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    • 1. 发明专利
    • MANUFACTURE OF THERMISTER
    • JPH11162709A
    • 1999-06-18
    • JP32558097
    • 1997-11-27
    • SATO SUSUMUTDK CORP
    • SATO SUSUMUSATO YUICHIOGASAWARA TADASHITAGUCHI HARUO
    • H01C17/00H01C7/04
    • PROBLEM TO BE SOLVED: To obtain a variety of different properties of very compact thermisters, by changing an irradiation scanning rate to control property of a metal oxide thin film, while forming at least two metal thin films on an insulating substrate and irradiating heat energy wave to the metal thin films. SOLUTION: Mn thin film 2 and Cu thin film 3 are deposited on a quartz insulating substrate 1 in ascending order using a mask formed with a pattern P for the thin film, and an Mn-Cu, thin film is formed which is connected to an electrode 5, 5 with a laminated metal thin film narrow-wide film portion 4. This insulating substrate 1 is attached to a X-Y stage, and YAG laser beam is irradiated to a processed region 6 from above this laminated metal thin film narrow-wide film portion 4. By moving the X-Y stage in x axis direction at various rate, the processed region 6 is oxidized by scanning YAG laser beam in one direction. A surface mount type thermister is obtained by fixing to connect a conductor wire 7, 7 to an element in which the processed region 6 is oxidized, and providing an end electrode 8, 8.
    • 2. 发明专利
    • THERMISTER AND MANUFACTURE THEREOF
    • JPH11162710A
    • 1999-06-18
    • JP32558197
    • 1997-11-27
    • SATO SUSUMUTDK CORP
    • SATO SUSUMUSATO YUICHIOGASAWARA TADASHITAGUCHI HARUO
    • H01C17/00H01C7/04
    • PROBLEM TO BE SOLVED: To obtain a very compact thermister with steady resistance value,, by forming at least two metal thin films on an insulating substrate, slowly moving irradiated positions to irradiate heat energy wave, and firming a metal oxide thin film with negative resistive temperature coefficient. SOLUTION: Mn thin film 2 and Cu thin film 3 are deposited on a quartz insulating substrate 1 in ascending order using a mask formed with a pattern P for the thin film, and a Mn-Cu thin film is formed which is connected to an electrode 5, 5 with a laminated metal thin film narrow film portion 4. This insulating substrate 1 is attached to an X-Y stage, and YAG laser beam is irradiated to a processed region 6 from above this laminated metal thin film narrow film portion 4. By moving the X-Y stage in x axis direction at various rate, the processing region 6 is oxidized with negative resistive temperature coefficient by scanning YAG laser beam in one direction. A conductor wire 7, 7 is connected to an element in which the processed region 6 is oxidized with negative resistive temperature coefficient by means of a conductive adhesive 5.
    • 10. 发明专利
    • FAR INFRARED RADIATION HEATER
    • JPH0410376A
    • 1992-01-14
    • JP11143290
    • 1990-04-26
    • TDK CORP
    • TAGUCHI HARUOMASUMURA HITOSHIIWATANI SHOICHI
    • H05B3/10H05B3/14H05B3/84
    • PURPOSE:To improve the thermal characteristics of a far infrared radiation heater, and raise the efficiency and mechanical strength thereof by providing a semiconductor ceramic layer formed on one side of an insulator ceramic substrate, and an electrode layer on the semiconductor ceramic layer for power supply. CONSTITUTION:A far infrared radiation heater 1 has an inorganic insulation ceramic substrate 2, a semiconductor ceramic layer 3 laid on the entire surface of one side of the substrate 2 via a printing method, electrodes 4a and 4b formed on the upper surface of the semiconductor ceramic layer 3 via a printing method, and an insulation layer 5 of borosilicate glass paste covering the semiconductor layer 3 and the exposed portions of both electrodes 4a and 4b. A far infrared radiation is efficiently emitted outside from the semiconductor ceramic layer 9, due to the use of the aforesaid insulation ceramic substrate 2 and the supply of electric power to the electrode layers 4a and 4b. According to the aforesaid construction, it is possible to obtain a far infrared radiation heater having high mechanical strength and excellent thermal characteristics such as heat and shock resistance, heat conductivity and heat radiation characteristics, while ensuring high efficiency and easy manufacture at low cost.