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    • 2. 发明公开
    • ELECTRONIC DEVICE AND METHOD OF PRODUCING THE SAME
    • ELEKTRONISCHE EINRICHTUNG UND VERFAHREN ZUR HERSTELLUNG DERSELBEN
    • EP0964415A4
    • 2005-12-28
    • EP98945643
    • 1998-10-06
    • TDK CORP
    • IGARASHI KATSUHIKOMASUDA SUNAOUCHIDA TOMOKOTOKUOKA YASUMICHISATO SHIGEKI
    • H01C1/142H01C7/18H01C17/00H01G4/232H01G4/12H01C13/00
    • H01G4/2325H01C1/142H01C7/18H01C17/006
    • The invention provides an electronic device comprising a first metal layer containing a first metal converted into an oxide upon firing in an oxidizing atmosphere and a second metal layer formed by firing of a second metal particle containing a metal that is not oxidized upon firing in an oxidizing atmosphere, with an intermediate oxide layer interleaved between these two metal layers. The intermediate oxide layer contains an oxide of the first metal contained in the first metal layer. Preferably, the second metal particle contained in the second metal layer is dispersed in the intermediate oxide layer. A uniform oxide layer is obtained at a simple step, and the resistance value provided by the oxide layer is easily controllable with high precision. It is thus possible to achieve an electronic device in which the bonding strength of the oxide layer with respect to the other metal-containing layer is improved with an improvement in the bonding strength with respect to lead wires.
    • 本发明提供一种电子器件,其包含第一金属层,该第一金属层含有在氧化气氛中烧制时转化为氧化物的第一金属,以及第二金属层,该第二金属层通过在氧化性气体中烧成含有不被氧化的金属的第二金属颗粒 在这两个金属层之间交错的中间氧化物层。 中间氧化物层包含第一金属层中包含的第一金属的氧化物。 优选地,包含在第二金属层中的第二金属颗粒分散在中间氧化物层中。 以简单的步骤获得均匀的氧化物层,并且由氧化物层提供的电阻值可以高精度地容易地控制。 因此,可以实现相对于其他含金属层的氧化物层的接合强度随着与引线的接合强度的提高而提高的电子器件。