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1. 发明授权

US07508352B2 Embedded assembly including moveable element and antenna element 失效
标题翻译：嵌入式组件，包括可移动元件和天线元件
公开(公告)号：US07508352B2
公开(公告)日：2009-03-24
申请号：US11275589
申请日：2006-01-18
申请人： Robert Lempkowski , Manes Eliacin , Keryn Lian
发明人： Robert Lempkowski , Manes Eliacin , Keryn Lian
IPC分类号： H01Q1/38 , H01P11/00
CPC分类号： H01Q23/00 , H01Q1/40 , H05K1/16 , H05K2201/10053 , Y10T29/49016
摘要： An embedded assembly (200) and method for fabricating the same is provided. The embedded assembly includes an organic substrate (102) and at least one movable element (104). The embedded assembly also includes at least one antenna element (106). The method includes providing (502) the organic substrate, and embedding (504) the at least one moveable element on the organic substrate. The method also includes embedding (506) the at least one antenna element on the organic substrate.
摘要翻译：提供一种嵌入式组件（200）及其制造方法。嵌入式组件包括有机衬底（102）和至少一个可移动元件（104）。嵌入式组件还包括至少一个天线元件（106）。该方法包括提供（502）有机衬底，并将至少一个可移动元件嵌入（504）到有机衬底上。该方法还包括将至少一个天线元件嵌入（506）到有机衬底上。

2. 发明申请

US20070164905A1 EMBEDDED ASSEMBLY INCLUDING MOVEABLE ELEMENT AND ANTENNA ELEMENT 失效
标题翻译：嵌入式组件，包括移动元件和天线元件
公开(公告)号：US20070164905A1
公开(公告)日：2007-07-19
申请号：US11275589
申请日：2006-01-18
申请人： Robert Lempkowski , Manes Eliacin , Keryn Lian
发明人： Robert Lempkowski , Manes Eliacin , Keryn Lian
IPC分类号： H01Q1/38
CPC分类号： H01Q23/00 , H01Q1/40 , H05K1/16 , H05K2201/10053 , Y10T29/49016
摘要： An embedded assembly (200) and method for fabricating the same is provided. The embedded assembly includes an organic substrate (102) and at least one movable element (104). The embedded assembly also includes at least one antenna element (106). The method includes providing (502) the organic substrate, and embedding (504) the at least one moveable element on the organic substrate. The method also includes embedding (506) the at least one antenna element on the organic substrate.
摘要翻译：提供一种嵌入式组件（200）及其制造方法。嵌入式组件包括有机衬底（102）和至少一个可移动元件（104）。嵌入式组件还包括至少一个天线元件（106）。该方法包括提供（502）有机衬底，并将至少一个可移动元件嵌入（504）到有机衬底上。该方法还包括将至少一个天线元件嵌入（506）到有机衬底上。

3. 发明授权

US06891190B2 Organic semiconductor device and method 失效
标题翻译：有机半导体器件及方法
公开(公告)号：US06891190B2
公开(公告)日：2005-05-10
申请号：US10154013
申请日：2002-05-23
申请人： Ke Keryn Lian , Robert T. Croswell , Aroon Tungare , Manes Eliacin
发明人： Ke Keryn Lian , Robert T. Croswell , Aroon Tungare , Manes Eliacin
IPC分类号： H01L21/316 , H01L25/04 , H01L27/28 , H01L51/05 , H05K1/18 , H01L29/76
CPC分类号： H01L51/0537 , H01L21/31691 , H01L25/046 , H01L27/28 , H01L51/0512 , H01L2924/0002 , H01L2924/09701 , H05K1/185 , H01L2924/00
摘要： An organic semiconductor device (11) can be embedded within a printed wiring board (10). In various embodiments, the embedded device (11) can be accompanied by other organic semiconductor devices (31) and/or passive electrical components (26). When so embedded, conductive vias (41, 42, 43) can be used to facilitate electrical connection to the embedded device. In various embodiments, specific categories of materials and/or processing steps are used to facilitate the making of organic semiconductors and/or passive electrical components, embedded or otherwise.
摘要翻译：有机半导体器件（11）可以嵌入印刷线路板（10）内。在各种实施例中，嵌入式设备（11）可以伴随有其他有机半导体器件（31）和/或无源电子部件（26）。当嵌入时，可以使用导电通孔（41,42,43）来促进与嵌入式装置的电连接。在各种实施例中，使用特定类别的材料和/或处理步骤来促进有机半导体和/或嵌入式或其它方式的无源电组件的制造。

