会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明专利
    • SEMICONDUCTOR STORAGE DEVICE
    • JPH11238813A
    • 1999-08-31
    • JP33479798
    • 1998-11-25
    • SHARP KK
    • KOMATSU KOJI
    • G11C7/18G11C8/12G11C11/401G11C11/41G11C17/12H01L21/8246H01L27/112
    • PROBLEM TO BE SOLVED: To improve the access speed of a mask ROM memory cell array that that of a conventional one after an increase in the area of a chip is inhibited by a method wherein main bit lines are travelled across a plurality of bank regions in the column direction and the main bit lines, which correspond to selected blocks in parallel to external bit lines, are connected with the external bit lines. SOLUTION: This mask ROM memory cell array is provided with a plurality of blocks BLK0 to BLKn arranged in the column direction and each block BLK is provided with a plurality of banks BNK0 to BNKm arranged in the column direction. In each bank BNK, memory cells are arranged into the form of matrix. A bank select line BS and a word line WL are selected, whereby one of the memory cells is made to have continuity with main bit lines and main ground lines. External bit lines GB are wired in almost parallel to the main bit lines MB and are connected with the main bit line MB of each block BLK via a block selection transistor TC between blocks.
    • 8. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPH10321793A
    • 1998-12-04
    • JP13223897
    • 1997-05-22
    • SHARP KK
    • IMURA KOJITACHIKAWA MASAAKIKOMATSU KOJI
    • H01L25/18H01L25/065H01L25/07
    • PROBLEM TO BE SOLVED: To enable constituting a double-sided board mounting type semiconductor integrated circuit device constituted of an integrated circuit chip, having a board bias generating circuit and an integrated circuit chip which does not have a board bias generating circuit, without incurring cost increase. SOLUTION: This device is a resin-molded type semiconductor integrated circuit device, wherein a DRAM chip 11 and a mask ROM chip 12 are mounted on the both surface of a chip-mounting part 15 of a conductive lead frame, and the parts between the respective electrodes of the respective ships and the respective lead terminals are connected by bonding wires. The device is so constituted that the DRAM chip 11 has a board bias generating circuit 13, and the other mask ROM chip 12 does not have a board bias generating circuit. The threshold voltage of a MOS transistor arranged in the mask ROM chip 12 which does not have the board bias generating circuit is set to be lower than that of the case that a semiconductor integrated circuit device is constituted by molding only the mask ROM chip 12 with resin.