishing semiconductor wafers includes a double side primary polishing step and a single side secondary polishing step using a single side polishing machine with a wafer holder including a template so bonded on a carrier plate as having one or more wafer receiving holes in which backing pads are disposed respectively for holding the back sides of the respective wafers fittingly received therein.. This method makes it to possible to hold a plurality of wafers at one time due to batch processing to thereby improve the productivity, and decrease extremely the generation of the defective dimples in the front side of the wafer. Compared with conventional single side polishing, the flatness level of the wafer polished with the double side polishing machine in this method is improved.
摘要翻译：抛光半导体晶片的方法包括双面一次抛光步骤和单面二次抛光步骤，其使用单面抛光机，其具有包括模板的晶片保持器，所述模板粘合在载体板上，具有一个或多个晶片接收孔，其中背衬分别设置衬垫以保持各个晶片的背面合适地容纳在其中。该方法使得可以由于批量处理而一次保持多个晶片，从而提高生产率，并且极大地减少在晶片正面的缺陷凹坑。与常规单面抛光相比，该方法中用双面抛光机抛光的晶片的平整度得到改善。

4. 发明公开

EP0617457A3 Method for production of wafer 失效
标题翻译：一种用于半导体晶片的制造工艺。
公开(公告)号：EP0617457A3
公开(公告)日：1995-01-11
申请号：EP94302115.4
申请日：1994-03-24
申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED
发明人： Kato, Tadahiro , Shima, Sunao , Nakano, Masami , Masumura, Hisashi , Kudo, Hideo
IPC分类号： H01L21/302
CPC分类号： H01L21/02008 , Y10S148/138 , Y10S438/974
摘要： A wafer which allows manufacture of a device to proceed at an exalted yield by preventing the resolution of exposure at the step of photolithography during the manufacture of the device from being impaired is obtained by a method which comprises a slicing step for slicing a single crystal ingot thereby obtaining wafers of the shape of a thin disc, a chamfering step for chamfering the wafer obtained by the slicing step, a lapping step for imparting a flat surface to the chamfered wafer, an etching step for removing mechanical strain remaining in the lapped wafer, an obverse surface-polishing step for polishing one side of the etched wafer, and a cleaning step for cleaning the polished wafer, which method is characterized by interposing between the etching step and the obverse surface-polishing step a reverse surface-preparing step for preparing the shape of the reverse side of the wafer.

5. 发明公开

EP0617457A2 Method for production of wafer 失效
标题翻译： Verfahren zum Herstellen von Halbleiterscheiben。
公开(公告)号：EP0617457A2
公开(公告)日：1994-09-28
申请号：EP94302115.4
申请日：1994-03-24
申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED
发明人： Kato, Tadahiro , Shima, Sunao , Nakano, Masami , Masumura, Hisashi , Kudo, Hideo
IPC分类号： H01L21/302
CPC分类号： H01L21/02008 , Y10S148/138 , Y10S438/974
摘要： A wafer which allows manufacture of a device to proceed at an exalted yield by preventing the resolution of exposure at the step of photolithography during the manufacture of the device from being impaired is obtained by a method which comprises a slicing step for slicing a single crystal ingot thereby obtaining wafers of the shape of a thin disc, a chamfering step for chamfering the wafer obtained by the slicing step, a lapping step for imparting a flat surface to the chamfered wafer, an etching step for removing mechanical strain remaining in the lapped wafer, an obverse surface-polishing step for polishing one side of the etched wafer, and a cleaning step for cleaning the polished wafer, which method is characterized by interposing between the etching step and the obverse surface-polishing step a reverse surface-preparing step for preparing the shape of the reverse side of the wafer.
摘要翻译：通过包括用于将单晶锭切片的切片步骤的方法获得允许通过防止在制造器件受损时在光刻步骤中的曝光的分辨率而以高产量进行制造的晶片从而获得薄盘形状的晶片，用于对通过切片步骤获得的晶片进行倒角的倒角步骤，用于向倒角晶片赋予平坦表面的研磨步骤，用于去除在重叠晶片中残留的机械应变的蚀刻步骤，用于抛光蚀刻晶片的一侧的正面抛光步骤和用于清洁抛光晶片的清洁步骤，该方法的特征在于插入蚀刻步骤和正面抛光步骤之间的反面制备步骤晶片背面的形状。