4. 发明授权

US06714105B2 Micro electro-mechanical system method 失效
标题翻译：微机电系统方法
公开(公告)号：US06714105B2
公开(公告)日：2004-03-30
申请号：US10133913
申请日：2002-04-26
申请人： Manes Eliacin , Keryn Lian , Junhua Liu , Robert B. Lempkowski
发明人： Manes Eliacin , Keryn Lian , Junhua Liu , Robert B. Lempkowski
IPC分类号： H01P110
CPC分类号： H01H59/0009 , H01G5/16 , H01H2001/0073 , H01H2059/0054
摘要： A meso-scale MEMS device having a cantilevered beam is formed using standard printed wiring board and high density interconnect technologies and practices. The beam includes at least some polymer material to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying embodiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.
摘要翻译：使用标准印刷线路板和高密度互连技术和实践形成具有悬臂梁的中尺度MEMS器件。梁包括构成其长度的至少一些聚合物材料，并且在一些实施例中还包括作为其承载部件的导电材料。在不同的实施例中，梁被附接在靠近其端部的位置处，或者远离其端部。

5. 发明授权

US07463113B2 Apparatus and methods relating to electrically conductive path interfaces disposed within capacitor plate openings 有权
标题翻译：与设置在电容器板开口内的导电路径接口相关的装置和方法
公开(公告)号：US07463113B2
公开(公告)日：2008-12-09
申请号：US11276429
申请日：2006-02-28
申请人： Aroon Tungare , Manes Eliacin , Lih-Tyng Hwang , Robert Lempkowski , Junhua Liu , Jovica Savic
发明人： Aroon Tungare , Manes Eliacin , Lih-Tyng Hwang , Robert Lempkowski , Junhua Liu , Jovica Savic
IPC分类号： H01P1/10
CPC分类号： H01G5/16 , H01G5/011 , H01H59/0009
摘要： A first and second capacitor plate are provided (101 and 102). Each capacitor plate has an opening disposed therethrough with the second capacitor plate being disposed substantially opposite the first capacitor plate. A first electrically conductive path interface is then disposed (103) in one of these openings as is at least a second electrically conductive path interface (104).
摘要翻译：提供第一和第二电容器板（101和102）。每个电容器板具有穿过其中的开口，其中第二电容器板与第一电容器板大致相对设置。然后，至少第二导电路径接口（104）将第一导电路径界面（103）设置在这些开口之一中。

6. 发明授权

US06859119B2 Meso-microelectromechanical system package 有权
标题翻译：中微机电系统封装
公开(公告)号：US06859119B2
公开(公告)日：2005-02-22
申请号：US10329907
申请日：2002-12-26
申请人： Manes Eliacin , Tomasz Klosowiak , Robert Lempkowski , Ke Lian
发明人： Manes Eliacin , Tomasz Klosowiak , Robert Lempkowski , Ke Lian
IPC分类号： B81B7/00 , H01P1/10
CPC分类号： B81C1/00333 , H01H2001/0073
摘要： A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board (10) at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (12, 16), an insulating member (22, 26) formed on the first metal layer, and a second metal layer (32, 36) situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (40). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover (46) on the package to provide an environmental seal.
摘要翻译：用于微机的中尺度微机电系统（MEMS）封装。中等尺寸的微型机器同时形成在印刷电路板（10）上并且与中等尺寸的微型机器包装材料相同。微机和封装均具有第一金属层（12,16），形成在第一金属层上的绝缘构件（22,26）和位于绝缘层上的第二金属层（32,36）。包装由围绕微机器的周边壁和低流量封盖粘合剂层（40）组成。微机和封装的第一金属层以相同的工艺顺序形成，微机和封装的绝缘层以相同的工艺顺序形成，并且两者的第二金属层微机和封装以相同的工艺顺序形成。低流量封盖粘合剂将可选的盖（46）固定在包装上以提供环境密封。

