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    • 1. 发明专利
    • DE3884712T2
    • 1994-05-05
    • DE3884712
    • 1988-07-27
    • SHARP KK
    • ASHIDA TSUTOMUOKADA MIKIRO
    • H01L21/8246H01L21/8247H01L27/112H01L29/78H01L27/10H01L21/82H01L29/62G11C17/00
    • A matrix type semiconductor memory device with higher complexity comprising: (a) a p-type (or n-type) semiconductor substrate, (b) a group of n-type (or p-type) semiconductor regions formed in the surface layer of the substrate in the from of strips arranged in parallel at a predetermined spacing, the semiconductor regions providing alternating source regions and drain regions and defining gate regions between the alternating regions, (c) a group of strips of first gate insulating film formed on the surface of the substrate at a predetermined spacing and intersecting the group of semiconductor regions, (d) a first gate electrode formed on each of the strips of first gate insulating film, (e) a group of portions of second gate insulating film formed on the exposed surface of the substrate between the strips of first gate insulating film, and (f) a second gate electrode formed on each of the portions of second gate insulating film and held out of contact with the first gate electrode, whereby a matrix of MIS semiconductor cells is formed, each of the cells being provided by the intersection of each gate region with one of the first and second electrodes, the gate regions of some of the cells being selectively doped with a p-type (or n-type) impurity substance at a higher concentration than the substrate.
    • 2. 发明专利
    • DE3884712D1
    • 1993-11-11
    • DE3884712
    • 1988-07-27
    • SHARP KK
    • ASHIDA TSUTOMUOKADA MIKIRO
    • H01L21/8246H01L21/8247H01L27/112H01L29/78H01L27/10H01L21/82H01L29/62G11C17/00
    • A matrix type semiconductor memory device with higher complexity comprising: (a) a p-type (or n-type) semiconductor substrate, (b) a group of n-type (or p-type) semiconductor regions formed in the surface layer of the substrate in the from of strips arranged in parallel at a predetermined spacing, the semiconductor regions providing alternating source regions and drain regions and defining gate regions between the alternating regions, (c) a group of strips of first gate insulating film formed on the surface of the substrate at a predetermined spacing and intersecting the group of semiconductor regions, (d) a first gate electrode formed on each of the strips of first gate insulating film, (e) a group of portions of second gate insulating film formed on the exposed surface of the substrate between the strips of first gate insulating film, and (f) a second gate electrode formed on each of the portions of second gate insulating film and held out of contact with the first gate electrode, whereby a matrix of MIS semiconductor cells is formed, each of the cells being provided by the intersection of each gate region with one of the first and second electrodes, the gate regions of some of the cells being selectively doped with a p-type (or n-type) impurity substance at a higher concentration than the substrate.
    • 3. 发明专利
    • DE69120020T2
    • 1996-11-28
    • DE69120020
    • 1991-10-22
    • SHARP KK
    • HOTTA YASUHIROOKADA MIKIRO
    • H01L27/112G11C17/12H01L21/8246G11C7/00
    • A read-only memory includes columns of memory cell arrays, a plurality of banks formed by dividing each column of the memory cell arrays along the columns, sub-bit lines disposed between adjacent banks situated along the rows and connected to a transistor of each memory cell, and main-bit lines disposed between every two other columns of the memory cell arrays and extending along the columns, wherein the sub-bit lines are divided into sets of three sub-bit lines connected to a pair of adjacent banks situated along the rows, and one end of each center sub-bit line being connected to a first main-bit line through a first selector transistor, the first main-bit line passing through one side of the set to which the center bit-line belongs, and the other end of the sub-bit line being connected to a second main-bit line through a second selector transistor, the second main-bit line passing through the other side of the set to which the center sub-bit line belongs, the two outer sub-bit lines being directly connected to the main-bit lines adjacent to the set of banks, respectively.
    • 4. 发明专利
    • DE69120020D1
    • 1996-07-11
    • DE69120020
    • 1991-10-22
    • SHARP KK
    • HOTTA YASUHIROOKADA MIKIRO
    • H01L27/112G11C17/12H01L21/8246G11C7/00
    • A read-only memory includes columns of memory cell arrays, a plurality of banks formed by dividing each column of the memory cell arrays along the columns, sub-bit lines disposed between adjacent banks situated along the rows and connected to a transistor of each memory cell, and main-bit lines disposed between every two other columns of the memory cell arrays and extending along the columns, wherein the sub-bit lines are divided into sets of three sub-bit lines connected to a pair of adjacent banks situated along the rows, and one end of each center sub-bit line being connected to a first main-bit line through a first selector transistor, the first main-bit line passing through one side of the set to which the center bit-line belongs, and the other end of the sub-bit line being connected to a second main-bit line through a second selector transistor, the second main-bit line passing through the other side of the set to which the center sub-bit line belongs, the two outer sub-bit lines being directly connected to the main-bit lines adjacent to the set of banks, respectively.
    • 5. 发明专利
    • SEMICONDUCTOR STORAGE
    • JPH0778466A
    • 1995-03-20
    • JP22473993
    • 1993-09-09
    • SHARP KK
    • IMURA KOJIOKADA MIKIROSHIMADA YUKIMINE
    • G06F12/06G11C8/00G11C11/401
    • PURPOSE:To facilitate the optimization and the expansion of storage capacity by suppressing the output of the data when a signal showing a free address is received though the data stored in a specific memory are outputted according to an enable signal by a control circuit. CONSTITUTION:One among 2 +m pieces of memory cells provided in a memory cell array 3 is specified according to an address signal of n+1 bits by an address decoder 2, and the storage data are outputted by an output buffer circuit 4. By a free address detection circuit 5, a detection signal showing whether or not two bits among the received address signal of n+1 bits show the free address is outputted. Further, by the control circuit 6, an internal control signal the inverse of E outputting the data stored in the specified memory cell is generated according to the enable signal the inverse of CE. However, by the circuit 6, when the detection signal from the circuit 5 shows the free address, the signal the inverse of E suppressing the output of the data in spite of the signal the inverse of CE is outputted. Thus, the optimization and the expansion of the storage capacity are facilitated.
    • 9. 发明专利
    • SEMICONDUCTOR READ-ONLY MEMORY
    • JPH04246855A
    • 1992-09-02
    • JP1201091
    • 1991-02-01
    • SHARP KK
    • HOTTA YASUHIROOKADA MIKIRO
    • G11C17/12H01L21/8246H01L27/10H01L27/112
    • PURPOSE:To obtain a bank system semiconductor read only memory which can be made to operate stably at a high speed independently of the position of a memory cell selected at readout by a method wherein the other ends of a first and a second selection transistor are connected to different primary bit lines. CONSTITUTION:Primary bit lines MB extending in a row direction, a first selection transistor QO whose one end is connected to the end of one of two auxiliary bit lines SB adjacent to each other in a column direction, and a second selection transistor QE whose one end is connected to the end of the other auxiliary bit line SB are provided. The other ends of the first and the second selection transistor, QO and QE, are connected to the primary bit lines MB different from each other respectively. Therefore, a semiconductor read only memory is equal to an auxiliary bit line in resistance independently of the position (column) of a memory cell. Therefore, a data readout operation can be executed at a high speed as a whole.