6. 发明公开

EP0850724A1 Surface grinding device and method of surface-grinding a thin-plate workpiece 失效
标题翻译：的表面研磨装置和方法，用于表面研磨薄板工件
公开(公告)号：EP0850724A1
公开(公告)日：1998-07-01
申请号：EP97310438.3
申请日：1997-12-22
申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED
发明人： Kato, Tadahiro , Okuni, Sadayuki, C-305, Ryokufu-Dormitory , Kudo, Hideo , Tomioka, Hiroshi
IPC分类号： B24B7/22 , B24B37/04
CPC分类号： B24B37/30 , B24B7/228
摘要： There is provided a device and a method of surface grinding a thin-plate workpiece, which is capable of performing surface grinding to substantially remove, particularly, the waviness of 10 to 30 mm in period of a thin-plate workpiece having a sori(warp or bow) or waviness component without deterioration of the flatness and without entirely requiring an equipment investment, and which is also capable of manufacturing a semiconductor wafer with a high quality having no waviness and at low costs, which does not require the conventional lapping process and, as occasion demands, the etching process, in the case where the invention is applied to surface grinding of an as-cut wafer. The device for surface grinding a thin-plate workpiece includes a surface grinding element, and a holding element for holding the thin-plate workpiece to be surface ground, wherein a soft holding element is used as the holding element.
摘要翻译：本发明提供一种设备和表面的磨削薄板工件的方法，所有这些都能够执行表面研磨以基本上除去，特别是，10波纹度至30毫米（在薄板工件的周期具有孢子囊群经或弯曲）或波纹部件，而不平坦性的恶化和不完全无需对设备投资，并且所有其因此能够制造的半导体晶片具有高品质不具有波纹以低成本的和，其不需要常规的研磨过程和作为其中将本发明应用于表面的原切割晶片的磨削场合需要，在蚀刻工艺，在的情况下。磨削薄板工件表面的装置包括表面研磨元件，以及用于保持薄板工件表面待研磨，worin软保持元件用作保持元件的保持元件。

7. 发明授权

EP0617457B1 Method for production of wafer 失效
标题翻译：一种用于制造半导体晶片的方法
公开(公告)号：EP0617457B1
公开(公告)日：1998-05-27
申请号：EP94302115.4
申请日：1994-03-24
申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED
发明人： Kato, Tadahiro , Shima, Sunao , Nakano, Masami , Masumura, Hisashi , Kudo, Hideo
IPC分类号： H01L21/302
CPC分类号： H01L21/02008 , Y10S148/138 , Y10S438/974

8. 发明授权

EP0850724B1 Surface grinding device and method of surface-grinding a thin-plate workpiece 失效
标题翻译：的表面研磨装置和方法，用于表面研磨薄板工件
公开(公告)号：EP0850724B1
公开(公告)日：2002-09-25
申请号：EP97310438.3
申请日：1997-12-22
申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED
发明人： Kato, Tadahiro , Okuni, Sadayuki, C-305, Ryokufu-Dormitory , Kudo, Hideo , Tomioka, Hiroshi
IPC分类号： B24B7/22 , B24B37/04
CPC分类号： B24B37/30 , B24B7/228

9. 发明公开

EP0787562A1 Double side polishing machine and method of polishing opposite sides of a workpiece using the same 失效
标题翻译：双面研磨机和通过相同的方法抛光工件的相对侧的方法
公开(公告)号：EP0787562A1
公开(公告)日：1997-08-06
申请号：EP97300659.6
申请日：1997-01-31
申请人： SHIN-ETSU HANDOTAI COMPANY LIMITED
发明人： Kato, Tadahiro , Masumura, Hisashi, A-301 355-3 Ohaza , Kudo, Hido
IPC分类号： B24B37/04
CPC分类号： B24B37/08 , B24B37/28
摘要： A double side polishing machine includes a disk-shaped carrier for holding an article to be polished, and a sun gear and an internal gear which are meshed with external teeth of the carrier. The tooth portions of the sun gear and the internal gear are made of a hard resin material, such as polyimide sintered body or polyamide imide resin, which has excellent wear resistance, sufficient self-lubricating performance, and high shear resistance. Each tooth portion is formed as a single member, or is formed by a plurality of separable segments. Alternatively, the internal and sun gears are made of a metal such as steel and coated with a hard resin coating material. In another double side polishing machine, each of the tooth portions of the internal and sun gears is formed by a plurality of pins disposed at a predetermined pitches and sleeves fit onto the pins. The sleeves are made of a resin. Alternatively, resin-coated metallic sleeves may be used as the sleeves. The double side polishing machines can prevent generation of metal powder, thereby suppressing generation of scratches and metal contamination.
摘要翻译：双面抛光机包括啮合与载体的外齿，用于保持物品的被研磨盘形架和太阳齿轮和内齿轮的。所述太阳齿轮和所述内齿轮的齿部由硬质树脂材料，颜色：如聚酰亚胺烧结体或聚酰胺酰亚胺树脂，其具有优异的耐磨损性，自润滑足够的性能，和高的抗剪切性。每个齿部被形成为单个构件，或通过可分离的区段的多个形成。可选择地，内部和太阳齿轮由金属制成：诸如钢和涂层用硬树脂涂覆材料。在另一个双面抛光机，每一个内部和太阳齿轮的齿部通过以预定的节距和袖子配合到销处理完毕销多个形成。所述套筒由树脂形成。备选地，树脂包覆的金属套筒可以被用作套管。双面抛光机，能够防止产生金属粉末，从而抑制产生划痕和金属污染的。

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