7. 发明申请

US20080013251A1 APPARATUS AND METHODS RELATING TO ELECTRICALLY CONDUCTIVE PATH INTERFACES DISPOSED WITHIN CAPACITOR PLATE OPENINGS 有权
标题翻译：与电容板开口处理电导线路接口相关的装置和方法
公开(公告)号：US20080013251A1
公开(公告)日：2008-01-17
申请号：US11276429
申请日：2006-02-28
申请人： Aroon Tungare , Manes Eliacin , Lih-Tyng Hwang , Robert Lempkowski , Junhua Liu , Jovica Savic
发明人： Aroon Tungare , Manes Eliacin , Lih-Tyng Hwang , Robert Lempkowski , Junhua Liu , Jovica Savic
IPC分类号： H01G4/06
CPC分类号： H01G5/16 , H01G5/011 , H01H59/0009
摘要： A first and second capacitor plate are provided (101 and 102). Each capacitor plate has an opening disposed therethrough with the second capacitor plate being disposed substantially opposite the first capacitor plate. A first electrically conductive path interface is then disposed (103) in one of these openings as is at least a second electrically conductive path interface (104).
摘要翻译：提供第一和第二电容器板（101和102）。每个电容器板具有穿过其中的开口，其中第二电容器板与第一电容器板大致相对设置。然后，至少第二导电路径接口（104）将第一导电路径界面（103）设置在这些开口之一中。

8. 发明授权

US07217369B2 Meso-microelectromechanical system having a glass beam and method for its fabrication 有权
标题翻译：具有玻璃束的中微机电系统及其制造方法
公开(公告)号：US07217369B2
公开(公告)日：2007-05-15
申请号：US11380983
申请日：2006-05-01
申请人： Jovica Savic , Manes Eliacin , Junhua Liu , Aroon V. Tungare
发明人： Jovica Savic , Manes Eliacin , Junhua Liu , Aroon V. Tungare
IPC分类号： C23F1/00 , H01L21/00
CPC分类号： H02N1/006 , G02B26/0841
摘要： A meso-electromechanical system (900, 1100) includes a substrate (215), a standoff (405, 1160) disposed on a surface of the substrate, a first electrostatic pattern (205, 1105, 1110, 1115, 1120) disposed on the surface of the substrate, and a glass beam (810). The glass beam (810) has a fixed region (820) attached to the standoff and has a second electrostatic pattern (815, 1205, 1210, 1215, 1220) on a cantilevered location of the glass beam. The second electrostatic pattern is substantially co-extensive with and parallel to the first electrostatic pattern. The second electrostatic pattern has a relaxed separation (925) from the first electrostatic pattern when the first and second electrostatic patterns are in a non-energized state. In some embodiments, a mirror is formed by the electrostatic materials that form the second electrostatic pattern. The glass beam may be patterned using sandblasting (140).
摘要翻译：中间机电系统（900,1100）包括衬底（215），设置在衬底的表面上的支座（405,1160），设置在衬底上的第一静电图案（205,1105,1110,1115,1120）基板的表面和玻璃光束（810）。玻璃束（810）具有附接到支座的固定区域（820），并且在玻璃束的悬臂位置上具有第二静电图案（815,1205,1212,1215,1220）。第二静电图案与第一静电图案基本上共同并且平行。当第一静电图案和第二静电图案处于非通电状态时，第二静电图案具有与第一静电图案的松弛分离（925）。在一些实施例中，由形成第二静电图案的静电材料形成反射镜。可以使用喷砂将玻璃束图案化（140）。

