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    • 3. 发明专利
    • Method for manufacturing split gate type flash memory device
    • 用于制造分离栅型闪存存储器件的方法
    • JP2005159361A
    • 2005-06-16
    • JP2004339296
    • 2004-11-24
    • Samsung Electronics Co Ltd三星電子株式会社
    • KIM YONG-HEEKEN TETSUJUNKIN CHINUKIM JOO-CHANKIM DAI-GEUNRYU EUI YOUL
    • H01L21/28H01L21/336H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L27/11526H01L21/28273H01L27/11521H01L27/11536H01L29/66553H01L29/66825
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a split gate type flash memory device.
      SOLUTION: The method comprises a step for forming a floating gate structure in a cell region of a semiconductor substrate having a peripheral circuit region divided into a high-voltage region and a low-voltage region and the cell region, a step for forming a first insulating film on the entire surface of a resulting specimen, a step for removing the first insulating film formed in the cell region, a step for forming a second insulating film in the cell region by forming an oxide film on the entire surface of the resulting specimen and forming a third insulating film in the peripheral circuit region, a step for removing the third insulating film formed in the low-voltage region, and a step for forming a control gate insulating film and a tunneling insulating film in the cell region by forming an oxide film on the entire surface of the resulting specimen, forming a high-voltage gate insulating film in the high-voltage region, and forming a low-voltage gate insulating film in the low-voltage region.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种用于制造分离式闸型闪存装置的方法。 解决方案:该方法包括在具有被划分成高压区域和低电压区域的外围电路区域和单元区域的半导体衬底的单元区域中形成浮置栅极结构的步骤,用于 在所得样品的整个表面上形成第一绝缘膜,除去形成在单元区域中的第一绝缘膜的步骤,通过在单元区域的整个表面上形成氧化物膜,在单元区域中形成第二绝缘膜的步骤 在外围电路区域中形成第三绝缘膜,除去形成在低电压区域中的第三绝缘膜的步骤,以及在电池区域中形成控制栅极绝缘膜和隧道绝缘膜的步骤 通过在所得样品的整个表面上形成氧化膜,在高电压区域形成高电压栅极绝缘膜,并在低v电压下形成低压栅极绝缘膜 电压区。 版权所有(C)2005,JPO&NCIPI