9. 发明申请

US20060226732A1 MESO-MICROELECTROMECHANICAL SYSTEM HAVING A GLASS BEAM AND METHOD FOR ITS FABRICATION 有权
标题翻译：具有玻璃光束的MESO-微电子机电系统及其制造方法
公开(公告)号：US20060226732A1
公开(公告)日：2006-10-12
申请号：US11380983
申请日：2006-05-01
申请人： Jovica Savic , Manes Eliacin , Junhua Liu , Aroon Tungare
发明人： Jovica Savic , Manes Eliacin , Junhua Liu , Aroon Tungare
IPC分类号： H02N1/00
CPC分类号： H02N1/006 , G02B26/0841
摘要： A meso-electromechanical system (900, 1100) includes a substrate (215), a standoff (405, 1160) disposed on a surface of the substrate, a first electrostatic pattern (205, 1105, 1110, 1115, 1120) disposed on the surface of the substrate, and a glass beam (810). The glass beam (810) has a fixed region (820) attached to the standoff and has a second electrostatic pattern (815, 1205, 1210, 1215, 1220) on a cantilevered location of the glass beam. The second electrostatic pattern is substantially co-extensive with and parallel to the first electrostatic pattern. The second electrostatic pattern has a relaxed separation (925) from the first electrostatic pattern when the first and second electrostatic patterns are in a non-energized state. In some embodiments, a mirror is formed by the electrostatic materials that form the second electrostatic pattern. The glass beam may be patterned using sandblasting (140).
摘要翻译：中间机电系统（900,1100）包括衬底（215），设置在衬底的表面上的支座（405,1160），设置在衬底上的第一静电图案（205,1105,1110,1115,1120）基板的表面和玻璃光束（810）。玻璃束（810）具有附接到支座的固定区域（820），并且在玻璃束的悬臂位置上具有第二静电图案（815,1205,1212,1215,1220）。第二静电图案与第一静电图案基本上共同并且平行。当第一静电图案和第二静电图案处于非通电状态时，第二静电图案具有与第一静电图案的松弛分离（925）。在一些实施例中，由形成第二静电图案的静电材料形成反射镜。可以使用喷砂将玻璃束图案化（140）。

10. 发明授权

US06777629B2 Micro electro-mechanical system with one or more moving parts method and apparatus 失效
标题翻译：具有一个或多个移动部件的微机电系统方法和装置
公开(公告)号：US06777629B2
公开(公告)日：2004-08-17
申请号：US10156780
申请日：2002-05-08
申请人： Spencer A. Lane , Krishna Jonnalagadda , Manes Eliacin
发明人： Spencer A. Lane , Krishna Jonnalagadda , Manes Eliacin
IPC分类号： B81B702
CPC分类号： B81C1/00182 , B81B2201/045 , B81B2203/0315 , B81C2201/0108 , B81C2203/0136 , H01H59/0009 , H01H2001/0073
摘要： A meso-scale MEMS device having a movable member (51) is formed using standard printed wiring board and high density interconnect technologies and practices. In one embodiment, sacrificial material disposed about the movable member (51) is removed through openings (101, 102) as formed through a cover (91) to form a cavity (121) that retains and limits the freedom of movement of the movable member (51). The movable member can support a reflective surface (224) to thereby provide a mechanism that will support a projection display and/or image scanner (such as a bar code scanner).
摘要翻译：使用标准印刷线路板和高密度互连技术和实践形成具有可移动部件（51）的中尺度MEMS器件。在一个实施例中，围绕可移动构件（51）设置的牺牲材料通过通过盖（91）形成的开口（101,102）去除以形成空腔（121），其保持并限制可移动构件（51）。可移动构件可以支撑反射表面（224），从而提供将支撑投影显示和/或图像扫描器（例如条形码扫描器）的机构。

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